744050 Search Results

stabilizer

Contextual Info: MATERIAL DECLARATION SHEET Model # 70AD 2 pin Product Line Male Modular Contact Date March 24, 2009 RoHS Compliant YES No. 1 Construction element Material group Copper alloy 0.008 plating 0.0002 Stabilizer Copper alloy 2 Contacts 3 Lid 4 Material weight [g]

Contextual Info: MATERIAL DECLARATION SHEET Material # 4609M-LF Series Product Line Networks Date 05/17/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.1663 0.0019 0.0414 0.0138 0.0221

To39 transistor header

Abstract: 731 triac 715 triac
Contextual Info: Package Details - TO-39 Mechanical Drawing DIMENSIONS INCHES MILLIMETERS SYMBOL MIN MAX MIN MAX A DIA 0.335 0.370 8.51 9.40 B (DIA) 0.315 0.335 8.00 8.51 C 0.040 1.02 D 0.240 0.260 6.10 6.60 E 0.500 12.70 F (DIA) 0.016 0.021 0.41 0.53 G (DIA) 0.200 5.08

pwr4525

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR4525 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY ENCAPSULANT

Contextual Info: MATERIAL DECLARATION SHEET Material Number PWR2615 SURFACE MOUNT WIREWOUND RESISTOR Product Line Compliance Date 1/1/2000 RoHS Compliant YES No. Construction Element subpart 1 LEAD WIRE 2 LEAD WIRE PLATING 3 END CAPS 4 RESISTANCE WIRE 5 EPOXY Headquarters Riverside CA

MATERIAL DECLARATION inductor

Contextual Info: MATERIAL DECLARATION SHEET Material SRP8040 Series Product Line SHIELDED SMD POWER INDUCTOR Date 11-October-2005 No. Construction element 1 Core 2 Wire Material group Ferrite Mn-Zn Series Copper Wire Total weight Headquarters Riverside CA Material Weight [g]

Contextual Info: MATERIAL DATA SHEET Material PMH1206 Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO

3050b

Abstract: TISP7350H3SL-S Bourns Sip IT 8572
Contextual Info: MATERIAL DECLARATION SHEET 3-SIP Package Type Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the component part number e.g. TISP7350H3SL-S

06852

Contextual Info: MATERIAL DECLARATION SHEET Material # 4609H-LF Series Product Line Networks Date 05/18/2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.2328 0.0027 0.0580 0.0193 0.0310

SRR3011

Abstract: enamelled copper wire
Contextual Info: MATERIAL DATA SHEET Material SRR3011 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Terminal Material group Ferrite Ni-Zn Series Bar Solder Sn100% Silver Paste Material Weight g 0.058 Average mass (%) Sum (%)

4780

Abstract: CDSC706-T05C silver ag wire Bond
Contextual Info: MATERIAL DECLARATION SHEET Material # CDSC706 Series Product Line ESD Protection Date 1/1/2007 RoHS Compliant Yes COMPONENT DETAILS No. Construction element Material group Material weight [g] 1 Lead Frame Lead Frame 0.002570 2 Wafer Silicon 0.001434 3 Gold Bond wire

acrylic resin

Abstract: SDR1006 MATERIAL DECLARATION inductor C21H26O3 UV-C110
Contextual Info: MATERIAL DECLARATION SHEET Material Number Model SDR1006 Product Line Power Inductor Compliance Date 01-October-2004 RoHS Compliant No. 1 Construction Element subpart CORE Yes MSL Homogeneous Material F4D 1 Material weight [g] 0.833 2 WIRE 2-SFBW 0.289 3

Contextual Info: MATERIAL DECLARATION SHEET Material # Model 4416T-L Product Line Networks Date 02-January-2005 RoHS Compliant Yes No. 1 2 3 4 Construction Element Element Material Group Material Weight [g] Materials Ceramic Conductor Ink Glaze 0.14324 0.000026 0.000013 0.000037

Contextual Info: Model: FVXO-PC53 SERIES LVPECL 5 x 3.2mm 3.3V VCXO Freq: 0.75 MHz to 1.35GHz Rev. 12/12/2007 Features XTREMELY Low Jitter Low Cost XPRESS Delivery Frequency Resolution to six decimal places Absolute Pull Range APR of ±50ppm -20 to +70°C or -40 to +85°C operating temperatures

DAD 5

Abstract: TO 92 leadframe 3050b TISP4240M3LMFR-S TISP4350H3LM-S
Contextual Info: MATERIAL DECLARATION SHEET Package Type DO-92 Product Line TSP Transistors & Thyristors Compliance Date November 30, 2004 RoHS Compliant Yes (-S suffix) MSL N/A Bourns TISP products complying with RoHS legislation are identified with a “-S ” suffix in the part number e.g. TISP4350H3LM-S or TISP4240M3LMFR-S.

Contextual Info: MATERIAL DECLARATION SHEET Material Number 85L CP Dual Cup Product Line Panel Control Compliance Date September 30, 2005 RoHS Compliant Yes MSL N/A Subpart mass of total wt. (%) 72 Material Mass % of total unit wt. 3.920 25 1.361 5.455 7440-50-08 3 0.163

enamelled copper wire

Contextual Info: MATERIAL DATA SHEET Material SDR2207 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base 4 Wire 5 Adhesive Headquarters Riverside CA Material group Ferrite Ni-Zn Series Material Weight g 2.5 if applicable

SN1004

Abstract: SDR0906 polyester resin enamelled copper wire SN100
Contextual Info: MATERIAL DATA SHEET Material SDR0906 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Base Material group Ferrite Ni-Zn Series Material Weight g 0.726 Average mass (%) Sum (%) Iron & Compounds N/A Remainder

MATERIAL DECLARATION inductor

Abstract: PM1008 material declaration MATERIAL DECLARATION SHEET inductor
Contextual Info: MATERIAL DECLARATION SHEET Material Number PM1008 Series Product Line Chip Inductor Compliance Date 01-January-2006 RoHS Compliant Yes MSL 2a No. Construction Element subpart Homogeneous Material Material Weight [g] Homogeneous Material Substance 1 Core

Contextual Info: MATERIAL DECLARATION SHEET Material # 70AA 2 PIN Product Line Male Modular Contact Date March 27, 2009 RoHS Compliant YES No. 1 2 Construction element Body Pins Material group CAS if applicable Average mass [%] Tribromopolystyrene 74.00 7.00 19.00 0.053 0.022

Contextual Info: MATERIAL DATA SHEET Material PMA1206L Product Line Chip Beads Date 2-Oct-2006 No. 1 Construction element Ceramic Body Material group Ferrite Powder Series Material Weight [g] 0.028261 if applicable Average mass [%] Fe2O3 1309-37-1 45~55 NiO 1313-99-1 5~7 ZnO

SRR0805

Contextual Info: MATERIAL DATA SHEET Material SRR0805 Product Line SMD POWER INDUCTOR Date 04-October-2004 No. Construction element 1 Core 2 Solder 3 Gap 4 Solder 5 6 7 Base Wire Adhesive Headquarters Riverside CA Material group Ferrite Ni-Zn Series Material Weight g 0.48

Contextual Info: MATERIAL DECLARATION SHEET Material Number SRU3014 Series Product Line Shielded Power Inductor Compliance Date 01-November-2006 RoHS Compliant No. 1 2 3 Construction Element subpart Core Yes MSL Homogeneous Material Ferrite Ni-Zn Series Solder Bar Solder

diode marking 226

Abstract: marking 7c fiber glass
Contextual Info: MATERIAL DECLARATION SHEET Material # CMF-RD Product Line PTC resistors Date 01/13/2009 Version A/0 RoHS Compliant Yes No. 1 Construction element Substrate Material group Ceramic Material weight [g] 0.674 Materials CAS if applicable Average mass [%] Barium