742C083102JP Search Results

pj 69 SMD diode

Abstract: RX-2B RX2C RX2b bs3-1000 Monitor VD58 smd diode pj 72 c8051f320-gq VD58 ISL54100
Contextual Info: ISL54100AHDMI-EVALZ, ISL54105ACRZ-EVALZ Operation Manual for Intersil’s 4:1 and 1:1 TMDS HDMI Regenerator Evaluation Kits Application Note April 1, 2009 AN1453.2 Thank you for requesting Intersil’s high-performance TMDS signal multiplexor/regenerator/retimer evaluation kit. This

Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors

742C083100JP

Abstract: 742C083102J 100W high power resistor 8.2K Resistor Power Resistor 100w resistor 220 ohm Resistors 3.0k ohm 0805 150k 1K 220 Ohm resistor res 0603
Contextual Info: Chip Resistor Arrays Technical Data Features • • • • • • • • • Low Cost Thick Film Technology High Density Packaging Leadless Surface Mount Construction Tape and Reel Packaging Solder Coated Nickel Barrier Pads Isolated and Bussed Circuits

75K ohm 1 resistor

Abstract: EX1001 RES 0402 620K 1
Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors

Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors

.024 ohm resistors

Abstract: 222 thick film chip resistor 49R9 740X043 741X163 742C083 742C083100JP chip resistor 683
Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations

EX 470

Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors

ADS7924

Contextual Info: User's Guide SBAU173 – June 2010 ADS7924EVM and ADS7924EVM-PDK User's Guide ADS7924EVM Left and ADS7924EVM-PDK (Right) This user's guide describes the characteristics, operation, and use of the ADS7924EVM, both by itself and as part of the ADS7924EVM-PDK. This evaluation model (EVM) is an evaluation board for the ADS7924,

Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors

49R9

Abstract: 740X043 741X163 742C083 742C083100JP 745x102
Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • • • • • • • • - Up to 30% less space per resistor than 0603 chip resistors - Up to 75% less space per resistor than 0805 chip resistors

Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations

tmc 4.7k ohm

Abstract: 0603x8 49R9 740X043 741X163 742C083 742C083100JP 742C083102JP 742C083102J
Contextual Info: Chip Resistor Arrays Series 74x FEATURES • Low Cost • Thick Film Technology • High Density Packaging • Leadless Surface Mount Construction • Tape and Reel Packaging • Solder Coated Nickel Barrier Pads • Isolated and Bussed Circuits • Concave and Convex Terminations