7358 AP Search Results

HP 5082 7358

Abstract: HP 5082-7356 HP 5082-7357 5082-7359 tl 324 display
Contextual Info: HEXADECIMAL AND NUMERIC DISPLAYS FOR INDUSTRIAL APPLICATIONS 5082-7356 5082-7357 5082-7358 5082-7359 Features • CERAMIC/GLASS PACKAGE • ADDED RELIABILITY • NUMERIC 5082-7356/-7357 0-9, Test State, M inus Sign, Blank States, Decimal Point 7356 Right Hand D.P., 7357 Left Hand D.P.

INCOMING RAW MATERIAL INSPECTION checklist

Abstract: incoming material checklist INCOMING RAW MATERIAL INSPECTIONs in-process quality inspections INCOMING RAW MATERIAL specification INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL change control INCOMING RAW MATERIAL INSPECTION procedure MIL-STD-1686 incoming quality control checklist
Contextual Info: QUALITY ASSURANCE SELF SURVEY FACT SHEET I GENERAL INFORMATION a) Company Name: Data Device Corporation b) Address: 105 Wilbur Place, Bohemia, NY 11716 c) Telephone: 631) 567-5600 d) Fax - Main - (631) 567-7358 Fax - QA - (631) 244-8252 e) FSCM Number: 19645

5082-7357

Abstract: 320 display
Contextual Info: HEXADECIMAL AND NUMERIC DISPLAYS FOR INDUSTRIAL APPLICATIONS HEW LETT PACKARD m 5082-7356 5082-7357 5082-7358 5082-7359 Features • C ER A M IC /G LA SS PACKAGE • ADDED RELIABILITY • N U M ER IC 5082-7356/-7357 0-9, Test State, Minus Sign, Blank States,

502-3682

Contextual Info: Altech Corp. Pluggable Terminal Blocks Fixed Printed Circuit Terminal Blocks Ñ NEW Ñ Triple Deck Terminal Block Continued MVT-25 Plug (Continued) Stock No. Triple Deck Terminal Block 502-7352 502-7354 502-7356 502-7358 502-7360 502-7362 502-7364 Mfr.Õs

HP 5082-7356

Abstract: HP 5082-7357 5082-7356 Display hp 5082 5082-7357 5082-7359 5082-7358 HP 5082 7358 transistor marking bh ra HP 5082
Contextual Info: HEWLETT-PACKARD/ CMPNTS blE » ¥Ap% H E W L E T T mLfLM P A C K A R D • H 4 4 7 S S 4 □ □ D 8 b b 4 bOb ■ H P A HEXADECIMAL AND NUMERIC DISPLAYS FOR INDUSTRIAL APPLICATIONS 5082-7356 5082-7357 5082-7358 5082-7359 Features • C ER A M IC /G LA SS PACKAGE

7358

Abstract: DS26LS31CN AN-805 DS26LS31 EIA-422
Contextual Info: National Semiconductor Application Note 805 Joe Vo February 1992 INTRODUCTION In many board and system level designs, it is often necessary to determine the total power dissipated by the individual components of that application. This determination of total

Contextual Info: TMX fusible tantalum chip capacitor features • • • • • Fusible for safety applications Epoxy molded body, UL94V0 flammability EIA-US compatible sizes Low ESR and low inductance Fusing characteristics: - B, C case in less than 100 seconds at 1.5A

7358

Abstract: capacitor 476 10V capacitor marking code 1D 226 capacitor 476 capacitor MARKING W1
Contextual Info: TMX fusible tantalum chip capacitor features • • • • • Fusible for safety applications Epoxy molded body, UL94V0 flammability EIA-US compatible sizes Low ESR and low inductance Fusing characteristics: - B, C case in less than 100 seconds at 1.5A

Contextual Info: TMX fusible tantalum chip capacitor features • • • • • Fusible for safety applications Epoxy molded body, UL94V0 flammability EIA-US compatible sizes Low ESR and low inductance Fusing characteristics: - B, C case in less than 100 seconds at 1.5A

7358

Abstract: F5063
Contextual Info: 1218 Reader's Spreads 6/20/02 10:10 AM Page 134 PMS 300 neg. Black neg. TMX fusible tantalum chip capacitor features • • • • • Fusible for safety applications Epoxy molded body, UL94V-0 flammability EIA - US compatible sizes Low ESR and low inductance

Contextual Info: TANTALUM CHIP CAPACITOR KOA TMX SPEER ELECTRONICS, INC. FU SIB LE FUSIBLE CAPACITOR Epoxy Molded Body, UL94V-0 Flammability • EIA - US Compatible Sizes • Fusible for Safety Applications • Low ESR and Low Inductance • Fusing characteristics: - B, C, D case less than 100 sec @ 1.5A or

capacitor 226 20V

Abstract: capacitor 476 10V fusible c475 226 capacitor 476 capacitor 7358 D-2000 F5063
Contextual Info: TANTALUM CHIP CAPACITOR TMX FUSIBLE SPEER ELECTRONICS, INC. FUSIBLE CAPACITOR • Epoxy Molded Body, UL94V-O Flammability • EIA - US Compatible Sizes • Fusible for Safety Applications • Low ESR and Low Inductance • Fusing characteristics: SIDE CHIP

F5063

Contextual Info: TANTALUM CHIP CAPACITOR TMX SPEER ELECTRONICS, INC. FUSIBLE FUSIBLE CAPACITOR • Epoxy Molded Body, UL94V-O Flammability • EIA - US Compatible Sizes • Fusible for Safety Applications • Low ESR and Low Inductance • Fusing characteristics: SIDE CHIP

FT 3528

Abstract: KO 686 6W32
Contextual Info: KO A TANTALUM CHIP CAPACITOR TMX FUSIBLE SPEER ELECTRONICS, IN C . F U S IB L E C A PA C ITO R Epoxy Molded Body, U L94V -0 Flamm ability EIA - US Com patible Sizes Fusible for Safety Applications Low ESR and Low Inductance Fusing characteristics: - B, C, D case less than 100 sec @ 1.5A or

Contextual Info: P-JHＢ-E001） Type JHB TYPE JHB High Current Micro Fuse is designed for the purpose of external short circuit protection of the lithium ion battery of medium sizes, such as a power tool and an electric assistant bicycle. Though it was a surface mount type, it was small and realized high current rating, because a fuse element and a terminal adopt the

NTC 100 - 11

Abstract: NTC 130 ohm ntc 80
Contextual Info: NTC % /°C VS. Temperature Curves NTC (- %/°C) is negative temperature coefficient of resistance at temperature (T) expressed in % resistance change per °C. Since one NTC resistance change is approximately equivalent to 1°C temperature change, NTC is useful in developing curve tracking thermistor

Contextual Info: P-JHC-E001） Type JHC TYPE JHC High Current Micro Fuse is designed for the purpose of external short circuit protection of the lithium ion battery of medium sizes, such as a power tool and an electric assistant bicycle. Though it was a surface mount type, it was small and realized high current rating, because a fuse element and a terminal adopt the

CS5541

Abstract: MO-150
Contextual Info: CS5541 Low-Power, Low-Voltage, 24-Bit ∆Σ ADC Features Description l ∆Σ The CS5541 is a 24-bit low-power and low-voltage ∆Σ analog-to-digital converter ADC . It is optimized to convert analog signals in DC measurement applications, such as temperature and pressure measurement, and

Contextual Info: SN74ACT1073 16-BIT BUS-TERMINATION ARRAY WITH BUS-HOLD FUNCTION SCAS193 – D3992, MARCH 1992 – REVISED APRIL 1993 • • • • • • • DW PACKAGE TOP VIEW Designed to Ensure Defined Voltage Levels on Floating Bus Lines in CMOS Systems Reduces Undershoot and Overshoot

Contextual Info: Revised Mar. 1998 JS9P08-AS 1. RF PERFORMANCE SPECIFICATIONS Ta= 25°C CHARACTERISTICS Output Power at ldB Compression Point Power Gain at ldB Compression Point Drain Current Power Added Efficiency SYMBOL CONDITION MIN. TYP. MAX. UNIT 23.0 24.0 — dBm

TA 7358 TOSHIBA

Abstract: T 9722
Contextual Info: Revised Mar. 1998 JS9P08-AS 1. RF PERFORMANCE SPECIFICATIONS Ta= 25°C CHARACTERISTICS Output Power at ldB Compression Point Power Gain at ldB Compression Point Drain Current Power Added Efficiency SYMBOL CONDITION MIN. TYP. MAX. UNIT 23.0 24.0 — dBm

RC-3813

Abstract: 685 j RC-1009B 335M50 D336M SAF25
Contextual Info: Sharma Tantalum Capacitors RoHS Compliant SAF SERIES INTRODUCTION SAF Series molded Tantalum Chip Capacitors with Built-in fuse, are developed to provide safety to the PCB by opening the circuit in case of abnormal voltage or current. FEATURES: HIGH HEAT RESISTANCE MAKES IT SUITABLE FOR ALL TYPES OF SOLDERING

Contextual Info: TANTALUM CAPACITORS SAF SERIES INTRODUCTION SAF Series molded Tantalum Chip Capacitors with Built-in fuse, are developed to provide safety to the PCB by opening the circuit in case of abnormal voltage or current. FEATURES: HIGH HEAT RESISTANCE MAKES IT SUITABLE FOR ALL TYPES OF SOLDERING

9352-TB

Abstract: LTA05018 liquidtight LT125M LT9200M
Contextual Info: T&B Conduit Fittings Liquidtight Flexible Metal Conduit Fittings Liquidtight Flexible Metal/MS Fittings Cat. No. ⁄8 ⁄8 1 ⁄2 1 ⁄2 1 ⁄2 3 ⁄4 3 ⁄4 3 ⁄4 1 1 LTA03810 LTA03814 LTA05014 LTA05016 LTA05018 LTA07516 LTA07518 LTA07520 LTA10020 LTA10024