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TCTH011AE
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Toshiba Electronic Devices & Storage Corporation
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Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type |
Datasheet
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75867-108LF
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Amphenol Communications Solutions
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Quickie®, Wire to Board Connector, Double Row, 50 Positions, 2.54 mm (0.100in), Right Angle, Shrouded Header 0.76 um (30 u\\.) Gold or GXT™ Plating |
PDF
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68657-108HLF
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Amphenol Communications Solutions
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BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 8 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail. |
PDF
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79257-108HLF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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95157-108V
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded vertical header, Surface mount, Double Row, 8 Positions, 2.54 mm (0.100in) Pitch. |
PDF
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