6V8L Search Results

16v8 programming

Abstract: 16v8 16v8 programming Guide TS7166 CERAMIC LEADLESS CHIP CARRIER PALCE erase TEA 2053 B 16V8-10 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC palce programming Guide
Contextual Info: fax id: 6009 C PA LC E16V8 *t r ~ n£J Flash Erasable, Reprogrammable CMOS PAL Device Features • Q S O P packag ing availab le — 7.5 ns c o m ’l version 5 ns tc o 5 ns ts 7.5 ns t PD 12 5-M H z sta te m a ch in e • A c tiv e p ull-up on d ata input pins

6V8L-25LMB

Abstract: CERAMIC LEADLESS CHIP CARRIER 6V8L-15DMB 16v8 programming 16V8-10 PACKAGE CERAMIC LEADLESS CHIP CARRIER LCC PALCE16V8 PALCE16V8-10 PALCE16V8-15 PALCE16V8-25
Contextual Info: PALCE16 V8 CYPRESS Flash Erasable, Reprogrammable CMOS PAL Device • Up to 16 in p u t te rm s and 8 o utp uts Features • 7.5 ns c o m ’l version 5 ns tc o 5 ns ts 7.5 ns t PD 12 5-M H z sta te m ach ine • A c tiv e p ull-up on d ata input pins • Low p o w er version 16V 8L

transistors BC 557C

Abstract: BF366 SMD code 307C F199 transistor 2N5793 BC413 motorola ZENER diode marking code z7 equivalent of transistor bc212 bc 214 bc107c motorola 2n555
Contextual Info: S e le c to r G u id e s 1 M e ta l-C a n T ra n s is to rs 3 F ie ld -E ffe c t T ra n s is to rs 4 S m a ll-S ig n a l T u n in g , S w itc h in g and Z e n e r D io d e s 5 T a p e a n d R eel S p e c ific a tio n s P a ck ag e O u tlin e D im e n s io n s and

5962-8983914RA

Abstract: EA1 SMD 5962-8983912RA AM 16v8 5962-89839022a 5962-8983907 5962-8983909RA PALCE16V8H-15E4 MARKING EA1 smd code EA2
Contextual Info: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED A Updated document. Added three device types 04, 05, and 06. Added S package. Added two vendors. Editorial changes throughout. 91-08-23 M. A. Frye B Update boilerplate. Add device type 07 for vendor 66675. Editorial

X3-DFN0603-2

Abstract: United 7060 6V8L
Contextual Info: GDZ5V1LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm Ultra-Low Profile Package (0.3mm) Ideally Suited for Automated Assembly Processes

Contextual Info: GDZ5V1LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm   Ultra-Low Profile Package (0.3mm)   Ideally Suited for Automated Assembly Processes

16v8

Abstract: 16V8-5 16v8 programming PALCE16V8-15 rjoc 16V8L SLD15 16v8 programming Guide ATH 2053 PALCE16V8-10
Contextual Info: PA LCE16V8 7CYPRESS Flash Erasable, Reprogrammable CMOS PAL Device • Up to 16 input term s and 8 outputs Features • 7.5 ns com ’l version 5 ns tco 5 ns ts 7.5 ns t PD 125-M Hz state m achine • Active pull-up on data input pins • Low power version 6V8L

GDZ3V9LP3

Contextual Info: GDZ3V9LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm   Ultra-Low Profile Package (0.3mm)   Ideally Suited for Automated Assembly Processes

Contextual Info: GDZ5V1LP3 - GDZ8V2LP3 ADV AN CE I N FORM AT I ON ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm Ultra-Low Profile Package (0.3mm) Ideally Suited for Automated Assembly Processes

GDZ3V9LP3

Contextual Info: GDZ3V9LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm Ultra-Low Profile Package (0.3mm) Ideally Suited for Automated Assembly Processes

Contextual Info: GDZ5V1LP3 - GDZ8V2LP3 ADVANCE INFORMATION ULTRA-SMALL LEADLESS SURFACE MOUNT ZENER DIODE Features Mechanical Data • • • • • • • • • Ultra-Small Leadless Surface Mount Package 0.6 x 0.3mm Ultra-Low Profile Package (0.3mm) Ideally Suited for Automated Assembly Processes