6951B Search Results

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

DIN EN 60352-2

Abstract: NFF F 16101 09 23 248 6824 harting 09 06 000 6421 09 03 296 6825 222 harting 09 06 148 2901 222 09 03 000 6160 09 03 296 6825 222 09 03 096 3214 09 03 196 2921
Contextual Info: Directory chapter 01 – DIN Signal up to 2 A Page Technical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.10 Type B connectors . . . . . . . . . . . . . . . . . . . 01.11 Type 2B connectors . . . . . . . . . . . . . . . . . .

N10015

Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 695 SERIES Standard P/N 695-1B Space-Saving Heat Sinks for Small Stud-Mounted Diodes Maximum Width in. mm Height in. (mm) 1.330 (33.8) 0.530 (13.7) Mount and effectively heat sink small stud-mounted diodes with the 695 Series

09 05 348 6921

Abstract: HARTING 09 23 448 6824 09 03 232 2845 09 23 448 6824 132/6921 iso 1207 09 23 248 6824 132/6922 DIN EN ISO 1207 09 72 264 6801
Contextual Info: Inhaltsverzeichnis Kapitel 01 – DIN Signal bis 2 A Technische Kennwerte . Seite 01.10 Bauform B . . . . . . . . . . . . . . . . . . . . . . . . . . 01.11 Bauform 2B . . . . . . . . . . . . . . . . . . . . . . . . .

09 03 196 2921

Abstract: 09 03 196 7921 6922
Contextual Info: DIN 41 612 • Type C Number of contacts DIN Signal to 2 A 96, 64, 32 Male connectors Identification Male connector with angled solder pins Number Contact of contacts arrangement Performance levels according to IEC 60 603-2. Explanation chapter 00 3 2 1 96

TGT2

Contextual Info: O ^ K I s e m ic o n d u c t o r M S M 6 9 5 1 B ANALOG FRONT END LSI FOR MULTI-STANDARD MODEM GENERAL DESCRIPTION The 6951B is an analog front-end LSI which is fabricated by Oki's low power con­ sumption CMOS silicon gate technology for modem chip set based on Bell 2 1 2A, CCITT

657-10ABP

Abstract: 667-10ABPP TO220 HEATSINK 637-15ABPE 651b deltabond 152 XX1371 XX1703 657-25ABPNE 657-15ABPE
Contextual Info: 797-2012.qxp:QuarkCatalogTempNew 9/5/12 7:08 AM Page 797 7 Extrusions, Heat Sinks and Accessories XX1024 XX1371 ᭤ Aluminum Mfr.’s Type Extrusion Type Dimensions WxH×T Inches Nat. Conv. Qsa (°C/W) (1.312) (312) (1.335) (.090) (.190) (.375) (1.000)

Contextual Info: OKI semiconductor 6951B_ ANALOG FRONT END LSI FOR MULTI-STANDARD MODEM G EN ERA L DESCRIPTION The M S M 6 9 5 1 B is an analog front-end L S I w hich is fabricated by O K i's low power con­ sum ption C M O S silicon gate technology for m odem chip set based on Bell 2 1 2A, C C IT T

DIN 41 612 Connectors

Abstract: 09 03 164 6850 harting 09 06 000 6421
Contextual Info: HARTING Connectors DIN 41 612 Page 01.11 Pages 01.12 f Page 01.16 2B Page 01.17 Page 01.18 3B Page 01.19 Pages 01.20 f C Pages 01.22 f Pages 01.28 f 2C Pages 01.30 f Pages 01.32 f 3C Pages 01.34 f Page 01.41 M Page 01.42 M-flat Page 01.43 M invers Pages 01.44 f

220v AC voltage stabilizer schematic diagram

Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585

b0948

Abstract: 7902b 6931b 09 23 248 6824 09 03 000 6160 DIN EN ISO 1207 pin shroud 2824B 09 02 000 6484 6953-B
Contextual Info: Directory chapter 01 – DIN Signal to 2 A Page Technical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 01.10 Type B connectors . . . . . . . . . . . . . . . . . . . . 01.11 Type 2B connectors . . . . . . . . . . . . . . . . . . .

TO-220 footprint

Abstract: 287-1AB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks Standard P/N Height Above PC Board in. mm Maximum Footprint in. (mm) Material 286-AB ̆ 286-CBT ̆ 286-CT 1.190 (30.2) 1.190 (30.2)

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'