680102 Search Results

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: PRELIMINARY MULTILAYER CERAMIC CHIP CAPACITORS RESISTORS MCAPS & COILS MDELAY LINES +-5-41-5 L T t FEATURES H Miniature size H Wide range of capacitance, tolerance, TC, and voltage H High reliability, long life H Excellent frequency response H Available on 8mm and 12mm T&R

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

UL1015 awg12

Abstract: ac 680 DF22A-1416SC AWG10 AWG12 AWG14 AWG16 DF22 "1015 AWG 12"
Contextual Info: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current

Contextual Info: Value Code Inductor ph Code ph Code .01 .012 .015 .018 000 Oil 001 009 .022 dF H I 010 012 015 018 002 .10 .12 .15 .18 .22 .027 007 .27 027 .033 003 - - - * .039 - .047 - - - - 009 - 004 - - .33 - - - 033 - 039 .47 047 - - .056 005 .56 056 .068 006 .68 068

550028

Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

E52653

Abstract: R9950703 AWG10 AWG12 AWG14 AWG16 DF22 connector dep series 1155 socket
Contextual Info: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current

AWG10

Abstract: AWG12 AWG14 AWG16 B107 DF22 UL1430 DF22-1416SCF
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

DF22-1EP-7.92C

Abstract: UL1015 awg10 AWG10 AWG12 AWG14 AWG16 DF22 DF22-3S-7
Contextual Info: The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.

637-10ABEP

Abstract: 677-15ABEP 677-20ABEP 657-10ABEPN 657-10ABEP 657-20ABEPSC do-5 package MATERIAL 667-15ABESP weight TO66 66720
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Without Pin Plain Pin 634-10AB 634-10ABEP 634-15AB 634-15ABEP 634-20AB 634-20ABEP Material: Aluminum, Black Anodized.

AWG10

Abstract: AWG12 AWG14 AWG16 DF22 UL1015 awg10
Contextual Info: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current

1-534-24

Abstract: 221-233 R50-821
Contextual Info: MULTILAYER CERAMIC CHIP CAPACITORS RESISTORS MCAPS & COILS MDELAY LINES +-5-41-5 L T t FEATURES H Miniature size H Wide range of capacitance, tolerance, TC, and voltage H High reliability, long life H Excellent frequency response H Available on 8mm and 12mm T&R

ebonol

Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

coshh

Abstract: solid solubility 680102 fume smoke MS24 MS25 solder coshh assessment
Contextual Info: EXTRUDED SOLDER BAR Health and Safety Data Sheet 1. Identification of Substance/Preparation and of the Supplier Description : CEL extruded solder bar, 60/40 and 63/37 alloy containing lead. Part No./Code : 60/40 Alloy CEL Part No. Anglia Order Code 500g 45A501B

BMS13-78

Abstract: BMS13 408-7424 68011-1 68008-1 58422-1 Terminal crimping training crimping die 448044 BMS-1378
Contextual Info: Instruction Sheet Crimping Die Assemblies for COPALUM* Sealed Terminals and Splices 2. DESCRIPTION Nest Stationary Die 408-2281 21 NOV 08 Rev W (Figure 1) The die assemblies consist of stationary dies (nests) and moving dies (anvils). Refer to Figure 2 to ensure

CM-105

Abstract: AP109A-DF22A-1416 CL680 AWG10 AWG12 AWG14 AWG16 DF22 UL1430
Contextual Info: NEW 7.92 mm Contact Pitch, High-Current Connectors for Internal Power Supplies UL, C-UL and TÜV Listed DF22 Series Complete Locking Function Completely enclosed locking system Protection from shorts circuits between adjacent Contacts •Features 1. 30 A maximum current

E52653

Abstract: UL1015 awg10 UL1015 awg12 DF222 connector dep series
Contextual Info: •Right angle header A B C 9.45 12.2 P=7.92 3.5 15.2 0.8 9 17.6 24 1.6 Ø1.5 Contact No.1 A 5 Cavity No. No. of contacts indicator 3.7 5 1.2 Standard Type Guide Key: Inside, Color: Natural Beige Part Number CL No. Number of contacts A DF22-2P-7.92DS DF22-3P-7.92DS

EN29453

Abstract: 680102 68010 183C
Contextual Info: SOLDERING WAVE / FLOW SOLID SOLDER BARS EXTRUDED SOLDER Solid bars of high purity extruded solder, each polythene protected, with a choice of tin/lead alloy composition. Suitable for soldering machines, baths and pots. Available in 500g or 1kg bars. ◆ High purity extruded solder made from virgin

680-125220

Abstract: TO-220 footprint Heat Sinks 680-5K 680-125A 680-Series TO66 PLASTIC package 6903b 6805A
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above PC Board in. mm Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection Outline Dimensions

221-233

Contextual Info: MULTILAYER CERAMIC CHIP CAPACITORS RESISTORS MCAPS & COILS MDELAY LINES +-5-41-5 L T t FEATURES H Miniature size H Wide range of capacitance, tolerance, TC, and voltage H High reliability, long life H Excellent frequency response H Available on 8mm and 12mm T&R

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

680-125220

Abstract: 603K 637-10ABP 637-15ABP 680-5K 657-10ABPSC 627-15ABP 635-75B2
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABP ̆ 634-10AB 634-15ABP 634-15AB 634-20ABP ̆ 634-20AB Material: Aluminum, Black Anodized.