67710 Search Results

Contextual Info: MITSUBISHI RF POWER MODULE M 67710H 1 5 0 — 1 7 5 M H z, 9 .6 V 5 W FM P O R T A B L E RA D IO D E SC R IP T IO N M 67710H is a thick film RF power module specifically de­ signed for 1 5 0 ~ 175MHz, 5W FM portable sets. O U T LIN E D R A W IN G FEATURES

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

Contextual Info: Issued March 1997 232-3557 Data Pack G Data Sheet Power transmission drive belts Wedge and V-belt drives Wedge belts – SPZ and SPA types Size selector guide: SPZ and RMA equivalent RS stock no. The RS range of power transmission wedge and V-belts are manufactured to the ‘Fit and Forget’ oneshot tensioning principle. The precision control during

SKIIP 33 nec 125 t2

Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302
Contextual Info: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.

231-75PAB-14V

Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Contextual Info: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube

217-36CTT6

Abstract: ebonol 217-36CT6 230-75AB-10 MO-169 204-CB 260-6SH5B 215AP 627 Series 260-4T5
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

CXA 2159 S

Abstract: CXA 2159 inp075
Contextual Info: • Industry standard connector configurations allow mating with military and commercial ”D” Subminiature connectors. • Plugs and receptacles in 9,15,25 and 37 position sizes are available with a wide selection of contact platings, housing styles and hardware.

apm 4030

Contextual Info: A Member of Bird Technologies Group G E N E R A L C ATA L O G AND A P P L I C AT I O N S G U I D E QUALITY INSTRUMENTS FOR RF POWER MEASUREMENTS Bird Technologies Group BTG is the parent of Bird Electronic Corporation, Bird Component Products, and TX RX Systems Inc.

82430VX

Abstract: TE430VX SU116 intel 82430VX 82437VX 297653 pciset datasheet 430VX 82371SB 82438VX
Contextual Info: TE430VX Motherboard Specification Update Release Date: August 1997 Order Number: 281815-011 The TE430VX motherboard may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are

sgm 8905

Abstract: 3302 81A ir 3302 81A alcan joint compound snapdragon AKO 546 687 burglar alarm system abstract walkie talkie circuit diagram ZENER DIODES DZ 8407 tea 1601 t
Contextual Info: December 19, 2000 Preface to the 13th Edition The Harmonized Tariff Schedule of the United States, Annotated for Statistical Reporting Purposes HTS 2001 is being published pursuant to section 1207 of the Omnibus Trade and Competitiveness Act of 1988 (P.L.

Contextual Info: 677-100 Linear ICs Active Low-pass Filter status Military/High-RelN Tech. Filter TypeCauer Nominal Clock Frequency Hz f(cutoff) Maximum (Hz)106 Cutoff Freq (Min. Hz) Nom. Neg Supp15 Nom. Pos. Supp15 Minimum Operating Temp (øC)0 Maximum Operating Temp (øC)70

637-10ABEP

Abstract: 677-15ABEP 677-20ABEP 657-10ABEPN 657-10ABEP 657-20ABEPSC do-5 package MATERIAL 667-15ABESP weight TO66 66720
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Without Pin Plain Pin 634-10AB 634-10ABEP 634-15AB 634-15ABEP 634-20AB 634-20ABEP Material: Aluminum, Black Anodized.

ebonol

Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

82430VX

Abstract: 430VX TE430VX 82437VX 82437vx 82371sb 297653 SU116 82371SB 82438VX intel 28181
Contextual Info: TE430VX Motherboard Specification Update Release Date: July 1997 Order Number: 281815-010 The TE430VX motherboard may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are documented in this Specification

R0201

Abstract: R0321 S263 S262 S-262 S261 M 67580 GH S262 0001 R0041 R0161 r0131
Contextual Info: D Miniature Circuit Breakers S 260-D type System pro M acc. to EN 60 898 for cable protection Selection table No. of poles SK 0012 B 93 1 UBmax 440 V ȁ 60 V . SK 0013 B 93 2 UBmax 440 V ȁ 125 V . ቢ SK 0014 B 93 3 UBmax 440 V ȁ Rated current In A Ordering details

PR221DS sace tmax

Abstract: ABB RD2 earth leakage relay 2CSC400002D0205 mccb 60947-2 max zs ABB Sace Tmax S941N C2 60947-2 MAX EARTH LOOP IMPEDANCE BSEN 60898 R0427 50Hz to 60Hz 400v circuit diagram SQZ3
Contextual Info: Technical catalogue System pro M compact and other modular devices for low voltage installation System pro M compact® and other modular devices for low voltage installation In consideration of modifications to Standards and materials, the characteristics

77693

Abstract: 68064 7808 209j 471A 77079 71459 75405 75302 69310
Contextual Info: Part num bers 494 Page Part num bers Page 46221 46223 46225 46226 46227 23 23 23 23 23 48048 48049 48050 48051 48052 20 20 20 20 20 46231 46233 46235 46236 46237 23 23 23 23 23 48085 48115 48116 48117 48231 46241 46243 46245 46246 46247 23 23 23 23 23 46420

ISP2032

Abstract: lattice isp2032 4380-0000 PLD-10 glb02 PU18 PU27 SK 9080 PAL16V8 MPC860
Contextual Info: PCI 9080/860 AN MPC860 PowerQUICC  to PCI bus Application Note January 5, 1998 Version 2.0 Features _ • • • Complete Application Note for designing a PCI adapter or embedded system based on the Motorola MPC860 PowerQUICC including:

677-25ABEP

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 677 SERIES Standard P/N High-Performance, High-Power Heat Sinks for Vertical Board Mounting Height Above PC Board “A” in. mm Maximum Footprint in. (mm) 677-10ABEP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 677-15ABEP

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

680-125220

Abstract: 603K 637-10ABP 637-15ABP 680-5K 657-10ABPSC 627-15ABP 635-75B2
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABP ̆ 634-10AB 634-15ABP 634-15AB 634-20ABP ̆ 634-20AB Material: Aluminum, Black Anodized.