oki qfp tray
Abstract: 1000H ED-4701 72 ball w-csp SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY wcsp reliability FBGA tray mobile phone
Contextual Info: Oki’s Wafer Level Chip Size Packaging Technology 1 W-CSP 12/02 The Market’s Requirement for a New Packaging Technology • The need for increased functionality, smaller device size and lower costs are major challenges for today’s design engineers < •
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30min1000h100cyc300cyc+8500cyced-4701oki qfp tray72 ball w-cspsemiconductor packaging assembly technologywcsp reliabilityfbga traymobile phone
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