6252A Search Results

Contextual Info: REV ISIO N S THIRD ANGLE PROJ. NOTES: 1. MATERIALS AND FINISHES PLATING THICKNESS IN MICRO-INCHES : BODY - BRASS, NICKEL PLATING CONTACT -BERYLLIUM COPPER, GOLD PLATING INSULATOR - PTFE 2 . ELECTRICAL A. IMPEDANCE: 75 OHM B. FREQUENCY RANGE: DC 0 -1 GHz C. DIELECTRIC WITHSTANDING VOLTAGE: 1000 VRMS, MIN.

A6252

Abstract: 3GT50G SMA6252A1
Contextual Info: 4 7 6 8 REVISIONS ISS ZONE DESCRIPTION\PER REQUEST\DATE E D C NOTES: FINISH PLATING THICKNESS IN MICRO-INCHES 1. BRASS PER Q Q - B - 6 2 6 2. GOLD PL. 3 MIN. THICK OVER NICKEL PL. 100 MIN. THICK OVER COPPER STRIKE 3. BERYLLIUM COPPER PER Q Q - C - 5 3 0

Contextual Info: Film Capacitors – Power Factor Correction PhaseCap Compact capacitors Series/Type: Ordering code: MKK690-D-25-02 6252A090 Date: Version: January 2012 2 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the

6252a

Contextual Info: Film Capacitors – Power Factor Correction PhaseCap Compact capacitors Series/Type: Ordering code: MKK690-D-25-02 6252A090 Date: Version: March 2011 1 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the

Contextual Info: Film Capacitors – Power Factor Correction PhaseCap Compact capacitors Series/Type: Ordering code: MKK690-D-25-02 6252A090 Date: Version: January 2012 2 Content of header bars 1 and 2 of data sheet will be automatically entered in headers and footers! Please fill in the

atmel sdram

Abstract: 6252a
Contextual Info: Features • AMBA Compliant Interface, interfaces Directly to the ARM Advanced High • • • • • • • • • performance Bus AHB – Four AHB Interfaces, Management of All Accesses Maximizes Memory Bandwidth and Minimizes Transaction Latency

Contextual Info: 6252A2-021-3GT50G-50 NOTES: 1. MATERIALS AND FINISHES: BODY - BRASS, GOLD PLATING CONTACT - BERYLLIUM COPPER, GOLD PLATING INSULATOR - PTFE DRAWING ND. THIRD AN G LE PROJ. R E V IS IO N S REV DESCRIPTION DATE A R ELEASE TO MFG. 1 0 /1 3 /0 5 ^ APPR ECO

Contextual Info: 4 7 6 RE V IS IO NS I5 S D ESCRIPTI O N /P E R ZO N E REO U E S T \ DATE F F 1.4 SQ. E RECOMMENDED E MOUNTING HOLE ROB MOUNTING HOLE HEX 3 2 U N E F -2 A D D ii—if To ^] \\ ^ C ±0 ^ FORMING NOTES: 1. 2. 3. 4. 5. FINISH PLATING THICKNESS IN M IC R O -INC HE S)

Contextual Info: 1 I 2 I 3 I 4 I 5 I 6 I 7 I 8 REVISIONS I5S ZDNE D E S C R IP T IO N ^ ER REQUEST\DATE F \ - r 8 HE E PCB M O U N T IN G HOLE< D NOTES: FINISH PLATING THICKNESS IN M IC R O -IN C H E S 1. BRASS PER Q Q - B - 6 2 6 2 . GOLD PL. 3 MIN. THICK OVER NICKEL PL. 1ÛÛ MIN. THICK