614 004 161 21 Search Results

Contextual Info: 8 7 4 5 6 1 2 3 REVISIONS REV. ECO. NO DESCRIPTION DATE BY A 2406 INITIAL RELEASE 08/02/2011 LH F F 15.63[.614] 6.05 .238 1.48 .058 16.66[.655] 2.95 .116 12.00 .472 1.83 .072 6.85[.269] E 1.80 .071 2.20 .087 5.45 .215 11.55[.454] E 8.50[.334] 6.25 .246 0.50±0.10 .020±.004

614 004 161 21

Abstract: E323964 mar 614 629b
Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT COLOR: WHITE CONTACT MATERIAL: COPPER ALLOYS CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRASS Ni PLATED QUALITY CLASS: 1500 MATING CYCLES A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C

614 004 161 21

Abstract: E323964
Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT COLOR: WHITE CONTACT MATERIAL: COPPER ALLOYS CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRASS Ni PLATED QUALITY CLASS: 1500 MATING CYCLES A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C

Contextual Info: 1 2 3 4 5 TECHNICAL CHARACTERISTICS MATERIAL INSULATOR: PBT COLOR: WHITE CONTACT MATERIAL: COPPER ALLOYS CONTACT TYPE: STAMPED CONTACT PLATING: SELECTIVE GOLD SHIELDING: BRASS Ni PLATED QUALITY CLASS: 1500 MATING CYCLES A ENVIRONMENTAL OPERATING TEMPERATURE: -40 UP TO 105°C

C920

Abstract: U75-A30-X000
Contextual Info: 8 7 4 5 6 3 2 1 REVISIONS REV. AMPHENOL PART NUMBER CONFIGURATION U79 - A 1 X 1 - X X 0 X HEAT SINK OPTION 1 = NO HEAT SINK SHIPPED 2 = HEAT SINK AND CLIP SHIPPED LOOSE D 65.23 2.568 DATE PROPOSAL 2005/11/29 APPROVED A.G. PACKAGING 1 = TRAY PACKAGING T = TAPE AND REEL PACKAGING

mobile switching center (msc)

Abstract: sma square flange jack to jack adapter 619231-1 msc mobile switching center 5-619078-4
Contextual Info: RF Coax Connectors COAXICON Series Mobile Phone Switching Coax Connectors Product Facts • Able to switch RF signal from internal to external antenna ■ SMD component for standard pick & place ■ Up to 2.4 GHz ■ Up to 30,000 life cycles ■ High radial and axial

D2PAK1

Contextual Info: Cherry Semiconductor offers a wide variety of traditional packages in addition to more advanced package technology. Flip Chip is an example of the advanced packaging technologies offered by Cherry Semiconductor. An application note included in this section explains the Flip Chip manufacturing process and the methods available for Flip Chip assembly.

Contextual Info: Note: 1. Material: Housing: PA46 UL94V-0 Color: Nature Actuator: 4~29P PA46 Black Actuator: 30~50P PPS Brown Metal: Phosphoer bronze 2.Plating: Tin plated RoHS COMPLIANT D n n n n n n n n n m nnnnnm i U LI UJ LI U U LI 0.200 B B .008 tsnnnnnnnnnnnnnnnnnFs

W3DG648V-D2

Contextual Info: White Electronic Designs W3DG648V-D2 64MB- 8Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION „ PC100 and PC133 compatible „ Burst Mode Operation „ Auto and Self Refresh capability „ LVTTL compatible inputs and outputs The W3DG648V is a 8Mx64 synchronous DRAM module

VDE reg 7030

Abstract: VDE reg 0245 Cable VDE reg NR 7030
Contextual Info: ÖLFLEX CLASSIC 400 P / 400 CP PUR control cable with numbered cores and optimized design, NEW: with DESINA® conform design in larger cross-sections available Application ÖLFLEX® CLASSIC 400 P ÖLFLEX® CLASSIC 400 P is particularly suitable as control

B750T

Abstract: e225 capacitor E500
Contextual Info: SOLID TANTALUM CHIP CAPACITORS Solid Tantalum Surface Mount T495 SERIES—Low ESR, Surge Robust FEATURES • • • • • • • • Designed for very low ESR High ripple current capability High surge current capability 100% accelerated steady-state aging

transistor BC 945

Abstract: BC 945 metallized polyester film capacitor 125 KO 317 TIP 122 100 V transistor BC 157 cf06 capacitor transistor Bc 540 AVX film chip capacitors TIP 126
Contextual Info: A KYOCERA GROUP COMPANY TPC Film Chip Capacitors Film Chip Capacitors Contents CF Series. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Standardized Range PET H.T. CF-2 . . . . . . . . . . . . . . . . . . . . . . . . 3

siemens 5sy4

Abstract: siemens 5sy 5SJ6 MINIATURE CIRCUIT BREAKER siemens SIEMENS circuit breakers 5st3 801 siemens VDE 0660
Contextual Info: 1 Siemens AG 2009 BETA Protecting Miniature Circuit Breakers 1/2 1/8 1/11 1/15 1/16 1/18 1/21 Product overview 5SY and 5SP miniature circuit breakers 6000 A, 5SY6 10 000 A, 5SY4 10 000 A, high current, 5SP4 10 000 A, universal current, 5SP5, 5SY5 15 000 A, 5SY7

Contextual Info: SOLID TANTALUM CHIP CAPACITORS Solid Tantalum Surface Mount T495 SERIES—Low ESR, Surge Robust FEATURES • • • • • • • • New Extended Values for Low ESR Low Equivalent Series Inductance Ͻ2.5nH ESL Precision-molded, laser-marked case Symmetrical, compliant terminations

W3DG6432V-D2

Contextual Info: White Electronic Designs W3DG6432V-D2 256MB- 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION PC100 and PC133 compatible The W3DG6432V is a 32Mx64 synchronous DRAM module which consists of eight 16Mx16 SDRAM components in TSOP II package and one 2K EEPROM in an 8 pin TSSOP package for Serial Presence Detect

W3DG6433V-D2

Contextual Info: W3DG6433V-D2 White Electronic Designs 256MB- 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION „ PC100 and PC133 compatible „ Burst Mode Operation „ Auto and Self Refresh capability „ LVTTL compatible inputs and outputs „ Serial Presence Detect with EEPROM

W3DG6432V-D2

Contextual Info: White Electronic Designs W3DG6432V-D2 256MB- 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION „ PC100 and PC133 compatible „ Burst Mode Operation „ Auto and Self Refresh capability „ LVTTL compatible inputs and outputs „ Serial Presence Detect with EEPROM

W3DG6433V-D2

Contextual Info: White Electronic Designs W3DG6433V-D2 256MB- 32Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION PC100 and PC133 compatible The W3DG6433V is a 32Mx64 synchronous DRAM module which consists of four 32Mx16 SDRAM components in TSOP 11 package and one 2K EEPROM in an 8 pin TSSOP package for Serial Presence Detect

W3DG6416V-D2

Contextual Info: White Electronic Designs W3DG6416V-D2 128MB- 16Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION The W3DG6416V is a 16Mx64 synchronous DRAM module which consists of eight 8Mx16 SDRAM components in TSOP II package and one 2K EEPROM in an 8 pin TSSOP package for Serial Presence Detect

W3DG6416V-D2

Contextual Info: White Electronic Designs W3DG6416V-D2 128MB- 16Mx64 SDRAM UNBUFFERED FEATURES DESCRIPTION „ PC100 and PC133 compatible „ Burst Mode Operation „ Auto and Self Refresh capability „ LVTTL compatible inputs and outputs „ Serial Presence Detect with EEPROM

DV1210

Abstract: DV1205S ARCO 308 DV1230 ym 238 C 458 D DV1202 DV1205W trimmer capacitors arco 402 arco TRIMMER capacitor
Contextual Info: g Applications o Cl DV1205S 400 MHz Oscillator 2 Meter Amplifier 5 W Output ? c\ • ¡8 CJ 1 Parts List Li, 10 turns #22AWG on 1/4" diam eter, close wound L2, 3/4" length of #16 AWG C6, 1.5 to 20 pF, ARCO #402 trimmer c a p a c ito r C7 , 0.9 to 7 pF, ARCO #400 trimm er c a p a c ito r

WED3DG649V-D2

Contextual Info: White Electronic Designs WED3DG649V-D2 64MB- 8M x 64 SDRAM UNBUFFERED FEATURES DESCRIPTION PC100 and PC133 compatible The WED3DG649V is a 8M x 64 synchronous DRAM module which consists of four 8M x 16 SDRAM components in TSOP II package and one 2K EEPROM in an 8 pin TSSOP package for Serial Presence Detect

W3DG6465V-D2

Contextual Info: White Electronic Designs W3DG6465V-D2 FINAL 512MB - 64Mx64, SDRAM UNBUFFERED FEATURES DESCRIPTION PC100 and PC133 compatible The W3DG6465V is a 64Mx64 synchronous DRAM module which consists of eight 32Mx16 SDRAM components in TSOP II package and one 2K EEPROM

PTS125

Abstract: ksb42
Contextual Info: KSB & KSF Series Low-profile Tact Switch Features/Benefits • Low profile • Protected against flux • KSB without top sealing • KSF with top sealing • RoHS compliant and compatible Typical Applications • Low profile keyboards • Instrumentation