60 FBGA Search Results

VCCQ15

Contextual Info: White Electronic Designs W3E64M16S-XSBX PRELIMINARY* 64Mx16 DDR SDRAM FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266, 333* „ „ Package: „ • 60 Plastic Ball Grid Array PBGA , 10 x 12.5mm „ 1Gb upgrade to 512Mb 60 FBGA SDRAM „ 2.5V ±0.2V core power supply

S80032VMCTW-75A

Abstract: vm 256MB DDR 400 SpecTek DDR266 DDR333 DDR400B PC2100 PC2700 PC3200 256mb ddr333 200 pin
Contextual Info: 256Mb: x4, x8, x16 DDR SDRAM DOUBLE DATA RATE DDR SDRAM 60-ball FBGA (8mm X 14mm, 60 Ball) FEATURES • ROHS Compliant • PC2100, PC2700, and PC3200 compatible • VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V (For –6A & - Package Types (Leaded): 66-pin Plastic TSOP, OCPL

Contextual Info: White Electronic Designs W3E64M16S-XNBX 64Mx16 DDR SDRAM FEATURES „ DDR SDRAM rate = 200, 250, 266, 333* „ Package: BENEFITS „ • 60 Plastic Ball Grid Array PBGA , 10mm x 12.5mm x 1.5mm „ 1Gb upgrade to 512Mb 60 FBGA SDRAM „ 2.5V ±0.2V core power supply

7812

Contextual Info: White Electronic Designs W3E64M16S-XSBX 64Mx16 DDR SDRAM FEATURES BENEFITS „ DDR SDRAM rate = 200, 250, 266, 333* „ „ Package: „ • 60 Plastic Ball Grid Array PBGA , 10 x 12.5mm „ 1Gb upgrade to 512Mb 60 FBGA SDRAM „ 2.5V ±0.2V core power supply

W3E64M16S-XSBX

Contextual Info: White Electronic Designs W3E64M16S-XSBX 64Mx16 DDR SDRAM FEATURES „ DDR SDRAM rate = 200, 250, 266, 333* „ Package: BENEFITS „ • 60 Plastic Ball Grid Array PBGA , 10 x 12.5mm „ 1Gb upgrade to 512Mb 60 FBGA SDRAM „ 2.5V ±0.2V core power supply „

S80032VMCTW-75A

Abstract: s80032vmctw vm 256MB DDR 400 sdram spectek SpecTek SpecTek SDRAM 256Mb DDR266 DDR333 DDR400B PC2100
Contextual Info: 256Mb: x4, x8, x16 DDR SDRAM DOUBLE DATA RATE DDR SDRAM Plastic Package: 66-pin TSOP – OCPL (400 mil width, 0.65mm pin pitch) 60-ball FBGA (8mm X 14mm, 60 Ball) FEATURES • PC2100, PC2700, and PC3200 compatible • VDD = +2.5V ±0.2V, VDDQ = +2.5V ±0.2V (For –6A & 75A)

BCM54810

Contextual Info:  HDR-60 Base Board – Revision B User’s Guide April 2014 Revision: EB70_01.2  HDR-60 Base Board – Revision B Introduction The HDR-60 Base Board provides a low-cost evaluation and demonstration platform to evaluate, test and debug image signal processing user designs or IP, including High Dynamic Range HDR cores targeted for the

Flash

Abstract: Spansion Parallel Flash Cross Reference S29AL008J Spansion S29AL016j S29AL032M Flash cross reference S29AL008j spansion s29al008d s29al008 S29AL016J55
Contextual Info: ESMT VS Spansion Parallel Flash Cross Reference ESMT Compatible Part Number ESMT Architecture Density Spansion Part Number 8M S29AL008D 50/60/70/90 (T/B/M)(I/N)(01/02/ R1/R2) (50/60/70/90=speed) (T/B/M=TSOP/FBGA/SOP) (I/N=Industrial/Extend) (01/02=2.7~3.6 Top/Bottom)

FPT-56P-M01

Abstract: MBM29QM12DH MBM29QM12DH60 MBM29QM12DH-60 SA66
Contextual Info: MBM29QM12DH-60 Data Sheet Retired Product MBM29QM12DH -60 Cover Sheet This product has been retired and is not recommended for new designs. Availability of this document is retained for reference and historical purposes only. Continuity of Specifications

Contextual Info: EDE5108AHBG, EDE5116AHBG Package Drawing 60-ball FBGA Unit: mm 10.0 ± 0.1 0.2 S B 10.5 ± 0.1 INDEX MARK 0.2 S A 0.2 S 1.20 max. S 0.35 ± 0.05 0.1 S 60-φ0.45 ± 0.05 φ0.15 M S A B 0.8 B 8.0 A INDEX MARK 1.6 6.4 0.8 ECA-TS2-0181-01 Preliminary Data Sheet E0933E10 Ver. 1.0

EDE1108AFBG

Contextual Info: EDE1108AFBG Package Drawing 60-ball FBGA Unit: mm 8.0 ± 0.1 0.2 S B 10.5 ± 0.1 INDEX MARK 0.2 S A 0.2 S 1.20 max. S 0.35 ± 0.05 0.1 S 60-B0.45 ± 0.05 B0.15 M S A B 0.8 B 8.0 A INDEX MARK 1.6 6.4 0.8 ECA-TS2-0297-01 Preliminary Data Sheet E1430E20 Ver. 2.0

Contextual Info: EDE2508AEBG, EDE2516AEBG Package Drawing 60-ball FBGA Unit: mm 8.0 ± 0.1 0.2 S B 9.5 ± 0.1 INDEX MARK 0.2 S A 0.2 S 1.20 max. S 0.35 ± 0.05 0.1 S 60-φ0.45 ± 0.05 φ0.15 M S A B 0.8 B 8.0 A INDEX MARK 1.6 6.4 0.8 ECA-TS2-0225-01 Data Sheet E1175E20 Ver. 2.0

E1390E30

Abstract: EDE1108AFSE EDE1104AFSE
Contextual Info: EDE1104AFSE, EDE1108AFSE Package Drawing 60-ball FBGA Unit: mm 8.0 ± 0.1 0.2 S B 10.5 ± 0.1 INDEX MARK 0.2 S A 0.2 S 1.18 max. S 0.1 S 0.32 ± 0.05 B φ0.15 M S A B 0.8 60-φ0.45 ± 0.05 8.0 A INDEX MARK 1.6 0.8 6.4 ECA-TS2-0286-01 Data Sheet E1390E30 Ver. 3.0

Contextual Info: Difference Comparison table of TMP86CM25F/CS25F/PS25F/C925XB and TMP86CM25AF/FM25F ROM TMP86CM25F/ TMP86CS25F TMP86PS25F TMP86C925XB Emulation chip TMP86FM25F TMP86CM25AF 32 K (Mask ROM) 60 K (Mask ROM) 60 K (OTP) − 32 K (Flash) 32 K (Mask ROM) RAM 2K

TMP86PS25F

Abstract: TMP86CM25F TMP86CS25F TMP86FM25F
Contextual Info: Difference Comparison table of TMP86CM25F/CS25F/PS25F/C925XB and TMP86CM25AF/FM25F ROM TMP86CM25F/ TMP86CS25F TMP86PS25F TMP86C925XB Emulation chip TMP86FM25F TMP86CM25AF 32 K (Mask ROM) 60 K (Mask ROM) 60 K (OTP) − 32 K (Flash) 32 K (Mask ROM) RAM 2K

CMP14

Contextual Info: FUJITSU SEMICONDUCTOR CONTROLLER MANUAL CM71-10134-1E FR 60 32-BIT MICROCONTROLLER MB91470/480 Series HARDWARE MANUAL FR 60 32-BIT MICROCONTROLLER MB91470/480 Series HARDWARE MANUAL Be sure to refer to the “Check Sheet” for the latest cautions on development.

Contextual Info: 60 PIN PLASTIC FBGA 7.83x14.76 w E M S B D INDEX MARK w y1 S M S A A S y A1 S ZD ABCD E F GH J K LMN PR 1 2 SD A 5 6 e e B 60 – φ b φx M ZE S A B ITEM MILLIMETERS D E w 7.83±0.1 14.76±0.1 e 0.20 0.80 A 1.00±0.15 A1 0.40±0.05 b x y 0.50±0.05 y1 0.08

M395T5163FB4

Contextual Info: Rev. 1.0, Jul. 2010 M395T2863FB4 M395T5663FB4 M395T5160FB4 M395T5163FB4 240pin Fully Buffered DIMM based on 1Gb F-die 60 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND

M378T5663FB3

Contextual Info: Rev. 1.0, Jul. 2010 M378T2863FBS M378T5663FB3 M391T2863FB3 M391T5663FB3 240pin Unbuffered DIMM based on 1Gb F-die 60 & 84 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND

serial presence detect samsung 2010

Abstract: M392T5663FB M392T5663FBA
Contextual Info: Rev. 1.0, Oct. 2010 M392T2863FBA M392T5663FBA M392T5660FBA 240pin VLP Registered DIMM based on 1Gb F-die 60 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.

M393T2863FBA-C

Abstract: serial presence detect samsung 2010 K4T1G084QF 800cl5 M393T5660FBA-C DDR2 DIMM
Contextual Info: Rev. 1.0, Jul. 2010 M393T2863FBA M393T5663FBA M393T5660FBA M393T5160FBA 240pin Registered DIMM based on 1Gb F-die 60 FBGA with Lead-Free & Halogen-Free RoHS compliant datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE.

Contextual Info: 184Pin DDR400 Registered DIMM 2GB with 128Mx4 CL3 TS256MDR72V4S Description Placement The TS256MDR72V4S is a 256M x 72bits Double Data Rate SDRAM high-density for DDR400. The TS256MDR72V4S consists of 36pcs CMOS 128Mx4 bits Double Data Rate SDRAMs in 60 ball FBGA packages,

Contextual Info: 184Pin DDR266 Registered DIMM 2GB with 128Mx4 CL2.5 TS256MDR72V6S Description Placement The TS256MDR72V6S is a 256M x 72bits Double Data Rate SDRAM high-density for DDR266. The TS256MDR72V6S consists of 36pcs CMOS 128Mx4 bits Double Data Rate SDRAMs in 60 ball FBGA packages,

Contextual Info: 184Pin DDR266 Registered DIMM 2GB with 128Mx4 CL2.5 TS256MDR72V6S Description Placement The TS256MDR72V6S is a 256M x 72bits Double Data Rate SDRAM high-density for DDR266. The TS256MDR72V6S consists of 36pcs CMOS 128Mx4 bits Double Data Rate SDRAMs in 60 ball FBGA packages,