5UM Search Results

Contextual Info: 10 G SEE NOTE A SCALE IOs I □ NOTES: I) 2) MATERIAL: HOUSING: NYLON 4 /6 30X G.F.UL 94 V-0, NATURAL (BEIGE) TERMINAL- CARTRIDGE BRASS (0 .2 8 )7 .0 11 REF THICK PLATING: TIN: TIN (3-5UM)/ I20uin-200uin OVER ( l.27um)/5 luin MIN NICKEL. GOLD: (0.76UM)/30UIN SELECTIVE GOLD AND

Contextual Info: 1 I 31 File No. 43.1 QÎ0.2Q O o 37.QQ ; CN LO o -H CM •sj- 1.80 SHEET 1 / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger):Beryllium copper,heat treated Plating(outer sleeve) : Tin plated:2um/80u”nickel,5um/200u”Tin

Contextual Info: IB! File No. 5 7 .2 0 iQ . 2 5 2.80 o p Ò 51.40 o c\J +1 00 LO I I SH E E T 392 o 1 ~ / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger):Beryllium copper,heat treated Plating(outer sleeve) : Tin plated:2um/80u”nickel,5um/200u"Tin

Contextual Info: 1 I ih : File No. 77 7 n + n on I 392 zn: SHEET 1 / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger):Beryllium copper,heat treated Plating(outer sleeve) : Tin plated:2um/80u"nickel,5um/200u”Tin Gold plated:2um/80u”nickel,Full gold

Contextual Info: Tin Whisker Growth Experiment 1. Sample: DO-204 SMA TO-220 RS4M Matte tin (Matte tin) (Bright tin) (Bright tin) 10 Pcs 10 Pcs 10 Pcs 10 Pcs 2. Plating thickness: Typ. 5um 3. Post baking after plating: 150℃ for 1 Hr. 4. Environment condition (Humidity): 85℃ / 85%RH

Contextual Info: THTDO AWßl C DO NOT S C A L E DIMENSIONS M I N mm E T R I C PROJECTION VJ - - / \ PLATING CONNECTOR: NOTES: L— CONTACT AREA: 0,8pm Au MIN. OVER 1, 3jum Ni M I N . ACTION P I N : 0 , 5um SnPb MIN. OVER 1 , 3pm Ni MIN. REDUCED CROSS-TALK SH IE L D, 0, 5/im Sn .P b .

ESD test plan

Abstract: Episil process SP3481 SP3485 SP481 SP483
Contextual Info: Reliability and Qualification Report EPISIL 5um CMOS Process SP3485 Product Prepared by: G. West Manager, Quality Assurance Date: 7/14/06 EPISIL 5um CMOS Process Qualification Reviewed by: Fred Claussen VP Quality & Reliability Date: 7/14/06 Page 1 of 5

Contextual Info: T H I S COPY I S PROVIDED ON A RESTRICTED B A S IS AND I S NOT TO BE USED IN ANY WAY DETRIMENTAL TO THE PANDUI T PART NO. 6 2 . 5 / 1 2 5u m OR 5 0 / 1 2 5um MULTIMODE R I S E R RATED PATCHCORD F I B E R JACK PLUG TO M T - R J F5Z6P-12M* COMPONENT TYPE/DESCRIPTIO N

KLI-2113 sensor board

Abstract: KEK-4H0349-KLI-4104-12-30 kodak kli 2113 KLI-2113 Photodiode Array 32 element Kodak KLI-8023 CCD KODAK KLI-2113 KLI14 KLI-14403 KLI-5001
Contextual Info: IMAGE SENSOR SOLUTIONS DEVICE PERFORMANCE SPECIFICATION KODAK KLI-4104 Image Sensor High-Resolution Quadri-Linear Array 3 X 4080 Chroma, 10um Square Pixels and Array 1 X 8160 Luma, 5um Square Pixels June 7, 2004 Revision 5.0 1 KAF-4104 Revision 5.0 www.kodak.com/go/imagers

h2lb

Abstract: 2n2369 die ccd board Circuit Schematic Diagram Electronic h1ca
Contextual Info: IMAGE SENSOR SOLUTIONS DEVICE PERFORMANCE SPECIFICATION KODAK KLI-4104 Image Sensor High-Resolution Quadri-Linear Array 3 X 4080 Chroma, 10um Square Pixels and Array 1 X 8160 Luma, 5um Square Pixels June 7, 2004 Revision 5.0 1 KAF-4104 Revision 5.0 www.kodak.com/go/imagers

L4204

Abstract: 76UM L4208
Contextual Info: 1.27 .050 a r j j# r " a 1.05 .041 IF .ooo ±:i SEE NOTE 4 (SCALE lOil) (0.70) 7YP. '.0 2 8 NOTES: 1) MATERIAL! HOUSING! NYLON 4/6 3 0 * G.F.UL 94 V-0, NATURAL (BEIGE) TERMINAL- CARTRIDGE BRASS (0.2B)/.0II REF THICK 2) PLATING: TINi TIN (3-5UM)/l20uln-200uln OVER (l.2Tum)/5lu!n MIN NICKEL.

IR1011

Contextual Info: IR101１Evaluation Board Manual Features • The evaluation board for AsahiKasei’s infrared sensor IR1011 including Current-Voltage convertor and amplifier. • Field of view FOV limiter and optical filter (5um long-pass filter) are mounted to make easy to start to evaluate.

Contextual Info: 1 8 I File No. 392 I SHEET o 1 /1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Plating : Tin plated : 2u,m /80u”nlckel,5um/200u”Tin Gold plated: 2um /80 u"nickel,full gold Insulator body(housing) : PBT(UL94V— 0) Current rating : 3 Am ps/contact max.

6858 A

Contextual Info: 31 I I File No. I 392 , I Q ISHEET 1 /I A MATERIAL Pin Outer Sleeve : Brass,Machined,CuZn38Pb2 Clip(Contact 4 Finger): Beryllium Copper,Heat Treated Plating(Outer Sleeve): Tin Plated: 2um/80u” Nickel,5um/200u"Tin Plating(Contact): 2um/80u” Nickel,Gold Plating

Contextual Info: 2 .8 4 & Customer drawing 2_ _ I_ 1 REVISIONS SYM DATE DESCRIPTION ECN APPROVED 10/31/07 A D -S U B TECHNICAL DATA SHELL : BODY : Steel 2 .5 u m 1 0 0 u ” min tin over 1.2 5um (5 0u”) min nickel D Glass filled therm oplastic.

Contextual Info: RE VI S E PER ECN 0 U1 B- 00 5 9- 3 9 REV PER EC OU1B-C REV PER EC 0 5 1 2-C SECTION CONTACT AREA: ACTI ON P I N = ATER I AL ; CONTACT: HOUSING! PLAIEU O.Gum / 0 . 5um ' HOLE OVER IN I MUM OVEF PI OOPER BRONZE G L A 5 5 F I L L E D P OLYE STE R IHROOGH HOLES A I O xl . E

lead frame QFP

Abstract: SDIP30P-400
Contextual Info: O K I Semiconductor Packaging Packaging Unit, mm DtP40-P-600-2.54 5 1 .9 8 * 0 .3 Package material Lead frame material Pin treatment Solder plate thickness Package weight (g) Epoxy resin 42 alloy Solder plating 5um or more 6.10 TYP. DIP42-P-600-2.54 UUUUUUAUAA&

D5023

Abstract: 1A4A UK49 4005C K3190 cu k08
Contextual Info: NOTES: 1. MATERIALS HOUSING: UNFILLED NYLON 6/6, RATED UL 94V -2 FOR COLOURS. SEE CHARTS ON SHEETS 2-6. TERMINALS: PHOSPHOR BRONZE. 0.40/ 0.016 THICK REF. PLATING: 5um/(200uln) MIN PURE Sn 2. PRODUCT CONFORMS TO SPECIFICATION P S -9 9020-0037 3. ACCEPTS CABLE. PER E S -9 9036-0008 OR E S -99036-0009

47 16 t

Contextual Info: MULTILAYER CERAMIC CAPACITORS SMD * Multilayer ceramic capacitors MLCC are manufactured by suspending ceramic powders in liquid and casting into a thin green sheet from 20um in thickness to 5um or thinner. * Metal electrodes are sieved printed onto green sheets which are later stacked to form a laminated are structure. The metal

Contextual Info: \ 20 / 7.953 X _ s - 1 C2T r~r~L RECOMMENDED P ZB. LAYOUT VIEWED FROM COMPONENT SIDE (P.CB THICKNESS 1.60*020 e 1_ \/ . B H . - _ 91714 - * * * SECTION A-A (SEE CHART) •0- 3-5um TIN VERSION •3» 0.76um GOLD VERSION SECTION B-B 91714-026

Contextual Info:
      0. 5um 1P3M Embedded Flat ROM 5V
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Contextual Info: 1 I I 31 6 File No. 9« KD + n 9D I SHEET o 1 ~ / 1 Specifications: Pin outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger):Beryllium copper,heat treated Plating(outer sleeve) : Tin plated:2um /80u"nickel,5um /200u”Tin Gold plated:2um /80u”nickel,Full gold

Contextual Info: 1 I 46.60i0.20 3.00 2.80 o N 40.30 ; o -H o in 00 31 I File No. 392 I SHEET 1 o ~ / Specifications: Pin (outer sleeve : Brass,machined, CuZn38Pb2 Clip(contact 6 finger):Beryllium copper,heat treated Plating(outer sleeve) : Tin plated:2um /80u”nickel,5um /200u”Tin

4H0294

Abstract: KLI-4104 ccd board Circuit Schematic Diagram Electronic la 4127 4H0394 KEK-4H0349-KLI-4104-12-30 CCD linear multispectral tpd 1039 schematic power supply circuit diagram Lambda h2lb
Contextual Info: DEVICE PERFORMANCE SPECIFICATION Revision 7.0 MTD/PS-0542 January 6, 2009 KODAK KLI-4104 IMAGE SENSOR HIGH-RESOLUTION QUADRI-LINEAR ARRAY 3 X 4080 CHROMA, 10UM SQUARE PIXELS AND ARRAY 1 X 8160 LUMA, 5UM SQUARE PIXELS TABLE OF CONTENTS Summary Specification . 4