56001 Search Results

Contextual Info: High Performance ASIC Cooling Solutions w/Thermal Tape Attachment ATS PART # ATS-56001-C3-R0 Features & Benefits » D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling » Designed specifically for ASIC package and their unique

Contextual Info: HJ-56001 SIX WAY 0º POWER DIVIDER STC Microwave Systems – www.craneae.com 28 Tozer Road • phone: 978-524-7200 • Revision HJ-56001 2005 08252005 Beverly, MA 01915 email: electronics@craneae.com

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. •Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. •Pins are mechanically fastened and soldered to board

Contextual Info: High Performance ASIC Cooling Solutions w/Thermal Tape Attachment* DIGI-KEY PART # ATS1346-ND ATS PART # ATS-56001-C4-R0 Features & Benefits D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

18021

Contextual Info: P/N 97-56001 Motorola DSP56000/001 QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,

56001 motorola

Abstract: 56001 ASTM-B16-85 18021
Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: High Performance ASIC Cooling Solutions ATS Part#: ATS-56001-C4-R0 Description: maxiFLOW Heat Sink, NO TIM, RED-ANODIZED Heat Sink Type: maxiFLOW Heat Sink Attachment: THERMAL TAPE Equivalent Part Number: *Image above is for illustration purpose only.

56001

Abstract: QFE132SA
Contextual Info: 13 89 Position, PGA. PGA PC-PGA/QFP -56001 A1 Relative orrientations top views 1.800" 1993 I.E. Pin 1 SA QFP 1 N A Top View 1 1.800" 0.600" 0.681" 0.328" Substitute X in Part# with L or G Surface-mount Leadless version (-L) 0.409" Surface-mount Gull-wing leaded version (-G)

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: High Performance ASIC Cooling Solutions w/Thermal Tape Attachment* DIGI-KEY PART # ATS1332-ND ATS PART # ATS-56001-C3-R0 Features & Benefits D maxiFLOW design features a low profile, spread fin array that maximizes surface area for more effective convection air cooling

Contextual Info: M mSmm Model 560015 Antenna Feed Matrices 4 x 4 Butler Applications_ • Power Amplifiers • Sectorize Base Station Transmissions • Beam Forming • Wireless Infrastructure • GSM and AMPS Frequencies Features • • • • • Commercial Grade

Contextual Info: P/N 97-56001 Motorola DSP56000/001 QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,

FED-STD-595

Abstract: MIL-C-22750
Contextual Info: Vertical Launched Connectorized Components Model 560014 Antenna Feed Matrices 8 x 8 Butler Applications • Power Amplifiers • Sectorize Base Station Transmissions • Beam Forming • Wireless Infrastructure • GSM and AMPS Frequencies Features Electrical Specifications

56001 motorola

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

Contextual Info: Part No. 97-56001 - QFP to PGA Adapter for Motorola DSP56000/001 FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board

56001 motorola

Abstract: AMS-QQ-N-290
Contextual Info: P/N 97-56001 Motorola DSP56000/001 QFP-to-PGA Adapter FEATURES • Convert surface-mount QFP packages to a 13x13 PGA footprint. • Reduce costs by using less-expensive QFP packages to replace PGA footprints in existing designs. • Pins are mechanically fastened and soldered to board using Aries’ patented process,

MOTOROLA Cross Reference Search

Abstract: DSP56KCCG DSP56000 G56K
Contextual Info: Order this document by BR541/D MOTOROLA SEMICONDUCTOR DSP56KCCx TECHNICAL DATA Software Summary DSP56KCCx DSP56000/56001 C Cross Compiler DSP56000/1 High-Level Tools The DSP56KCCx is a full ANSI C Cross Compiler supporting development of DSP56000 family applications. This

Contextual Info: TO SH IBA TLSH180P T O S H IB A LED L A M P In G a A fP RED LIGHT E M ISS IO N TLSH180P A N E L C IRCUIT IN D IC A T O R 5mm DIAMETER Tl-3 / 4 InGaAiP RED LED All Plastic Mold Type. Colorless Clear Lens Low Drive Current, High Intensity Red Light Emission

Contextual Info: TOSHIBA TLRH190P TOSHIBA LED LAMP PANEL CIRCUIT INDICATOR InGaAfP RED LIGHT EMISSION TLRH1 9 0 P 10mm DIAMETER In G aA iP RED LED A ll P lastic Mold Type. Colorless Clear Lens Low Drive Current, High Intensity Red L ight Em ission Recommended Forward Current : Ip = 1—20mA DC

Contextual Info: TOSHIBA TLYH180P TOSHIBA LED LAMP PANEL CIRCUIT INDICATOR InGaAiP YELLOW LIGHT EMISSION T L Y H 1 80P 5mm DIAM ETER T l-3 /4 InGaA€P YELLOW LED All Plastic Mold Type. Colorless C lear Lens Low Drive C urrent, H igh In ten sity Yellow L ight Em ission

Contextual Info: TOSHIBA TLRH180P T O S H IB A LED L A M P In G a A fP RED LIG H T EM ISSION TLRH180P PAN EL C IR CU IT IN D IC A T O R 5mm DIAM ETER Tl-3 / 4 InG aA fP RED LED All Plastic Mold Type. Colorless Clear Lens Low Drive Current, High Intensity Red Light Em ission