503XX Search Results

Contextual Info: C US YK 503xx 3 x 0 J0G PDS: Rev :A STATUS:Released Printed: Jul 22, 2014

MVL-503DR

Abstract: MVL-503G MVL-503HR MVL-503UR MVL-503Y MVL-503
Contextual Info: Unity Opto Technology Co., Ltd. MVL-503G MVL-503Y MVL-503HR MVL-503DR MVL-503UR 04/30/2002 Description Package Dimensions Unite: mm inches The MVL-503xx series package are T-1 3/4 (φ5mm) standard color transparent plastic lens package. The Hi-EFF red (HR) and yellow LED chips are made with

Contextual Info: C US YK 503xx 0 x 0 J0G PDS: Rev :A STATUS:Released Printed: Jul 22, 2014

Contextual Info: C US YK 503xx 1 x 0 J0G PDS: Rev :A STATUS:Released Printed: Jul 22, 2014

Contextual Info: C US YK 503xx 2 x 0 J0G PDS: Rev :A STATUS:Released Printed: Jul 22, 2014

L-503ED

Abstract: L-503GD L-503HD L-503SRD L-503XX L-503YD L-511ED L-511GD L-511HD L-511YD
Contextual Info: L-503XX 5.0 mm Dia FLANGELESS LED LAMP Chip Part No. Raw Material Emitted Color Lens Color Wave Length ɡp nm Electro-Optical Characteristics Iv(mcd)20mA Vf(V)20mA Typ. Typ. Max. View Angle (deg) L-503HD GaP Red Red Diffused 700 2.3 2.8 8.0 110 L-503GD GaP

LED red 10mA

Abstract: L-503ED L-503GD L-503HD L-503SRD L-503XX L-503YD L-511ED L-511GD L-511HD
Contextual Info: L-503XX 5.0mm Dia FLANGELESS LED LAMP Chip Part No. L-503HD L-503GD L-503YD L-503ED L-503SRD Raw Material Emitted Color Lens Color GaP GaP GaAsP/GaP GaAsP/GaP GaAlAs Red Green Yellow Hi.effi Red Super Red Red Diffused Green Diffused Yellow Diffused Red Diffused

L-503RD-H506

Abstract: red 5mm LED with holder L-503ED-H506 L-503GD-H506 L-503HD-H506 L-503SRD-H506 L-503YD-H506
Contextual Info: MAIN FEATURES 5mm DIA FLANGLESS LED LAMP STANDARD 1" LEAD I.C. COMPATIBLE LOW POWER CONSUMPTION American Opto Plus L-503XX-H506 series . 5mm Dia FLANGLESS LED LAMP WITH H506 HOLDER ¡ PACKAGE DIMENSIONS 2.80 .110 6.35 (.250) 0.50 (.020) 1.All Dimension are in millimeter.

MVL-503DR

Abstract: MVL-503G MVL-503HR MVL-503UR MVL-503Y
Contextual Info: Unity Opto Technology Co., Ltd. MVL-503G MVL-503Y MVL-503HR MVL-503DR MVL-503UR Description Package Dimensions 5.05 .200 The MVL-503xx series package are T-1 3/4 (φ5mm) standard color transparent plastic lens package. The Hi-EFF red (HR) and yellow LED chips are made with Gallium Arsenide

AMP PBT connector 7 way

Abstract: EN3155 Cross Reference en3155 m39029 BOEING bacc63 D38999 series I II MS27615-KXXBXX MS27295 MS24254-16P aecma en3155 L-2119-E
Contextual Info: Amphenol 2010 Amphenol 12-C3 Circular Interconnects Products for Military, Aerospace and Harsh Environments Circular Interconnects • Aluminum • Stainless Steel/Firewall • Composite • Printed Circuit Board Connectors • High Speed Connectors • EMI Filter/Transient

M50430

Contextual Info: M50 Connectors SPECIFICATION Materials Environmental Mouldings: High Temperature Plastic UL94V-0 Operating temperature: -40°C to +105°C Contacts: Copper Alloy Solderability: 260°C for 3 seconds Finish:  50-3XX: Gold on contact area, M Tin on tails M50-4XX: Gold

Contextual Info: Series 503 Lo-PRO file Socket w/Collet Contacts & Wire Wrap Pins FEATURES • Available with Solder Tail or Wire Wrap Pins • Choose from Several Sizes and Plating Options GENERAL SPECIFICATIONS • BODY MATERIAL: Black UL 94V-0 glass-filled 4/6 Nylon

EN3155 Cross Reference

Abstract: en3155 m39029 D38999 series I II BACC47 en3155 crimping tools MS24264EXXTXX draka fileca cable ABS1503 en3155 017 aecma NF26Q100
Contextual Info: Amphenol 2010 Amphenol 12-C3 Circular Interconnects Products for Military, Aerospace and Harsh Environments Circular Interconnects • Aluminum • Stainless Steel/Firewall • Composite • Printed Circuit Board Connectors • High Speed Connectors • EMI Filter/Transient

dmpal10h8

Abstract: PAL16H2MJ m38510 PAL14H4MJ PAL12H6M DMPAL12H6j PAL10L8 M38510/14103BEC PAL14H4 PAL14L4
Contextual Info: REVISIONS DESCRIPTION DATE YR-MO-OA Pg 2 , o u tlin e l e t t e r Y changed to S ; case o u tlin e changed from fig u re 1 to F-9 . D elete subgroup 9 from f in a l e le c t r ic a l t e s t parameters in ta b le I I . Change m ilit a r y drawing p a rt numbers

intersil DATE CODE MARKING

Abstract: pin diagram details of CD4015 y2010 R4573 B TA3842 wafer fab control plan TA388* transistor ESD test plan ta5142 R4573
Contextual Info: Status of Document is: RELEASED Effective from: 07-AUG-2000 09:48:23 to Date Printed: 07-Aug-2000 10:33:38 Controlled Document QML QUALITY MANAGEMENT PLAN Title: QML QUALITY MANAGEMENT PLAN Specification Type: DOCS Specification Number :999015 Issue :24 Page :1 of 100

Contextual Info: Amphenol Aerospace 38999 III HD Dualok II I SJT 38999, Series III Hermetic – PCB Contacts TVPS02Y Stainless Steel Box Mounting Receptacle Series III TV S 2 PLACES R1 2 PLACES R2 2 PLACES Accessories Aquacon Herm/Seal PCB .913 +.011 –.000 .093 +.006 –.000

amphenol 77820

Abstract: TV-26 BACC63CT MS27477Y bacc63D BACC63CU vg96912 sjtg MS39029 SJT06
Contextual Info: Version 2 Amphenol 12-C2 Amphenol Circular Interconnects MIL-DTL-38999 MIL-DTL-38999 • Aluminum • Stainless Steel/Firewall • Composite • Clutch-lok High Vibration • Printed Circuit Boards • EMI Filter/Transient • Accessories • High Density HD38999

Contextual Info: M50 Connectors SPECIFICATION Materials Environmental Mouldings: High Temperature Plastic UL94V-0 Operating temperature: -40°C to +105°C Contacts: Copper Alloy Solderability: 260°C for 3 seconds Finish:  50-3XX: Gold on contact area, M Tin on tails M50-4XX: Gold

APPLICATION CD4094

Abstract: ta3842 tA 1507 989XXXX icl7667 die TA384 TA5072 ta1313 TA07667B 51122A
Contextual Info: Status of Document is:RELEASED Effective from: 19-SEP-1997 14:23:42 to Date Printed: 09/24/97 7:48 AM Controlled Document SECTION 3.0 QML TECHNOLOGY SPECIFIC GENERAL This section of the Harris QM Plan provides a description of the database systems used to control the

ta3842

Abstract: APPLICATION CD4094 CD40110 equivalent cd40110 211026001 87XXXX alps-rh HA-5320 ta5072 TA388
Contextual Info: Status of Document is:RELEASED Effective from: 02-JUN-1997 08:18:36 to Date Printed: 06/09/97 6:43 AM Controlled Document SECTION 3.0 QML TECHNOLOGY SPECIFIC GENERAL This section of the Harris QM Plan provides a description of the database systems used to control the