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SSM10N961L
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Toshiba Electronic Devices & Storage Corporation
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N-ch MOSFET x 2, Common drain, VSSS=30 V, 0.0128 Ω@10V, TCSPAG-341501 |
Datasheet
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10132450-1621GLF
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Amphenol Communications Solutions
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Minitek® Pwr 3.0 HCC, Dual Row, Vertical Through Hole Header, Tin plating, Black Color, 16 Positions, GW Compatible PA9T, Tray packing. |
PDF
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69305-016LF
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Amphenol Communications Solutions
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Crimp-to-Wire Housing, Single Row, 16 Position |
PDF
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66925-016LF
|
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Amphenol Communications Solutions
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Dubox®, Board To Board Connector, Horizontal Card Connector, Double Row, 32 Positions, 2.54mm (0.100in) Pitch |
PDF
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54122-810501600LF
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Amphenol Communications Solutions
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BergStik®, Board to Board connector, Unshrouded stacking vertical header, through hole, double Row, 50 position, 2.54mm (0.100in) pitch |
PDF
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