5000MFI Search Results
5000MFI Price and Stock
TXC Corporation AM-25.000MFIQ-TCRYSTAL 25.0000MHZ 10PF SMD |
|||||||||||
Distributors | Part | Package | Stock | Lead Time | Min Order Qty | Price | Buy | ||||
![]() |
AM-25.000MFIQ-T | Reel | 3,000 |
|
Buy Now | ||||||
![]() |
AM-25.000MFIQ-T | Reel | 3,000 |
|
Buy Now |
5000MFI Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
Contextual Info: Pin 1 r Y 2.00 MATERIAL Insulator : 30% Glass fiber PBT Contact Pin : Brass SPECIFICATION Current Rate : 1 AMP Insulation Resistance : 5000MfiMin. at DC 500V Contact Resistance : 20mQMax. a t DC 100mA Dielectric Voltage : AC 5 00V for one minute Operation Temperature : —40'C to + 105'C |
OCR Scan |
5000MfiMin. 20mQMax. 100mA -DB15-1Xxx | |
Contextual Info: I I - E + 1 .0 6 ± 0 .1 5 - - nnnnnnnnnnnnnnnn Pin 2 E E s MATERIAL 0 0 in o O Pîn Insulator : NYLON 9T C ontact Pin : Brass to UUUÜUUUUUUUUUUUÜ SPECIFICATION Current Rate : 1 AMP Insulation Resistance : 5000MfiMin. a t DC 500V |
OCR Scan |
5000MfiMin. 15mfiMax. 265-52-xx | |
3554
Abstract: 40T6 8004-32T6 IC 2764
|
OCR Scan |
UL94V-0. 5000Mfimin. 20m0max. 100mA. 3554 40T6 8004-32T6 IC 2764 | |
8949-h
Abstract: FCC-68 A-186
|
OCR Scan |
8949-H UL94V-0. 5000MQmin. 30mQmax. 100mA. FCC-68 A-186 | |
Contextual Info: R EV ECN. NO. A EDIÇÂO INICIAL APP DATE SPECIFICATION Current Rate : 1 AMP Insulation Resistance : 5000MfiMin. a t DC 500V C ontact Resistance : 20m0Max. a t DC 100mA D ielectric Voltage : 500V AC fo r one m inute Operation Temperature : - 5 5 ’C to + 1 0 5 ‘C |
OCR Scan |
5000MfiMin. 20m0Max. 100mA MJM02[ | |
b9001b
Abstract: 9001B CA27
|
OCR Scan |
9001-B DIN41612 UL94V-0. 5000MQmin. 30mnmax. 100mA. -94Max- 54X31 54X31-78 b9001b 9001B CA27 | |
Contextual Info: A j * " Sa Mi ^ DEGSON ELECTRONICS CO., LTD. ¡a . DEGSON « t e . * - 3 *t st a *&« DG245H4-5.0 DG245H4-7.5 DG245H4-10.0 DG245H4-5.08 DG245H4-7.62 DG245H4-10.16 NX10.0+1.0 300V 10A 20m fi 5000Mfi/DC1000V AC2000V/1 Min 28-12AWG 2.5mm2 S M È PI ÉèÉüPi |
OCR Scan |
DG245H4-5 DG245H4-7 DG245H4-10 UL94V-0 5000M AC2000V/1 28-12AWG | |
A182Contextual Info: 8949—C Series □upun Modular Jack Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: Current Rating:2 AMP. Insulator Resistance:5000Mfimin. at DC 500V. |
OCR Scan |
8949-C UL94V-0. 5000MQmin. 30mQmax. 100mA. loaded-350g. loaded-500g. loaded-750g. loaded-900g. A182 | |
7901Contextual Info: 7901 Series □upiin D-SUB I.D.C. Type Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Platlng:Gold plated. Electrical Characteristics: Current Rating: 1 AMP. Insulator Resistance: 5000Mfimin. at DC 500V. Contact Resistance: 20mfimax. at DC 100mA. |
OCR Scan |
UL94V-0. 5000Mfimin. 20mfimax. 100mA. 7901-Series 7901 | |
Contextual Info: 8949-H Series □upnn Modular Ja c k Material: H o u sing: 30% Glass filled PBT UL94V-0. C ontacts: Phosphor Bronze. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: C u rre nt R ating:2 AMP. In su la to r Resistance: 5000Mfimin. at DC 500V. |
OCR Scan |
8949-H UL94V-0. 5000Mfimin. 30mQmax. 100mA. loaded-350g. loaded-500g. loaded-750g. loaded-900g. | |
3554Contextual Info: 8004 Series □upiin Machine Pin IC Socket 2.54mm 0.100” Material: H o u sing: 30% Gloss filled PBT UL94V-0. C ontacts: Heat Treated Beryllium Copper. Plating: Tin plated. Electrical Characteristics: Current Rating: 1 AMP. In su la to r R e sistance: 5000Mfimin. at DC 500V. |
OCR Scan |
UL94V-0. 5000Mfimin. 20mnmax. 100mA. 3554 | |
Contextual Info: 9 2 0 2 S e r ie s □upiin PCMCIA Socket Material: Housing: High temperature housing UL94V-0 withstands IR and VPR soldering methods. Contacts: Beryllium Copper. Plating:Selective gold plated. Electrical Characteristics: Current Rotlng:0.5 AMP. Insulator Resistance: 5000Mfimin. at DC 500V. |
OCR Scan |
UL94V-0 5000Mfimin. 20m0max. 100mA. F68tt\ir6S! 9202Series | |
Contextual Info: 8 9 4 9 - F Series □upnn Modular Ja c k Material: H o u sing: 30% Glass filled PBT UL94V-0. C ontacts: Phosphor Bronze. Plating: Gold plated on contact area over Nickel. Electrical Characteristics: C u rre nt Rating:2 AMP. In su la to r Resistance:5000Mfim in. at DC 500V. |
OCR Scan |
UL94V-0. 5000Mfim 30mfimax. 100mA. loaded-350g. loaded-500g. loaded-750g. loaded-900g. loaded-1100g. 8949-F | |
Contextual Info: 7901 S e r ie s □upiin D-SUB I.D.C. Type Material: H o u sing: 30% Glass filled PBT UL94V-0. C ontacts: Phosphor Bronze. Plating:Gold plated. Electrical Characteristics: Current Rating: 1 AMP. In su la to r Resistance: 5000Mfimin. at DC 500V. C ontact R e sistance: 20mfimax. at DC 100mA. |
OCR Scan |
UL94V-0. 5000Mfimin. 20mfimax. 100mA. | |
|
|||
Contextual Info: 8949-G Series □upiin M odular Ja c k Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Plating: Gold plated on contact area over Nickel. Electrical Characteristics: Current Rating:2 AMP. Insulator Resistance: 5000Mfimin. at DC 500V. |
OCR Scan |
8949-G UL94V-0. 5000Mfimin. 30m0max. 100mA. loaded-350g. co-900g. 75---Section 8949-G | |
Contextual Info: 2006 Series Mini Ju m p e r Block 2.54m m 0.100” □upiin Material: Housing: 30% Glass filled PBT U L94V-0. Contacts: Phosphor Bronze. Plat!ng:Gold plated over nickel. Electrical Characteristics: Current Rating:1 AMP. Insulator Resistance: 5000Mfimin. at DC 500V. |
OCR Scan |
UL94V-0. 5000Mfimin. 20m0max. 100mA. 08Material: | |
Contextual Info: 8949-B □upnn Series Modular Jack Material: H o u sing: 30% Gloss filled PBT UL94V-0. C ontacts: Phosphor Bronze. Shield: 0.25mm Bass, Nickel plated. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: C u rre nt R ating:2 AMP. |
OCR Scan |
8949-B UL94V-0. 5000Mfimin. 30mfimax. 100mA. meetd-500g. loaded-750g. loaded-900g. 1100g. | |
SMD PIN HEADER 2.54 Header 125c
Abstract: SMD 2.54 Header SMD PIN HEADER 2.54 Header HEADER 2.54 smd D 2041 m
|
OCR Scan |
UL94V-0 5000MQmin. 20mfimax. 100mA. Typ01 2012-1X SMD PIN HEADER 2.54 Header 125c SMD 2.54 Header SMD PIN HEADER 2.54 Header HEADER 2.54 smd D 2041 m | |
Contextual Info: 2242 S e rie s □upnn P.C.B. Socket 1.27mmX1.27mm 0.050”X0.050” Material: Housing: High temperature housing withstands IR and VPR soldering methods. Contacts: Phosphor Bronze. Plating: Gold plated over nickel. Tin plated over nickel. E lectrica l C h aracteristics: |
OCR Scan |
27mmX1 5000MC 20mfimax. 100mA. | |
JACS-5079
Abstract: KJG T9
|
OCR Scan |
6917S0LPS 500VAC 2000VAC JACS-5079 5000Mfijy± 500VDC 22nrtJ -17SE KJG T9 | |
4-40UNCContextual Info: 8 V1.1 I N O T E: T H IS 7 D E V IC E IS ROHS C O M P L IA N T . REVISIONS SYM A DESCRIPTION DATE APPROVED A SYM A DESCRIPTION DATE APPROVED A «CUSTOMER DRAWING FOR REFERANCE ONLY, SAMPLES APPROVAL ARE REQUIRED!! 047 SPECIFICATIONS: ELECTRICAL CHARACERISTICS: |
OCR Scan |
4-40UNC 5000Mfi HDB200-PF15GX-L 4-40UNC 06/JUN/07' HDB200-PF15G | |
Contextual Info: 0.5+ 2.54*no.of positions ±0.32.54*(no.of contacts-1) ±0.2— n n // n n n n 1 o -H o TJ O' I'D □ □ 7 [7 in CN REV. DESCRIPTION DATE NOTE: Material: 1. Housing: Polyester, UL94V-0. 2. Terminal: Copper alloy. Gold-plated Electrical: 1. Current rating: 3 Amp. |
OCR Scan |
UL94V-0. 30mft 5000Mfi F2540-H50-DSMT-XX F2540-H50-DSMT | |
NON ZIF CONNECTOR
Abstract: a096
|
OCR Scan |
UL94V-0. 5000Mfimin. 20mQmax. 100mA. I-2-54 NON ZIF CONNECTOR a096 | |
A181Contextual Info: 8949-B Series Modular Jack □upnn Material: Housing: 30% Glass filled PBT UL94V-0. Contacts: Phosphor Bronze. Shield: 0.25mm Bass, Nickel plated. Plating: Selective Gold plated on contact area over Nickel. Electrical Characteristics: Current Rating:2 AMP. |
OCR Scan |
UL94V-0. 5000MQmin. 30mfimax. 100mA. loaded-500g. loaded-750g. loaded-900g. loaded-110Og. 8949-B A181 |