5 BALL CSP DRAWING Search Results

QFN108

Abstract: QFN-132 kl1-v1 208 pin rqfp drawing qfn132 RT3PE3000L CQ256 DIMENSIONS pqfp 100 actel package mechanical drawing Actel A40MX04 PBGA 23X23 0.8 pitch
Contextual Info: v 11. 2 Package Mechanical Drawings Ceramic Pin Grid Array 84-Pin CPGA Top View 0.050" ± 0.010" Pin #1 ID 0.045" 0.055" 0.015" 0.018" ± 0.002" 0.100" BSC 1.100" ± 0.020" square 0.072" 0.088" L 0.120" 0.140" Side View K J H G F 1.000" BSC E D C B A 1 2 3

MS-034-AAn-1

Abstract: ak 957 MS-034 1152 BGA BGA 31 x 31 mm MO-047 MS026-ACD MO-113-AA-AD MS-034-AAU-1 MO-151 AAL-1 OPD0002
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

48LD

Contextual Info: LP62S16256F-I Series 256K X 16 BIT LOW VOLTAGE CMOS SRAM Document Title 256K X 16 BIT LOW VOLTAGE CMOS SRAM Revision History History Issue Date Remark 0.0 Initial issue November 22, 2002 Preliminary 0.1 Change ICC2 from 15mA to 8mA April 18, 2003 0.2 Modify 48LD CSP bottom view outline drawing

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch

CBG064-052A

Abstract: csp process flow diagram CBG064 reballing 28F160C18 BGA Solder Ball 0.35mm collapse intel 845 MOTHERBOARD pcb CIRCUIT diagram micron tsop 48 PIN tray 28F3202C3 intel MOTHERBOARD pcb design in
Contextual Info: D Intel Flash Memory Chip Scale Package User’s Guide The Complete Reference Guide 1999 D Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of Sale for such products, Intel assumes no liability

LGA 1150

Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter and contain between 250 and 2500 devices. The packages supplied on Tape and Reel are listed in Table 1 that shows the Tape Width and Part Pitch

639X

Abstract: LGA 1150
Contextual Info: CSP TAPE & REEL Chip Scale Packages for Memory Products Tape and Reel Shipping Media INTRODUCTION Surface mounting packages can be supplied with Tape and Reel packing. The reels are standard 330mm diameter 150mm for SBGA and contain between 250 and 2500 devices.

taiyo PSR4000

Abstract: Shipping Trays kostat 10 x 10 nitto hc100 Kostat tray PSR4000 aus5 EPAK EPAK TRAY JEDEC Kostat PSR4000 aus5
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

fBGA package tray 12 x 19

Abstract: EPAK TRAY FBGA THICK TRAY fbga Substrate design guidelines JEDEC Kostat FBGA EPAK Kostat PSR4000 SLB128B AN-1125
Contextual Info: Table of Contents Introduction . 2 CHIP SCALE PACKAGES . 2

116-Pin

Abstract: PBGA 256 reflow profile semiconductor cross index Lead Free reflow soldering profile BGA reflow soldering profile BGA 224-pin plastic ball grid array 0.8mm JIS-Z0202 tray qfp 14x14 1.4 tray bga 10x10 pcb warpage after reflow
Contextual Info: small! What is a CSP Chip Size Package ? A “CSP” is an integrated circuit package with dimensions equal to or slightly larger than those of the silicon chip it contains. Specifically, a package with size (L x W) equal to the size of the chip is called a Real Chip Size

Theta JC of FBGA

Abstract: cpga dimensions cpga weight 84 pin plcc ic base
Contextual Info: v3.0 Package Characteristics and Mechanical Drawings Pa c ka ge T he r m a l C ha r a ct e r i s t i c s Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

W-CSP footprint

Abstract: MO-211-C DM056 wcsp package reliability WLCSP stencil design EH11 wcsp wcsp qualification WAN0158
Contextual Info: w WAN_0202 Guidelines on How to Use W-CSP Packages and Create Associated PCB Footprints INTRODUCTION The Wolfson Wafer level ChipScale Package W-CSP is a die-sized package, which obtains electrical contact via solder bumps on the bottom surface of the device to a Printed Circuit Board

Contextual Info: PRELIMINARY CM1442 LCD and Camera EMI Filter Array with ESD Protection Features Product Description • The CM1442 is a family of pi-style EMI filter arrays with ESD protection, which integrates six and eight filters C-R-C in Chip Scale Package form factor with

CM1300

Abstract: CM1300-03CP CM1300-03CS CSPRC032A 250 micro solder ball
Contextual Info: CM1300 4 Channel EMI Filter Network Features Product Description • • The CM1300 is a 4-channel low pass EMI filter R-C-R configuration manufactured in a Chip Scale Package (CSP). Many portable applications require the attenuation of signals in the 800-3000 MHz band. California

Contextual Info: CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pistyle filter 30pF-100Ω-30pF which provides greater

Contextual Info: PRELIMINARY CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes.

ms-029

Abstract: FBGA1152
Contextual Info: v6.0 Package Characteristics and Mechanical Drawings P a ck ag e Th e r m al C h ar ac te ri st i cs Package Type Ceramic Pin Grid Array CPGA Ceramic Quad Flat Pack (CQFP) – cavity up – cavity up w/ heat sink Plastic Leaded Chip Carrier (PLCC) Plastic Quad Flat Pack (PQFP)

N406

Abstract: CM1440 CM1440-06CP CM1440-06CS
Contextual Info: CM1440 6 Channel EMI Filter Array with ESD Protection Features Product Description • • The CM1440 is a six channel low-pass EMI filter array with ESD protection that reduces EMI/RFI emissions while providing robust protection from ESD strikes. Each EMI filter channel integrates a high quality pistyle filter 30pF-100Ω-30pF which provides greater

Contextual Info: PRELIMINARY CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF

250 micro solder ball

Abstract: 5 ball csp drawing EMI/RFI filter schematic diagram CM1441 CM1441-07CP marking B4 diode
Contextual Info: CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF

CM1441

Abstract: CM1441-07CP CM1441-07CS n417
Contextual Info: CM1441 4-Channel EMI Filter Array w/ ESD + 4-channel ESD Array Features Product Description • The CM1441 is a multichannel EMI/ESD array consisting of four low-pass filter + ESD channels to reduce EMI emissions on data ports and lines and four dedicated ESD-only channels. Each EMI filter channel integrates a high quality pi-style filter 30pF-100Ω-30pF

00984a2

Abstract: top side marking b2 PACDN1404C PACDN1404CG PACDN1408C PACDN1408CG PACDN1416C PACDN1416CG 1416C
Contextual Info: PACDN1404C/1408C/1416C ESD Protection Arrays, Chip Scale Package Features Product Description • The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD.