4X MARKING Search Results

STM8 CPU programming manual

Abstract: STM8AF6266 pm0044 STM8AF6226 PM0044 Programming manual i2c berr stm8 STM8AF6248 STM8A STM8AF612x Date Code Marking STM8
Contextual Info: STM8AF622x/4x/66/68 STM8AF612x/4x/66/68 errata sheet Device limitations for STM8AFxxxx automotive MCUs featuring up to 32 Kbytes of Flash program memory Silicon identification This errata sheet applies to the STMicroelectronics STM8AF622x/4x, STM8AF6266/68,

Contextual Info: 0.478 12.14 0.344 8.75 0.770 19.57 6 1.024 26.00 2X 7 5 4 1 2 3 3 2 4X 8 1 4 0.091 2.30 4X 0.098 2.50 2 06 0. 8 5 1. 0.079 2.00 0.276 7.00 0.517 13.14 0.646 16.40 0.661 16.78 LED LED 0.419 10.64 1.024 26.00 9 6 03 0. 2 9 0. 0.553 14.05 10 0.080 2.03 4X 0.278

4x marking

Contextual Info: SEMICONDUCTOR PG24EXUS6 MARKING SPECIFICATION US6 PACKAGE 1. Marking method Laser Marking 2. Marking 0 1 4X 1 2 3 No. Item Marking Description Device Mark 4X PG24EXUS6 hFE Grade - - * Lot No. 01 2006. 1st Week [0:1st Character, 1:2nd Character] Dot ● Pin 1 Index

Contextual Info: LITE-ON SEMICONDUCTOR L30ESDL5V0C6-4X STAND-OFF VOLTAGE - 5.0 Volts POWER DISSIPATION - 300 WATTS ESD PROTECTION DEVICE GENERAL DESCRIPTION SOT23-6L The L30ESDL5V0C6-4X is low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically

Contextual Info: ASM3P2274A 4X Multiplier EMI Reduction IC The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. Features • Generates a 4X EMI optimized clock signal at the

Contextual Info: ASM3P2274A 4X Multiplier EMI Reduction IC Features The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. • Generates a 4X EMI optimized clock signal at the

ASM3P2274A

Abstract: marking z4l
Contextual Info: ASM3P2274A 4X Multiplier EMI Reduction IC The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. Features • Generates a 4X EMI optimized clock signal at the

Contextual Info: Plastic Packages for Integrated Circuits Package Outline Drawing V356.27x27C 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE HPBGA Rev 1, 6/10 0.20 (4X) 27.00 A1 BALL PAD CORNER 24.00 +0.35 -0.05 4X 10.00 5. A1 BALL PAD INDICATOR, 1.0 DIA., OPTIONAL A

9018

Abstract: PulseCore Semiconductor
Contextual Info: PCS3P2189A May 2008 rev 0.2 Spread Spectrum Clock Generator Product Description Features • PCS3P2189A is a versatile spread spectrum frequency Generates a 4X low EMI spread spectrum clock of modulator that generates a low EMI 4x clock at the the input frequency.

Contextual Info: PCS3P7101A September 2006 rev 0.1 Low Power Peak EMI Reducing clock synthesizer Product Description Features The PCS3P7101A is a low cost, single-output, clock • Generates a 4x low EMI clock at the output synthesizer. The PCS3P7101A generates a 4x output clock

marking Z3 6-pin

Contextual Info: ASM3P2274A Low Power 4X Multiplier EMI Reduction IC Features The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. Generates a 4X EMI optimized clock signal at the

ASM3P2274A

Abstract: marking z4l
Contextual Info: ASM3P2274A 4X Multiplier Peak EMI Reduction IC The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method. Features • Generates a 4X EMI optimized clock signal at the

Contextual Info: LITE-ON SEMICONDUCTOR L12ESDL5V0C6-4X STAND-OFF VOLTAGE - 5.0 Volts POWER DISSIPATION - 120 WATTS ESD PROTECTION DEVICE GENERAL DESCRIPTION SOT23-6L The L12ESDL5V0C6-4X is ultra low capacitance TVS arrays designed to protect high speed data interfaces. This series has been specifically

Solder Balls

Abstract: V356
Contextual Info: Plastic Packages for Integrated Circuits Heatsink Plastic Ball Grid Array Package HPBGA 27.00 A1 BALL PAD CORNER 0.20 (4X) V356.27x27C A 356 BALL HEATSINK PLASTIC BALL GRID ARRAY PACKAGE (HPBGA) 24.00 +0.35 -0.05 4X 10.00 B NO. OF LAYERS DIM “A” DIM “B”

P2084A

Contextual Info: P2084A Low Cost Frequency Multiplier The P2084A can generate a 4x output clock of the input frequency which allows system cost savings by using an inexpensive crystal or resonator to achieve high frequency multiplication. Features • Generates 2x and 4x clocks of the input clock

Contextual Info: P2084A Low Cost Frequency Multiplier Features The P2084A can generate a 4x output clock of the input frequency which allows system cost savings by using an inexpensive crystal or resonator to achieve high frequency multiplication. • Generates 4x clock of the input clock frequency

PLL 120Mhz

Abstract: ASM3P2274A TSOT23
Contextual Info: ASM3P2274A November 2006 rev 1.1 Low Power 4X Multiplier EMI Reduction IC Features • The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is Generates a 4X EMI optimized clock signal at the implemented by using a proprietary all digital method.

Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Inductance 100 kHz/ 100 mV ∆T = 40 K Impedance Rated current Value Unit Tol. L 4x 100 µH ±35% Zmax IR 900 Ω typ. 700 mA max. DC Resistance RDC 4x 0.10

Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Inductance 100 kHz/ 100 mV ∆T = 40 K Impedance Rated current Value Unit Tol. L 4x 250 µH ±35% Zmax IR 1400 Ω typ. 600 mA max. DC Resistance RDC 4x 0.12

marking Z4

Abstract: marking Z1 6-pin marking Z3 6-pin marking Z1 6pin 12Mhz crystal oscillator
Contextual Info: ASM3P2274A November 2005 rev 0.3 Low Power 4X Multiplier EMI Reduction IC Features ƒ The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is Generates a 4X EMI optimized clock signal at the implemented by using a proprietary all digital method.

V356

Contextual Info: Plastic Packages for Integrated Circuits Plastic Ball Grid Array Package PBGA V356.27x27B 0.20 (4X) 27.00 24.00 A1 BALL PAD CORNER A 356 BALL PLASTIC BALL GRID ARRAY PACKAGE (PBGA) +0.35 -0.05 B 4X 10.00 NO. OF LAYERS DIM “A” DIM “B” NOTES 4 2.33±0.21

Contextual Info: ASM3P2274A November 2005 rev 1.0 Low Power 4X Multiplier EMI Reduction IC Features ƒ The ASM3P2274A uses the most efficient and optimized modulation profile approved by the FCC and is Generates a 4X EMI optimized clock signal at the implemented by using a proprietary all digital method.

Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Inductance 100 kHz/ 100 mV ∆T = 40 K Impedance Rated current Value Unit Tol. L 4x 500 µH ±35% Zmax IR 3000 Ω typ. 400 mA max. DC Resistance RDC 4x 0.30

Contextual Info: A Dimensions: [mm] B Recommended land pattern: [mm] D Electrical Properties: Properties Test conditions Inductance 100 kHz/ 100 mV ∆T = 40 K Impedance Rated current Value Unit Tol. L 4x 4700 µH ±35% Zmax IR 14000 Ω typ. 200 mA max. DC Resistance RDC 4x 0.85