4L1A Search Results

Contextual Info: 2 -4 L1 A U n iti nn o+ i in ö co ö+1 in vJD CU ö +1 in MD 00 GOL 0, 25±0, 05 , 0 05 -E DT55I Nane JEDEC JE][TA Toshiba D iscre te Semiconductor In te g ra te d C ircuit — — — 2-4L1A — D ec,2004

land pattern for TSSOP

Abstract: land pattern for TSsOP 8
Contextual Info: 8-pin Thin Shrink Small Outline Advance Package TSSOP Advance Package Outline Dimensions Outline Dimensions 4 0.8 0.8 0.8 0.2 +0 –0.2 0.5 ±0.1 1 3.5 ±0.2 A S 2.75 ±0.2 8 1.05 ±0.2 4.65 ±0.3 2.2 ±0.2 5 4 0.75 ±0.05 3.65 ±0.2 8 0.55 0.166 ±0.05 0.05 M A

TE12L

Contextual Info: Thin Shrink Small Outline Advance Package 8pin TSSOP Advance パッケージ エンボス方式テーピング寸法 TE12L テープ形状および寸法 1.75 ±0.1 単位 : mm 2.0 ±0.1 4.0 ±0.1 Y 5.5 ±0.1 φ1.7 ±0.1 X 4.1 Y 12.0 ±0.2 φ1.55 ±0.05

Contextual Info: Thin Shrink Small Outline Advance Package 8pin TSSOP Advance パッケージ 外形図 パッケージ形状および寸法 4 0.8 0.8 0.8 0.2 +0 –0.2 0.5 ±0.1 1 3.5 ±0.2 A S 2.75 ±0.2 8 1.05 ±0.2 4.65 ±0.3 2.2 ±0.2 5 4 0.75 ±0.05 3.65 ±0.2 8 0.55

4L4A

Abstract: SHARC 21060
Contextual Info: WHITE M ICRO ELECTRO NICS WH31MXL2X-001X MODULAR HEX21060MODULE, 16M SRAM/16M FLASH ADVANCED* FEATURES FUNCTIONAL DESCRIPTION • SHARC 21060 DSP Based ■ ■ Integra ted C lock G eneration C irc u itry ■ The Hex SHARC 21060 D ig ita l S ignal Processor MCM is a high

TE12L

Contextual Info: 8-Pin Thin Shrink Small Outline Advance Package Embossed TE12L Tape for the TSSOP Advance Package Tape Dimensions 2.0 ±0.1 4.0 ±0.1 Y Y 4.1 5.5 ±0.1 φ1.7 ±0.1 X 0.3 ±0.05 12.0 ±0.2 φ1.55 ±0.05 1.75 ±0.1 Unit: mm X’ Y’ Y’ 8.0 ±0.1 1.0 ±0.1