42P3U Search Results

Contextual Info: 42P3U-E Plastic 42pin 300mil TSOP EIAJ Package Code TSOPII 42-P-300-0.65 Weight(g) 0.29 JEDEC Code – Lead Material Alloy 42 e b2 I2 F ME 22 E Recommended Mount Pad Symbol 21 1 A D L c L1 HE 42 e b y A2 Detail F A1 A A1 A2 b c D E e HE L L1 y ME I2 b2

Contextual Info: 42P3U-F Plastic 42pin 300mil TSOP II EIAJ Package Code TSOPII 42-P-300-0.65 JEDEC Code – Weight(g) 0.29 Lead Material Alloy 42 e b2 E ME 21 1 Recommended Mount Pad Symbol 22 42 A D L c L1 HE I2 F e b y A2 A1 Detail F A A1 A2 b c D E e HE L L1 y ME I2 b2

432W6

Abstract: 48P4B hssop 44P3W-R 28P0 5P5T tsop 2-54 42P9R 70P3S-M 479F7G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES LIST OF PACKAGE CODES CLASSIFIED ACCORDING TO PIN NUMBER 1. LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PIN NUMBER Pin Count Structure Type Lead Pitch mm 5 P P P P P P C C P P P C P P P P P P P P C P P P P P P P

TIC42

Abstract: 40P0K M5M411664AJ M4116 m5m411664
Contextual Info: MITSUBISHI LSIs M 5 M 4 1 1 6 6 4 A J ,T P 1 -5 ,-6 ,-7 ,-5 S ,-6 S ,-7 S FAST PAGE MODE 1048576-BIT 65536-WORD BY 16-BIT DYNAMIC RAM DESCRIPTION This is a family of 65536-word by 16-bit dynamic RAMs, fabricated with a high perform ance C M O S process, and is ideal for

Contextual Info: M ITSU B ISH I LSlS M 5 M 4 1 8 1 2 8 A J -5 ,-6 ,-7 ,-5 S ,-6 S ,-7 S FAST PAGE M O DE 1048576-B IT 131Û 72-W O RD BY 8-B IT DYN A M IC RAM DESCRIPTION This is a family of 131072-word by 8-bit dynamic RAMs, fabricated w ith a high perform ance CMOS process, and is ideal for

sram 3.3 16bit

Contextual Info: MITSUBISHI LSIs M5M4V4169TP-15,-20 4M 256K-WORD BY 16-BIT CACHED DRAM WITH 16K(1024-WORD BY 16-BIT)SRAM DESCRIPTION The M5M4V4169TP is a 4 M - b it Cached DRAM which integrates input registers, a 262, 1 4 4 - word by 1 6 - bit dynamic memory array and a 1 0 2 4 -word by 1 6 - bit static

M5M411664

Abstract: M5M411664AJ M5M411664ATP1 M5M411664A-6 M5M411664A-5 M5M411664A-7 ATP1
Contextual Info: MITSUBISHI LSIs Preliminary Spec. M5M411664AJ/ATP1-5,-6,-7,-5S,-6S,-7S Rev. 1.4 FAST PAGE MODE 1,048,576-BIT(65,536-WORD BY 16-BIT) DYNAMIC RAM DESCRIPTION FEATURES CAS Address OE access access access time time time (max.ns) (max.ns) (max.ns) Cycle Power

48P4B

Abstract: P/N146071 hssop 432W6 70P3S-M 10C2-C 136P6S-C 20P5A
Contextual Info: 3. DETAILED DIAGRAM OF PACKAGE OUTLINES LIST OF PACKAGE CODES CLASSIFIED ACCORIDING TO PACKAGE TYPE Pin Count Structure 5 8 8 10 12 9 12 12 14 16 20 24 8 14 16 18 18 20 20 22 22 24 24 24 24 28 28 28 30 32 32 32 40 42 20 28 30 32 36 40 42 48 52 64 P P P P P

Contextual Info: MITSUBISHI LSIs M5M411664J,TP,RT-6,-8,-6S,-8S FAST PAGE MODE 1 0 4 8 5 7 6 -B IT 6 5 5 3 6 -W 0 R D BY 16-B IT D Y N A M IC RAM DESCRIPTION PIN CONFIGURATION (TOP VIEW) T h is is a fa m ily o f 6 5 5 3 6 - w o r d b y 1 6 - b i t d y n a m ic R A M s , fa b ric a te d w ith th e h ig h p e rfo rm a n c e C M O S p ro c e s s , an d

8 BIT ALU IC

Contextual Info: MITSUBISHI LSIs M 5 M 4 1 0 0 9 2 A F P ,R F -1 0 ,-1 3 3D-RAM 10485760-BIT 327680-WQRD BY 32-BIT FRAME BUFFER MEMORY DESCRIPTION • Second-generation, 0.5 The M 5M 410092A FP.R F is a 10M-bit frame buffer memory which • 128-pin, plastic QFP integrates a 327680-word by 32-bit dynamic RAM array, 2048-bit

M5M411665AJ

Abstract: m5m411665atp3 M5M411664AJ m5M418128 M5M411664AJ7 M5M4116
Contextual Info: MEMORIES BUFFER M E M O R IE S • 1M BUFFER MEMORIES Memory capacity . Mwinory ■ Configuration Function mod« Mçx. Typ. accsss power time dwsipation mW <*} Fast Page 1CAS/2W 50 625 60 550 70 475 50 Fast Page 1CAS/2W 60 Self-Refresh mode Low Power

M5M411664

Abstract: M5M411664J 411664 M5M4116
Contextual Info: MITSUBISHI LSIs M5M411664J,TP,RT-6,-8,-6S,-8S FAST PAGE MODE 1 0 4 8 5 7 6 -B IT 6 5 5 3 6 -W 0 R D BY 16-B IT D YN A M IC RAM D E S C R IP T IO N PIN C O N F IG U R A T IO N (TOP VIEW ) This is a fam ily o f 6 5 5 3 6 -w o rd by 16 -b it dynam ic RAMs, fabricated w ith the high perform ance CMOS process, and

10C2

Abstract: 144PFB-A 48P4B 16P2S-A 240mil hssop Package tray dimension 12P9 16P2Z-A 18P4G
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.1 INDIVIDUAL PACKS Each type of package is used to carry individually packed products as listed below: PACKAGE AND INDIVIDUAL PACK LIST Package Type SIP HSIP ZIP DIP SDIP Package Name Standard Dimension

324pc

Abstract: L198 L-088 930PC 12P9B 300mil trays 4028PC L199 SP080 pt881
Contextual Info: MITSUBISHI INTEGRATED CIRCUIT PACKAGES PACKAGE SPECIFICATIONS 3.2 PACKAGE AND CARTON SERIAL NUMBER AND STANDARD CAPACITY TUBES STANDARD PACKAGING 240mil Individual Pack Qty/Individual Tube No. Pack ( ) 45 SP050PC 340mil SP070PC Package Type Package Name Standard Dimension

m5m411664

Contextual Info: MITSUBISHI MEMORY/ ASI C blE D • b S MT A E i 0018423 1T2 ■ M I T I MITSUBISHI LSIs M5M411664J,TP,RT-6,-7,-8,-6S,-7S,-8S _ FAST PAGE MODE 1.045.576-BIT(65,536-WQRD BY 16-BIT) DYNAMIC RAM DESCRIPTION This is a family of 65536-word by 16-bit dynamic RAMS, fabricated with the high performance CMOS process, and is