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    Microchip Technology Inc MCP6042-E/P

    The MCP6042-E/P is a dual operational amplifier featuring low-power consumption and rail-to-rail input/output for extended temperature range applications.
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    Master Electronics MCP6042-E/P 840
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    RS MCP6042-E/P Bulk 52 Weeks 420
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    Microchip Technology Inc MCP6042-E/P Tube 1,340 5 Weeks
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    Avnet Silica MCP6042-E/P 7 Weeks 60
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    Microchip Technology Inc PIC18F46K42-E/PT

    8-bit PIC MCU 64 KB 4096 Bytes 64 MHz 1.8 to 5.5V TQFP-44 RoHS
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    Master Electronics PIC18F46K42-E/PT 320
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    Microchip Technology Inc PIC18F47K42-E/P

    128KB 2.3V~5.5V PIC 8KB 64MHz FLASH 36 PDIP-40 Microcontroller Units (MCUs/MPUs/SOCs) ROHS
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    Master Electronics PIC18F47K42-E/P 210
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    Microchip Technology Inc PIC18F47K42-E/P Tube 416 5 Weeks
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    Microchip Technology Inc PIC18LF46K42-E/P

    Microcontroller - PIC XLP 18K - 8-Bit - 64MHz - 36 I/O - 64KB (64K x 8) FLASH - 1K x 8 EEPROM - 4K x 8 RAM - 1.8 to 3.6V - 40-PDIP.
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    Bourns Inc CR0603-FX-3742EPF

    Res 0603 37K4 1% 100MW TC100 Low Lead
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    Master Electronics CR0603-FX-3742EPF
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    Avnet Americas CR0603-FX-3742EPF Tape & Reel 12 Weeks 25,000
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    42EP Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    13EP

    Abstract: AF 1507 25C10 2C10 led 12v 5050 hours lead acid battery SoC measurement circuitry dbbp 08C10 12V 26AH genesis enersys
    Contextual Info: APPLICATION MANUAL SIXTH EDITION Genesis Purelead XE and EP Publication No: EN-GPL-AM-002 - July 2005 Genesis XE & EP Application Manual TABLE OF CONTENTS Preface to the Sixth Edition This edition of the Genesis® application manual has been necessitated by several factors.


    Original
    en-gpl-am-00213epaf 150725c10+72c10led 12v 5050 hourslead acid battery soc measurement circuitrydbbp08c1012v 26ahgenesis enersys PDF

    13-AH

    Contextual Info: SELECTION GUIDE FIFTH EDITION Publication No: US-GPL-SG-002 - July 2006 GENESIS Selection Guide EnerSys is the world’s largest industrial battery manufacturer with manufacturing and assembly plants located around the world, over 7,000 employees, and a worldwide sales and distribution network.


    Original
    us-gpl-sg-002g70epx13-ah PDF

    "leadframe material" DIP

    Abstract: "leadframe material" DIP 20 K 1357 C1995 leadframe materials an-469 national
    Contextual Info: National Semiconductor Application Note 469 R James Walker October 1986 ABSTRACT New space efficient packages for integrated circuits have been developed These include the Plastic Chip Carrier P C C and Small Outline (S O ) packages Design considerations and reliability tests for the S O package were compared to the standard plastic Dual-in-Line Package (DIP)


    Original
    leadframe material" dipleadframe material" dip 20k 1357c1995+2leadframe materialsan-469 national PDF