40 PIN DIP Search Results

HV500PJ

Abstract: SN55500
Contextual Info: ^ S u p e r te x ine . HV500 32-Channel AC Plasma Display Driver Ordering Information_ Package Options Device 40-Pin Ceramic DIP 40-Pin Plastic DIP 44-Pin J-Lead Ceramic Chip Carrier 44-Pin J-Lead Plastic Chip Carrier Die 40-Pin

HV501PJ

Abstract: HV501 SN55501
Contextual Info: ^ Supertex inc. HV501 32-Channel AC Plasma Display Driver Ordering Information_ Package Options Device 40-Pin Ceramic DIP 40-Pln Plastic DIP 44-Pin J-Lead Ceramic Chip Carrier 44-Pin J-Lead Plastic Chip Carrier Die 40-Pin Ceramic Dip

48-PIN

Abstract: A10C A12C A15C LH532000B
Contextual Info: LH532000B FEATURES CMOS 2M 256K x 8/128K x 16 M ask-Program m able ROM PIN CONNECTIONS • 262,144 words x 8 bit organization (Byte mode) 131,072 words x 16 bit organization (Word mode) 40-PIN DIP 40-PIN SOP TOP VI EW f 1• \ 40 ZI Ag a 7C 2 39 U Ag AgiZ

ic driver mosfet 8 pin 4413

Contextual Info: IXBD4410 IXBD4411 ISOSMARTTM Half Bridge Driver Chipset Type Description IXBD4410PI IXBD4411PI Full-Feature Low-Side Driver 16-Pin P-DIP Full-Feature High-Side Driver 16-Pin P-DIP -40 to +85°C -40 to +85°C IXBD4410SI IXBD4411SI Full-Feature Low-Side Driver 16-Pin SO

MOTOR DRIVER IC LM 2003

Abstract: 3 phase Ac to dc inverter welding schematic diagram
Contextual Info: IXBD4410 IXBD4411 ISOSMARTTM Half Bridge Driver Chipset Type Description IXBD4410PI IXBD4411PI Full-Feature Low-Side Driver 16-Pin P-DIP Full-Feature High-Side Driver 16-Pin P-DIP -40 to +85°C -40 to +85°C IXBD4410SI IXBD4411SI Full-Feature Low-Side Driver 16-Pin SO

schematic diagram welding inverter control

Abstract: schematic diagram UPS inverter three phase bi-directional switches IGBT driver LG direct drive motor schematic diagram for welding inverter IXBD4410 gate drive pulse transformer IGBT/MOSFET Gate Drive IXBD 4413 IXDP630 application note
Contextual Info: IXBD4410 IXBD4411 ISOSMARTTM Half Bridge Driver Chipset Type Description IXBD4410PI IXBD4411PI Full-Feature Low-Side Driver 16-Pin P-DIP Full-Feature High-Side Driver 16-Pin P-DIP -40 to +85°C -40 to +85°C IXBD4410SI IXBD4411SI Full-Feature Low-Side Driver 16-Pin SO

L9490

Contextual Info: H V500 P re lim in a ry 32-Channel AC Plasma Display Driver Ordering Package Options Device H V500 40-Pin Ceramic DIP 44-Pin J-Lead Ceramic Chip Carrier 40-Pin Plastic DIP H V 50 0 D H V 50 0 P H V 500D J

MT8985ap

Abstract: DIP-40 MT8972 MT8980 MT8980D MT8985 MT8985AE MT8985AL PLCC-44 QFP-44
Contextual Info: CMOS ST-BUS FAMILY MT8985 Enhanced Digital Switch  Features • • • • • • • • • ISSUE 5 Ordering Information MT8985AE 40 Pin Plastic DIP MT8985AP 44 Pin PLCC MT8985AL 44 Pin QFP -40°C to +85°C 256 x 256 channel non-blocking switch Programmable frame integrity for wideband

LH534

Abstract: 48-PIN A10C A15C A17C
Contextual Info: LH 534P00A FEATURES CMOS 4M 512K x 8/256K x 16 M ask-Program m able ROM PIN CONNECTIONS • 524,288 words x 8 bit organization (Byte mode) 40-PIN DIP 40-PIN SOP TOP VIEW f- . 262,144 words x 16 bit organization (Word mode) A i7C 1• a 7[= 2 • Access time: 120 ns (MAX.)

44-PIN

Abstract: LH532048 QFJ044-P-0650
Contextual Info: LH532048 • Access time: 100 ns MAX. 40-PIN DIP 40-PIN SOP TOP VIEW • Static operation NC 1 40 VCC CE 2 39 NC • TTL compatible I/O D15 3 38 A16 4 • Three-state outputs D14 37 A15 D13 5 36 A14 • Single +5 V power supply D12 6 35 A13 D11 7 34 A12

Contextual Info: SHRINK DUAL IN-LINE PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 40 PIN PLASTIC To Top / Package Lineup / Package Index DIP-40P-M03 EIAJ code :∗SDIP040-P-0600-1 40-pin plastic SH-DIP Lead pitch 70 mil Row spacing 600 mil Sealing method Plastic mold DIP-40P-M03

Contextual Info: ISOSMART Half Bridge Driver Chipsets Type Description Package IXBD4410PI IXBD4411 PI Full-Feature Low-Side Driver Full-Feature High-Side Driver 16-Pin P-DIP 16-Pin P-DIP -40 to +85°C -40 to +85°C • IXBD441 OSI IXBD4411SI Full-Feature Low-Side Driver

MAX497

Abstract: MAX4456 MAX4456CPL MAX4456CQH MAX4456EPL MAX4456EQH MAX456
Contextual Info: 19-1389; Rev 0; 10/98 Low-Cost, 8x8 Video Crosspoint Switch Ordering Information PART TEMP. RANGE PIN-PACKAGE MAX4456CPL MAX4456CQH MAX4456EPL MAX4456EQH 0°C to +70°C 0°C to +70°C -40°C to +85°C -40°C to +85°C 40 Plastic DIP 44 PLCC 40 Plastic DIP

PC 8591

Abstract: HI-8591PST-40 AN-300 HI-8591 HI-8591PSI HI-8591PSI-40 HI-8591PSM HI-8591PSM-40 HI-8591PST HI-8591-40
Contextual Info: HI-8591 ARINC 429 LINE RECEIVER August 2006 DESCRIPTION PIN CONFIGURATIONS VCC - 1 TESTA - 2 7 - ROUTB RINB - 3 6 - ROUTA RINA - 4 5 - GND HI-8591PSI, HI-8591PST & HI-8591PSM HI-8591PSI-40, HI-8591PST-40 & HI-8591PSM-40 NC VCC TESTB NC 8 - PIN PLASTIC NARROW BODY SOIC

8591p

Abstract: ARINC
Contextual Info: HI-8591 ARINC 429 LINE RECEIVER July 2006 DESCRIPTION PIN CONFIGURATIONS VCC - 1 TESTA - 2 7 - ROUTB RINB - 3 6 - ROUTA RINA - 4 5 - GND HI-8591PSI, HI-8591PST & HI-8591PSM HI-8591PSI-40, HI-8591PST-40 & HI-8591PSM-40 NC VCC TESTB NC 8 - PIN PLASTIC NARROW BODY SOIC

48-PIN

Abstract: A12C A15C LH532000B-1
Contextual Info: LH532000B-1 FEATURES CMOS 2M 256K x 8/128K x 16 M a sk-P ro g ra m m a b le ROM PIN CONNECTIONS • 262,144 words x 8 bit organization (Byte mode) 131,072 words x 16 bit organization (Word mode) 40-PIN DIP 40-PIN SOP TOP VIEW f . 1• 2 a 7[= O E i/Ô Ë ^D C C

4916

Contextual Info: VVA1, VVA2, VVA3 Full Size VCXO Package Option A1 = 0.8” x 0.5” x 0.2” 14 pin DIP A2 = 0.8” x 0.5” x 0.2” 14 pin Gull Leaded Surface Mount A3 = 0.8” x 0.5” x 0.4” 14 pin DIP Frequency Range 1.0 to 40 MHz Fundamental <80ps/pk-pk Jitter 40 to 160 MHz uses a low jitter internal multiplier

10BASET2

Abstract: T-14012 T-13001 T-13000 13000 T-14014 14010 T-14028 14800 10 BASE-T Transformers
Contextual Info: 10 BASE-T Transformers 16 Pin 50 mil Package See pg. 40, fig. 7 High Isolation 2000Vrms 16 Pin 100 mil DIP/SMD Packages Add G or J to P/N for SMD See pg. 40, fig. 4, 5 & 6 D Fast Rise Times Meets ECMA Requirements IEEE 802.3 Compatible (10BASE 2, 10BASE 5, & 10BASE T)

Contextual Info: Product Number: 802-40-048-10-004000 Description: Interconnect Header .100 Grid; Straight Pin Header .040 Pin Head with Solder Tail Double Row Through Hole Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part

Contextual Info: Product Number: 450-40-212-00-001000 Description: Interconnect Header .100 Grid; Straight Pin Header .025 Pin Head with Solder Tail Double Row Through Hole Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part

Contextual Info: Product Number: 350-40-101-00-001000 Description: Interconnect Header .100 Grid; Straight Pin Header .025 Pin Head with Solder Tail Single Row Through Hole Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part

Contextual Info: Product Number: 450-40-240-00-001000 Description: Interconnect Header .100 Grid; Straight Pin Header .025 Pin Head with Solder Tail Double Row Through Hole Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part

Contextual Info: Product Number: 350-40-139-00-001000 Description: Interconnect Header .100 Grid; Straight Pin Header .025 Pin Head with Solder Tail Single Row Through Hole Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part

Contextual Info: Product Number: 350-40-102-00-001000 Description: Interconnect Header .100 Grid; Straight Pin Header .025 Pin Head with Solder Tail Single Row Through Hole Plating Code: 40 Shell Plating: 200 µ" Tin matte finish over 100 µ" Nickel # Of Pins Mill-Max Part