4-40 KAPTON WASHER Search Results

Contextual Info: B B 1. 2. 3. 4. 5. 6. 7. Unless otherwise noted, all dim ensions are in inches. Film Material: .002 th ick Kapton MT Dielectric strength — 5200 VAC/m il Interface Material: .0005 th ick phase—change therm al com pound, both sides. Maximum shipping & storage tem perature — 40‘ C

concord ca 2100

Abstract: fagor 2201 HS01U 104 csk 3554M TFT250-18 FAGOR f 948 Concord Electronics MS04/CAGE
Contextual Info: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex thermal washers are also available from Power Devices. “Thermstrate” is the material trade name for these

FAGOR f 948

Abstract: SIP12 package pacifitek 56597
Contextual Info: H E A T S IN K S , M A T IN G S O C K E T S , W A S H E R S , V E N D O R S ACCESSORIES INFORMATION A P É X H T T P ://W W W .A P E X M IC R O T E C H .C O M M I C R O T E C H N O L O G Y 800 5 46-A PE X RECOMMENDATIONS FOR THERMALLY Apex therm al washers are also available from Power De­

211-HSG-D09-SR

Abstract: 212-PINFHD-26
Contextual Info: Company Profile DE: UK: F: Info@allectra.com uk@allectra.com fr@allectra.com Allectra – Mechanical, Electrical and Optical Components for UHV and High Vacuum COMPANY HISTORY Allectra GmbH was founded in 2002 in Berlin. Within the first year, the range of Sub-D Feedthroughs and associated

IXAN0028

Abstract: IXFX55N50 26N50 ISOPLUS247 IXFR150N10 IXFR170N10 IXFX180N10 PLUS247
Contextual Info: Technical Application The Revolution in Discrete Isolation Technique IXAN0028 by Martin Arnold, Product Marketing, IXYS Semiconductor GmbH & Ralph Locher, Application Engineering, IXYS Corporation Introduction When using power semiconductors, there is usually the need to electrically isolate the devices from the heatsink, which

IXFR170N10

Abstract: SIL-PAD to-247 IXFX55N50 SIL-PAD PLUS247 26N50 ISOPLUS247 IXFR150N10 IXFR55N50 IXFX180N10
Contextual Info: Technical Application The Revolution in Discrete Isolation Technique by Martin Arnold, Product Marketing, IXYS Semiconductor GmbH & Ralph Locher, Application Engineering, IXYS Corporation Introduction When using power semiconductors, there is usually the need to electrically isolate the devices from the heatsink, which

IXAN0025

Abstract: diode kv 1236 SIL-PAD 1000 TO 247 SIL-PAD to-247 IXFR170N10 DC to 3Phase converter SIL-PAD 26N50 CS 112 thyristor IXFX180N10
Contextual Info: ISOPLUSTM - The Revolution in Discrete Isolation Technique Technical Application IXAN0025 Introduction When using power semiconductors, there is usually the need to electrically isolate the devices from the heatsink, which could also be the equipment chassis. The three main reasons for this are: a safety; b) the desire to reduce

Contextual Info: Honeywell Pressure Switches High Pressure: HP Series, HE Series Factory set 150 psi to 4500 psi [10,34 bar to 310,26 bar] Low Pressure: LP Series, LE Series Factory set or field adjustable 3.5 psi to 150 psi [0,24 bar to 10,34 bar] Datasheet Honeywell Pressure Switches

SG-BGA-6134

Abstract: 613-4
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Minimum real estate required Compression plate distributes forces evenly 15.225mm Ball guide prevents over compression of elastomer

D 6124

Abstract: SG-BGA-6124 DASF0094 676mm
Contextual Info: GHz BGA Socket - Direct mount, solderless Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable Elastomer connection Top View Minimum real estate required Compression plate distributes forces evenly 24.23mm Ball guide prevents over compression of elastomer

Heatsinks

Abstract: b14-16 smd 123 25 34 SMD 4 DIL E 6 pin smd ic smd 83 51 a SMD IC smd E6 ART 230
Contextual Info: Hola1 H A H Heatsinks for DIL-IC, PLCC and SMD Heatsinks for DIL-IC B C art. no. ICK 6 8 L ICK 14 16 L ICK 20 L D for housings [mm] Rth [K/W] 6/8 contacts 14/16 contacts 20 contacts 8.5 19.0 25.0 83 46 34 for housings [mm] Rth [K/W] E art. no. ICK ICK ICK

kapton

Abstract: KA136
Contextual Info: B 4 3X .003 See Notes 2 & 3. B NOTES: 1. 2. 3. Unless otherwise noted, all dim ensions are in inches. Film Material: .002 th ick Kapton MT Dielectric strength — 5200 VAC/m il Interface Material: .0005 th ick phase—change therm al com pound, both sides.

RF Florida 82-1003TC

Abstract: dupont connector 2.54mm flange resistors florida rf 32-1123 SMR r020 82-1030TC MIL-R-11804 semi catalog 82-1003-TC 82-1032TC
Contextual Info: TABLE OF CONTENTS Resistors NEW NEW NEW NEW Page Aluminum Nitride Flange Resistors . 1 High Power Stud Mounted Resistors . 4

thermal conductive teflon

Contextual Info: Hola1 H A H Insulating caps and insolater sleeves Insulating caps different transistor flange levels will be compensated by the impressed sleeves B art. no. C IK 341 3 art. no. D IK 3 material pressed-in sleeves flammability polyamide, GF reinforced caps

ic marking hs01

Abstract: 1702M apex pa26 fagor f 948
Contextual Info: HEATSINKS, MATING SO C K E T S, W A SH ERS, VENDORS ACCESSORIES INFORMATION HTTP://W WW .APEXMICROTECH.COM 800 RECOMMENDATIONS FOR THERMALLY Apex thermal w ashers are also available from Power De­ vices. “Therm strate" is the material trade name for these

Contextual Info: PCB DRILLING DETAILS TECHNICAL SPECIFICATIONS MATERIAL ORDERING INFORMATION SHELL : INSULATORS : STEEL TIN/Zinc Cr 3 PLATED. SELF EXTINGUISHING BLACK POLYESTER UL CLASS 94V0 I D 2 5 S 3 3 E 4 G X 2 8 L F THE HOUSING WILL WITHSTAND EXPOSURE TO 260-265°C IF WE USE PROTECTIVE ADHESIVE type Kapton or Teflon

1-800-546-APEX

Abstract: Alpha Industries pin diodes TFT250-18 tw03 apex 0/72555
Contextual Info: HEATSINKS, MATING SOCKETS, WASHERS, VENDORS ACCESSORIES INFORMATION M I C R O T E C H N O L O G Y HTTP://WWW.APEXMICROTECH.COM 800 546-APEX (800) 546-2739 RECOMMENDATIONS FOR THERMALLY CONDUCTIVE WASHERS Apex TW03, TW05, and TW10 (which are available from

Contextual Info: : SELF EXTINGUISHING BLACK POLYESTER UL CLASS 94V0 STEEL TIN/Zinc Cr 3 PLATED. TECHNICAL SPECIFICATIONS : MATERIAL SHELL THE HOUSING WILL WITHSTAND EXPOSURE TO 260-265°C IF WE USE PROTECTIVE ADHESIVE type Kapton or Teflon OR PROTECTIVE METALLIC DEVICE COPPER ALLOY

Contextual Info: PCB DRILLING DETAILS TECHNICAL SPECIFICATIONS MATERIAL ORDERING INFORMATION SHELL : INSULATORS : STEEL TIN/Zinc Cr 3 PLATED. SELF EXTINGUISHING BLACK POLYESTER UL CLASS 94V0 I D 2 5 S 3 3 E 4 G X 2 8 L F THE HOUSING WILL WITHSTAND EXPOSURE TO 260-265°C IF WE USE PROTECTIVE ADHESIVE type Kapton or Teflon

Contextual Info: : SELF EXTINGUISHING BLACK POLYESTER UL CLASS 94V0 STEEL TIN/Zinc Cr 3 PLATED. TECHNICAL SPECIFICATIONS : MATERIAL SHELL THE HOUSING WILL WITHSTAND EXPOSURE TO 260-265°C IF WE USE PROTECTIVE ADHESIVE type Kapton or Teflon OR PROTECTIVE METALLIC DEVICE COPPER ALLOY

EK19

Abstract: HS20 HS27 PA95
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EK19

Abstract: HS20 HS27 PA94
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PA240CX

Abstract: CLR91 EK34 HS27 HS28 MS11 SA60
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QFN40

Abstract: DG-QFN40C-01
Contextual Info: GHz MLF Socket - Direct mount, solderless Top View Features Directly mounts to target PCB needs tooling holes with hardware. High speed, reliable connection Minimum real estate required Compression plate distributes forces evenly IC guide prevents over compression of elastomer