3DFN Search Results

MCP25050

Abstract: 6N6 datasheet A444 DATASHEET B34 MCP25055 K2375
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W538

Contextual Info:  MCP809/810 0LFURFRQWUROOHU 6XSHUYLVRU\ &LUFXLW ZLWK 3XVK3XOO 2XWSXW HDWXUHV 3DFNDJHV ‡ +ROGV PLFURFRQWUROOHU LQ UHVHW XQWLO VXSSO\ YROWDJH UHDFKHV VWDEOH RSHUDWLQJ OHYHO ‡ 5HVHWV PLFURFRQWUROOHU GXULQJ SRZHU ORVV ‡ 3UHFLVLRQ PRQLWRULQJ RI 9 9 DQG 9 V\VWHPV

Contextual Info: MEMORY MODULE NAND Flash 512Gb 3DFN512G08VB2453 NAND Flash Memory 512Gbit Synchronous NAND Flash Pin Assignment Top View BGA 100 Features - Open NAND Flash interface 2.1 compliant - Single Level Cell (SLC) technology - Organization (per basic component):

3DFN128G08VB2352

Contextual Info: MEMORY MODULE FLASH Nand 128Gb Flash Nand Memory MODULE 3DFN128G08VB2352 128Gbit Flash Nand with 8 bit-data access Pin Assignment Top View LGA 52 Features - Open NAND Flash interface 2.2 compliant - Multilevel Cell Technology (MLC) - Device width: x8 - Operating voltage range

Contextual Info: MEMORY MODULE FLASH Nand 1Gx8-SOP Flash Memory MODULE 3DFN4G08VS1636 8Gbit Flash Nand organized as 1Gx8, based on 512Mx8 Pin Assignment Top View SOP 50 (Pitch : 0.50 mm) – Package D1 Features - Organization -Memory Cell Array (512M+16.384KM)bitx8. - Automatic Program and Erase

Contextual Info: MEMORY MODULE FLASH Nand 256Gb Flash Nand Memory MODULE 3DFN256G08VB2406 256Gbit Flash Nand with 8 bit-data access Pin Assignment Top View LGA 52 Features - Open NAND Flash interface 2.1 compliant - Single Level Cell (SLC) technology - Device width : x8

3d plus memory

Contextual Info: MEMORY MODULE NAND Flash 64Gb 3DFN64G08VB1454 NAND Flash Memory 64Gbit Synchronous NAND Flash Pin Assignment Top View BGA 100 Features - Open NAND Flash interface 2.2 compliant - Multi Level Cell (MLC) technology - Organization: Page size x8: 8640 bytes

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DW97

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PG-TO-252-3-21

Abstract: PG-TO-252-3-11
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8363s

Abstract: 0d313
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Contextual Info: SCHURTER AG CH-6002 Luzern www.schurter.com PRODUCT CONTENT SHEET UMBRELLA SPECIFICATION Surface Mount Fuse SMD-SPT 5x20 SCHURTER part numbers 0001.2704 – 0001.2716 'DWH 9HUVLRQ 6XUIDFH 0RXQW XVH 6HH EHORZ 6HH EHORZ &RPSRVLWLRQ SDUW 0DWHULDO JURXS 3DFNDJH IDPLO\

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Contextual Info: TECHNOLOGY BACKGROUND &KLS6FDOH 3DFNDJLQJ IRU $0' ODVK 0HPRU\ 3URGXFWV 2 Chip-Scale Packaging Technology Background The AMD Fine-pitch Ball Grid Array FBGA) The FBGA package offers system designers a chip-scale package for Flash memories that provides a significant reduction in board real estate over TSOP packages and provides many

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