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Catalog Datasheet	Type	Document Tags	PDF
LP6872 Abstract: MIL-HDBK-263 Contextual Info: LP6872 0.5W POWER PHEMT • DRAIN BOND PAD 2X FEATURES ♦ 27 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency SOURCE BOND PAD (2x) GATE BOND PAD (2X) • DIE SIZE: 14.6X19.7 mils (370x500 µm)	Original	lp6872 370x500 50x60 mil-hdbk-263	PDF

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LP6872

Abstract: MIL-HDBK-263
Contextual Info: LP6872 0.5W POWER PHEMT • DRAIN BOND PAD 2X FEATURES ♦ 27 dBm Output Power at 1-dB Compression at 18 GHz ♦ 9.5 dB Power Gain at 18 GHz ♦ 55% Power-Added Efficiency SOURCE BOND PAD (2x) GATE BOND PAD (2X) • DIE SIZE: 14.6X19.7 mils (370x500 µm)

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lp6872 370x500 50x60 mil-hdbk-263

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