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    3641B Price and Stock

    TDK Corporation

    TDK Corporation B43641B5687M50

    Cap Aluminum 680uF 450VDC 20% Snap-In Cylindrical Can Cardboard - Bulk (Alt: B43641B5687M050)
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    Avnet Americas B43641B5687M50 Bulk 28 Weeks 240
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    • 10000 $7.72
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    TDK Corporation B43641B9827M50

    Cap Aluminum 820uF 400VDC 20% Snap-In Cylindrical Can Cardboard - Bulk (Alt: B43641B9827M050)
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    Avnet Americas B43641B9827M50 Bulk 28 Weeks 240
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    TDK Corporation B43641B9397M50

    - Bulk (Alt: B43641B9397M050)
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    Avnet Americas B43641B9397M50 Bulk 28 Weeks 320
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    TDK Corporation B43641B9827M057

    - Boxed Product (Development Kits) (Alt: B43641B9827M057)
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    Avnet Americas B43641B9827M057 Box 240
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    TDK Corporation B43641B5227M50

    Aluminum Electrolytic Capacitor, 220 uF, 450 V, ? 20%, Snap-In - Bulk (Alt: B43641B5227M050)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas B43641B5227M50 Bulk 28 Weeks 520
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    Avnet Abacus B43641B5227M50 29 Weeks 520
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    3641B Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    C3641

    Contextual Info: DM5160 1 960H and 720H 1 channel NTSC/PAL Decoder 1 DAVICOM Semiconductor, Inc. DM5160 960H and 720H 1 channel NTSC/PAL Decoder 23431567741 Preliminary Version: DM5160-DS-P01 February 27, 2013 Preliminary Doc No: DM5160-DS-P01 February 27, 2013 1 DM5160 960H and 720H 1 channel NTSC/PAL Decoder


    Original     		dm5160dm5160-ds-p01c3641 PDF

    Nippon Car central Locking

    Abstract: AN466 68HC05P3 AN466 motorola 68HC05K1 diode ir 0406 04DL ED204 fa0592 AN-466
    Contextual Info: Order this document as AN465/D MOTOROLA SEM ICONDUCTOR APPLICATION NOTE AN465 Secure Remote Control using the 68HC05K1 and the 68HC05P3 Tony Breslin, CSIC MCU Applications, Motorola Ltd., East Kilbride, Scotland INTRODUCTION This application note shows how the 68HC05K1 and the 68HC05P3 can be used together to form a multi­


    OCR Scan     		an465/dan46568hc05k168hc05p3+8nippon car central lockingan466an466 motoroladiode ir 040604dled204fa0592an-466 PDF

    MicroLeadFrame Packages Pad Landing Recommendations

    Abstract: 3641B atmel Reflow soldering die paddle IPC-SM-782 atmel touch pattern MLF 6x6 amkor exposed pad
    Contextual Info: MicroLeadFrame Packages Pad Landing Recommendations 1. Introduction This application note provides PCB designers with a set of guidelines for successful board mounting of Atmel’s DataFlash memories housed in the MicroLeadFrame package. The MicroLeadFrame package MLF® is a near CSP plastic encapsulated


    Original     		3641bmicroleadframe packages pad landing recommendationsatmel reflow solderingdie paddle+4ipc-sm-782atmel touch patternmlf 6x6amkor exposed pad PDF