32-LEAD TQFP Search Results

SUMITOMO EME G600

Abstract: EME G600 Moisture Sensitivity Level Rating 8050P sumitomo lcd 1575P JESD46-C pc/SUMITOMO g600
Contextual Info: 32 & 64-Lead Quad Flat Pack QFP Package Transfer Product Change Notice PCN0809 (v1.0) September 12, 2008 Overview This notice describes the changes to the 32-Lead & 64-Lead Quad Flat Pack (QFP) Package for the ARINC 429, MIL-STD 1553, Discrete to Digital and LCD Display Driver family of devices.

TQ32

Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Contextual Info: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*

A48A

Abstract: A101 120-PIN 7x7x1.4 160-PIN plastic quad flat pack 10X10X1.4 tqfp 44
Contextual Info: Package Diagrams Thin Quad Flat Packs 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.0mm A32 51-85063-B 32-Lead Thin Plastic Quad Flatpack 7 x 7 x 1.4 mm A32.14 51-85088-*B 1 Package Diagrams 44-Lead Thin Plastic Quad Flat Pack A44 51-85064-B 44-Lead Thin Plastic Quad Flat Pack 10 x 10 x 1.0 mm A44SB

32-lead TQFP

Contextual Info: PACKAGE INFORMATION Micrel 32 LEAD TQFP DIE UP (T32-1) Rev. 01 Rev.: C 1 Amendment: 0 Issue Date: July, 1999

Contextual Info: MN101C77A, MN101C77C, MN101C77D Type MN101C77A MN101C77C MN101C77D under development ROM (x× 8-bit) 32 K 48 K 64 K RAM (×× 8-bit) 1.5 K Package LQFP064-P-1414 3K *Lead-free 6K *Lead-free LQFP064-P-1414 TQFP064-P-1010C *Lead-free LQFP064-P-1414 *Lead-free

MN101C77A

Contextual Info: MN101C77A, MN101C77C, MN101C77D Type MN101C77A MN101C77C MN101C77D under development ROM (x× 8-bit) 32 K 48 K 64 K RAM (×× 8-bit) 1.5 K Package LQFP064-P-1414 2K *Lead-free 6K *Lead-free LQFP064-P-1414 TQFP064-P-1010C *Lead-free LQFP064-P-1414 *Lead-free

Contextual Info: MN101C77A, MN101C77C, MN101C77D Type MN101C77A MN101C77C MN101C77D under development ROM (x× 8-bit) 32 K 48 K 64 K RAM (×× 8-bit) 1.5 K Package LQFP064-P-1414 2K *Lead-free 6K *Lead-free LQFP064-P-1414 TQFP064-P-1010C *Lead-free LQFP064-P-1414 *Lead-free

H321

Abstract: H32-1
Contextual Info: PACKAGE INFORMATION Micrel 32 LEAD EPAD-TQFP DIE UP (H32-1) Rev. 01 Rev.: A 1 Amendment: 0 Issue Date: February 2000

Contextual Info: Reportable Substances in Components Package Type : TQFP 32 Lead #: No 1 2 3 4 5 6 7 Rev A B C D Material Molding Compound Copper Alloy Frame Lead frame plating Silver Die Attach Epoxy Gold Wire External Lead Plating Silicon Die ECN 080105HC05 121010HC01 030411HC02

MS-026ABA

Abstract: 241-Pin
Contextual Info: 32-Lead Thin Plastic Quad Flat Package [TQFP] SU-32-2 a Dimensions shown in millimeters 0.75 0.60 0.45 1.20 MAX 9.00 BSC SQ 25 32 24 1 PIN 1 1.05 1.00 0.95 0.15 0.05 0.20 0.09 7° 3.5° 0° 0.08 MAX COPLANARITY SEATING PLANE VIEW A 7.00 BSC SQ TOP VIEW (PINS DOWN)

Contextual Info: MN101C97A, MN101C97D Type ROM x× 8-bit RAM (×× 8-bit) Package MN101C97A (under development) MN101C97D (under development) 32 K 64 K 1.0 K 1K TQFP048-P-0707B *Lead-free (under development), QFP044-P-1010F *Lead-free (under planning), QFN044-P-0606A *Lead-free (under planning)

Lu32

Abstract: MS-026
Contextual Info: LU Package 32-Lead Plastic TQFP 5mm x 5mm (Reference LTC DWG # 05-08-1735 Rev Ø) 5.15 – 5.25 7.00 BSC 3.50 REF 5.00 BSC 32 0.50 BSC 1 2 3 32 SEE NOTE: 4 1 2 3 3.50 REF 7.00 BSC 5.00 BSC 5.15 – 5.25 A A 0.22 – 0.30 PACKAGE OUTLINE SEE NOTE: 5 1.30 MIN

Contextual Info: MN101C54A , MN101C54C Type MN101C54A MN101C54C ROM x× 8-bit 32 K 48 K RAM (×× 8-bit) 2K 2K Package QFP084-P-1818E *Lead-free, LQFP080-P-1414A *Lead-free, TQFP080-P-1212D *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 4.5 V to 5.5 V, 20 MHz)

MN101C54C

Abstract: MN101C54A LQFP080-P-1414A QFP084-P-1818E P-51
Contextual Info: MN101C54A , MN101C54C Type MN101C54A MN101C54C ROM x× 8-bit 32 K 48 K RAM (×× 8-bit) 2K 2K Package QFP084-P-1818E *Lead-free, LQFP080-P-1414A *Lead-free, TQFP080-P-1212D *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 4.5 V to 5.5 V, 20 MHz)

MAX9420

Abstract: MAX9420EHJ MAX9421 MAX9421EHJ MAX9422 MAX9422EHJ MAX9423 MAX9423EHJ
Contextual Info: 19-2285; Rev 0; 1/02 Quad Differential LVECL-to-LVPECL Translators The MAX9420–MAX9423 are specified for operation from -40°C to +85°C, and are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead 5mm ✕ 5mm QFN packages. Applications Features

MAX9420

Abstract: MAX9420EHJ MAX9421 MAX9421EHJ MAX9422 MAX9422EHJ MAX9423 MAX9423EHJ QFN50
Contextual Info: 19-2285; Rev 0; 1/02 Quad Differential LVECL-to-LVPECL Translators The MAX9420–MAX9423 are specified for operation from -40°C to +85°C, and are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead 5mm ✕ 5mm QFN packages. Applications Features

Contextual Info: Reportable Substances in Components Package Type : Component Weight : TQFP-EPAD 7x7 mm Document No : Lead #: 32 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Leadframe Plating Silver Die Attach Epoxy Gold Wire External Lead Plating

Contextual Info: Reportable Substances in Components Package Type : Component Weight : TQFP-EPAD 7x7 mm Document No : Lead #: 32 Process Type : No 1 2 3 4 5 6 7 Material Molding Compound Copper Alloy Frame Spot Silver Plating Silver Die Attach Epoxy Gold Wire Solder Lead Plating

ADV0406

Abstract: TQFP 32 PACKAGE altera TQFP 32 PACKAGE MS-026 MS-026 TQFP
Contextual Info: CUSTOMER ADVISORY ADV0406 TQFP 32 PACKAGE TOP MOLD AND EJECTOR SIZE CHANGE Change Description: Due to assembly process improvements undertaken at our assembly supplier, slight dimensional changes are being made to the 32 lead thin quad flat pack TQFP packages. The dimension changes involve an increase of the top mold

MAX9400

Abstract: MAX9400EGJ MAX9400EHJ MAX9402 MAX9402EHJ MAX9403 MAX9405
Contextual Info: 19-2223; Rev 1; 1/02 Quad Differential LVECL/LVPECL Buffer/Receivers These devices operate with a supply voltage of VCC VEE = 2.375V to 5.5V, and are specified for operation from -40°C to +85°C. These devices are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead

Contextual Info: 19-2223; Rev 0; 10/01 Quad Differential LVECL/LVPECL Buffer/Receivers These devices operate with a supply voltage of VCC VEE = +2.375V to +5.5V, and are specified for operation from -40°C to +85°C. These devices are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead

MAX9402

Abstract: MAX9402EHJ MAX9403 MAX9405 MAX9400 MAX9400EGJ MAX9400EHJ
Contextual Info: 19-2223; Rev 1; 1/02 Quad Differential LVECL/LVPECL Buffer/Receivers These devices operate with a supply voltage of VCC VEE = 2.375V to 5.5V, and are specified for operation from -40°C to +85°C. These devices are offered in space-saving 32-pin 5mm ✕ 5mm TQFP and 32-lead

Contextual Info: MN101C78A Type MN101C78A under development ROM (x× 8-bit) 32 K RAM (×× 8-bit) Package 1.5 K TQFP048-P-0707B *Lead-free (under development), QFP044-P-1010F *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 3.0 V to 3.6 V, 10 MHz)

Contextual Info: MN101C78A Type MN101C78A under development ROM (x× 8-bit) 32 K RAM (×× 8-bit) Package 1.5 K TQFP048-P-0707B *Lead-free (under development), QFP044-P-1010F *Lead-free (under planning) Minimum Instruction Execution Time 0.1 µs (at 3.0 V to 3.6 V, 10 MHz)