32 PIN TEST SOCKET Search Results

3224P

Contextual Info: PA32-24-wP Z d Data Sheet 32 pin PLCC socket/24 pin DIP 0.3” or 0.6” plug Introduction Adapter Construction This data sheet describes several adapters. They are all similar in that they have 32 pin PLCC test sockets and 24 pin DIP plugs. They differ in the dimensions of the DIP plug and the wiring from

TSOP 48 socket

Contextual Info: SOCKETS/SOCKET TOOLS TESCO INTERNATIONAL ENPLAS TSOP Type I • ■ ■ ■ ■ Supports Intel Flash memory components 32, 40, and 48 pin TSOP PROM programming and test socket Ideal for automation/burn-in Zero insertion force Low profile ENPLAS’ open-top TSOP Type I series

WA200

Abstract: WA51-0644-1586-NOSKT IC51 ic51-1764-1505 IC51-1284-1433 IC51-0484-806 IC201-0804-014 KS1518 IC51-2404-1655-3 WA51-0564-680-NOSKT
Contextual Info: WINSLOW ADAPTICs Data Sheet – Test socket Breakout adapters Winslow Adaptics IC Test socket breakout adapters convert Test sockets to a male 0.1” PGA type footprint. From the list below select the socket package you require for your device, check IC dimensions are correct and locate adapter part number.

AXS102013

Contextual Info: Discontinued as of September 30, 2010 AXS1 ROUND PIN TYPE IC SOCKETS HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket

Contextual Info: AXS1 ROUND PIN TYPE IC SOCKETS HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket with round pin external contacts

Contextual Info: PA32QFN-32-1 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFN devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

Contextual Info: PA32QFN-32 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFN devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

3240E

Contextual Info: AXS2 µIC SOCKETS AXS2 µSOCKET SERIES IC SOCKET WITH HIGH RELIABILITY CONSTRUCTION OF CONTACT Compliance with RoHS Directive Tulip-style µ contact, in which all contacts are arrayed facing the contact surface of the IC lead. Contact design using ABAQUS

PA32Q1498

Abstract: 32QF1498
Contextual Info: PA32Q1498 Data Sheet 32 pin QFP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of many 32 pin QFP devices in their 32 pin DIP footprint. The adapter is made up of 3 sub-assemblies. They assemble via

Socket IC 24 pin

Contextual Info: Discontinued as of September 30, 2010 AXS2 µIC SOCKETS AXS2 µSOCKET SERIES IC SOCKET WITH HIGH RELIABILITY CONSTRUCTION OF CONTACT Compliance with RoHS Directive Tulip-style µ contact, in which all contacts are arrayed facing the contact surface of the IC

diode in 5401

Abstract: 268-5401-51-1102J 268-5401-J 284-1273 TEXTOOL 268-5401-50-1102J 5401 TEXTOOL 40 pin socket 268-5401-00-1102J textool socket
Contextual Info: OEM LCC Sockets 32, 68 & 84 Leads • Accepts JEDEC leadless ceramic chip carriers • Variety of lid options available only for 68 position • "U" lid for I.C.E. adaptor I/O cable exit • Heat Sink available for 68 position • Polarizing post on bottom of socket

28 pin ic base socket round pin type lead

Abstract: AXS100811 AXS101411 AXS101611 AXS101811 AXS102011 AXS102211 AXS102411 AXS102471 AXS102811
Contextual Info: AXS1 HIGH RELIABILITY IC SOCKET WITH ROUND PIN FEATURES 1. With advanced design method of the frame, stress transmission from the PC board is greatly reduced. 2. This is a high reliability IC socket with round pin external contacts constructed with 4 point internal

Contextual Info: PA28-32-20-Dx-QF Data Sheet 28 pin DIP 0.3” socket /32 pin QFP plug Adapter Dimensions Supported Device/Footprints The PA28-32-20-Dx-QF adapters accept 28 pin DIP devices and have a removable 32 pin QFP solder-down plug. This allows DIP devices, or emulators with DIP plugs, to be used during

Contextual Info: PCB CONNECTORS 446-PP-2NN-41-036101 Double row 2.54 mm, Solderless compliant press-fit, Mating pin Ø 0.47 mm SERIES 446 Socket connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 446-PP-2NN-41-036101 Double row 2.54 mm, Solderless compliant press-fit, Mating pin Ø 0.47 mm SERIES 446 Socket connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 414-PP-2NN-41-134101 Double row 2.54 mm, Surface mount perp. floating pin, Mating pin Ø 0.47 mm SERIES 414 Socket connectors SMD perpendicular mount TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O

Contextual Info: PCB CONNECTORS 801-PP-NNN-65-410101 Single row 2.54 mm, Solderless compliant press-fit, Mating pin 0.47mm SERIES 801 Socket connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

Contextual Info: PCB CONNECTORS 801-PP-NNN-30-480101 Single row 2.54 mm, Surface mount perp. floating pin, Mating pin Ø 0.76 mm SERIES 801 Socket connectors SMD perpendicular mount TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O

Contextual Info: PCB CONNECTORS 346-PP-1NN-41-036101 Single row 2.54 mm, Solderless compliant press-fit, Mating pin Ø 0.47 mm SERIES 346 Socket connectors, press-fit With compliant pin for solderless mount in PCB plated through holes. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR

PA32TS14-OT

Abstract: 32TS14
Contextual Info: PA32TS14-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS14-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket.

Contextual Info: PCB CONNECTORS 326-83-1NN-41-001101 Single row 2.54 mm, Wire-wrap, Mating pin Ø 0.47 mm SERIES 326 Socket connectors with wire-wrap terminations and connecting pin for board stacking. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability

Contextual Info: PCB CONNECTORS 414-PP-2NN-41-134101 Double row 2.54 mm, Surface mount perp. floating pin, Mating pin Ø 0.47 mm SERIES 414 Socket connectors SMD perpendicular mount TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability UL 94V-O

Contextual Info: PCB CONNECTORS 426-83-2NN-41-001101 Double row 2.54 mm, Wire-wrap, Mating pin Ø 0.47 mm SERIES 426 Socket connectors with wire-wrap terminations and connecting pin for board stacking. TECHNICAL SPECS.: Insulator Black glass filled polyester PCT-GF30-FR Flammability

60068-2-14Na

Abstract: 13x13 C17200 pin grid array ppm IEC, cyclic moisture resistance test 510-PP-NNN-XX-XXX101 17x17 bga thermal resistance
Contextual Info: PGA / BGA / PLCC GENERAL SPECIFICATIONS WWW.PRECIDIP.COM TEL +41 32 421 04 00 SALES@PRECIDIP.COM The values listed below are general specs applying for Preci-Dip PGA, BGA and PLCC sockets. Please see individual catalog page for additional and product specific technical data.