31MAR20DO Search Results

Contextual Info: 4 AMP 1 4 70-19 REV 31MAR2Û0Û 3 2 1 4 THIS DRAWING 15 U NPUBLISH ED. COPYRIGHT 3 BY TYCO ELECTRONICS CORPORATION. 1998 1 2 RELEA5ED FOR PUBLICATION R E V IS IO N S A LL RIGHTS RESERVED. DESCRIPTION DWN APVD SEE SHEET 1 1 MATERIAL; HOUSING: HIGH TEMPERATURE THERMO PLASTIC U L 9 4 V - 0

Contextual Info: 6 7 R ELEA SED FOR PUBLICATIO N TH IS DRAWING IS U N P U B LIS H E D . COPYRIGHT BY TYCO ELECTRONICS CORPORATION. 4 5 3 2 - LOC R E VIS IO N S D IS T FT 64 ALL RIGHTS R E S E R V E D . 1 /}. D D E S C R IP TIO N LTR N DWN DATE REV PER QG3C—0 1 0 4 —01

AMP01

Abstract: 2-641605-3
Contextual Info: 7 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. COPYRIGHT 6 4 5 3 2 - LOC BY TYCO ELECTRONICS CORPORATION. REV ISIO NS DIST AD 0 ALL RIGHTS RESERVED. AA 1 . R E C E P T A C L E A C C E P T S A . 0 0 8 - . 01 4 T H IC K LC. LEAD. 2. T U B E LOADED FOR AUTOMATIC IN SERTION.

94V circuit board

Contextual Info: 6 7 TH IS DRAWING IS U N P U B LIS H E D . COPYRIGHT R ELEA SED FOR PUBLICATIO N BY TYCO ELECTRONICS CORPORATION. 4 5 3 2 - REVISIONS FT 64 ALL RIGHTS R E S E R V E D . 1 D 052 TY C IR C U IT CAVITY N D E S C R IP TIO N LTR DWN DATE REV PER 0G3C—0104—01