315DB Search Results

lm 4066

Contextual Info: F LM 3 742-18DA Internally M atc h ed Power CìaAs I E i s ABSOLUTE MAXIMUM RATING Ambient Temperature Ta=25°C Item Symbol Condition Rating Unit Drain-Source Voltage Vd S 15 V Gate-Source Voltage vgs -5 V 83.3 w °c °c Total Power Dissipation pt Tc = 25°C

P-324-DB

Abstract: Cinch Connectors p306d s333db p324d S333D
Contextual Info: Cinch Connectors Page 1 of 3 Series 300 Multiple Density Solder Eyelet Deep Bracket Materials Insulation Material: Molded monoblock, general purpose phenolic, black UL94V-1 Contact Material: Plug: Brass Socket: Phosphor bronze Contact Plating: Cadmium Operating Temperature: Up to +105°C

P312D

Contextual Info: Jones DURA-CON Plugs/Sockets High Reliability Series All-Plastic 300 [.050” Multiple 1.27mm Density Density Solder Solder Cup/Wire Eyelet D-Microminiature] Deep Bracket 300 Series Deep Bracket (DB) 2 No. of Contacts 2 3 4 6 8 10 12 15 18 21 24 27 30

2 SB 1203

Contextual Info: Jones Plugs/Sockets Multiple Density Solder Eyelet Series 300 Features Electrical Characteristics • Solder lug terminals with .093" x .062" 2.36mm x 1.57mm wiring holes Withstanding Voltage: 730 VAC rms (@ sea level) • Two-contact “Jones" connector is round,

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

DB95

Contextual Info: 1 1111111111111 111111 1 1111111111111 1 1111111111111 1 1111111111111 1 1 A123456789AABCDCEFCAFBAAAAA A AAAAAAAA A AAAAAAAA A AAAAAAAA A AAAAAAAA A A CA5E 3CD1AEA89 F !"#$%A89A&' 5 *A'BA1EEA !"ACCDCB A(+63&,6A(&+A A

5-176-3 terminal block

Abstract: mini circuits 15542 MS14141 DIN 18541 8-32X3 s31512 mini 15542 P-306-CCE 5-140-Y E61245
Contextual Info: COMMERCIAL Barrier Blocks Circular Mini DIN BNC Jones Plugs Edge Connectors Commercial [.050” 1.27mm Density Solder Introduction Cup/Wire D-Microminiature] Cinch Commercial Products, consisting of Jones Plugs and Sockets, Barrier Blocks, Edge Cards, Two-Piece Commercial Dins,

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

LA 4445

Abstract: S-312-CCT
Contextual Info: Jones Plugs/Sockets Series 300 M ultiple Density Solder Eyelet Solder lug terminals with .093" x .062" 2.36mm x 1.57mm wiring holes. Two-contact "Jones" connector is round, all others are rectangular. For use in cable-to-panel and cable-to-cable applications.

mini circuits 15542

Abstract: chocolate vending machine 16161L mdc-8p13 25541 DIN 18541 MSX-10 302-RP 50-12SN-3 Cinch fanning strip 10-160b-r
Contextual Info: COMMERCIAL Barrier Blocks Circular Mini DIN BNC Jones Plugs Edge Connectors Commercial [.050” 1.27mm Density Solder Introduction Cup/Wire D-Microminiature] Cinch Commercial Products, consisting of Jones Plugs and Sockets, Barrier Blocks, Edge Cards, Two-Piece Commercial Dins,

Contextual Info: FLM7785-IHDA I n t e r n a l l y M a t c h e d P o w e r >a \ \ I l l s ABSOLUTE MAXIMUM RATING (Ambient Temperature Ta=25°C Hem Condition S ptibk Melliflui Unit Drain-Source Voltage Vd S 15 V Gate-Source Voltage VGS -5 V 83.3 w Total Power Dissipation

qualcomm chipsets

Contextual Info: RF3300-2 I MICRO •DEVICES T y p ic a l A p p lic a tio n s • 3V CDMA/AMPS Cellular Handsets Designed for Compatibility with Qualcomm • 3V CDMA2000/1X Cellular Handsets Chipsets • Spread-Spectrum Systems P ro d u c t D e s c rip tio n The RF3300-2 is a high-power, high-efficiency linear