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Catalog Datasheet	Type	Document Tags	PDF
SDC-W25XB-09-LF Abstract: SDC-W25XB-09 Contextual Info: 1.50±0.05 1.65 11.57 11.06 SPECIFICATION MATERIAL Insulator: Thermal Plastic U L 9 4 V -0 Contacts: Copper Alloy Boardlock: Copper Alloy CONTACT PLATING Underplated: 50rn Nickel Contact Area: 1rti~30rrV Selective Gold Solder Tails Area: 100rrf Tin/Lead Brighten Tin or	OCR Scan	UL94V-0 100rrT SDC-W25XB-09-LF SDC-W25XB-09 SDC-W25XB-09	PDF

Catalog Datasheet

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SDC-W25XB-09-LF

Abstract: SDC-W25XB-09
Contextual Info: 1.50±0.05 1.65 11.57 11.06 SPECIFICATION MATERIAL Insulator: Thermal Plastic U L 9 4 V -0 Contacts: Copper Alloy Boardlock: Copper Alloy CONTACT PLATING Underplated: 50rn Nickel Contact Area: 1rti~30rrV Selective Gold Solder Tails Area: 100rrf Tin/Lead Brighten Tin or

OCR Scan

UL94V-0 100rrT SDC-W25XB-09-LF SDC-W25XB-09 SDC-W25XB-09

PDF