30JUN Search Results

Contextual Info: TH I S DRAW I NG IS UNPUBLI S H E D . BY C O P Y R I G H T 20 RELEASED TYCO ELECTRONICS FOR ALL CORPORATION. REV ISIONS P U B L I C A T I ON R IGHTS RESERVED. LTR DESCRIPTION DATE DWN B2 EE R - 0 8 - 0 1 2 3 9 9 23MAYO0 B3 EE R - 0 9 - 0 1 4 7 8 4 30JUN09

HIPRO

Abstract: 109-5206 POWER hipro 12p connector
Contextual Info: Product Specification（製品規格 2.5 Signal DBL Lock Connector 2.5 シグナル･ シグナル･ダブル･ ダブル･ロックコネクタ 108-5459 30JUN2009 Rev L 1. Scope : １1. 適用範囲 1.1 Contents 1.1 1.1 内容 This specification covers the requirements for product

Contextual Info: 107-68157 Packaging Specification 30June08 Rev F 2.5 MM MIS AMP-IN ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 2.5 MIS 2.5 MM MIS AMP-IN ASSY. 订定 2.5 MM MIS AMP-IN ASSY 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围

Contextual Info: 107-68156 Packaging Specification 30June08 Rev G 2.5 MM MIS POST HEADER ASSY 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 2.5 MM MIS POST HEADER ASSY. 订定 2.5 MM MIS POST HEADER ASSY 产品之包装规格及包装方式。

Contextual Info: 107-68155 Packaging Specification 30June08 Rev G 2.5 MM MIS HEADER ASSY AND RECEPTACLE 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 2.5 MM MIS HEADER ASSY AND RECEPTACLE. 订定 2.5 MM MIS HEADER ASSY AND RECEPTACLE 产品之包装规格及包装方式.

Contextual Info: THIS DRAWING 15 UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. GP DIST 00 R E V IS IO N S LTR DESCRIPTION RELEASED PER DATE 30JUN05 EC 0 S 1 3 - 0 6 5 9 - 0 4 DWN APVD BEC SB ±0.38 '±.01 5~ 2.54

Contextual Info: 4 RELEASED FOR PUBLICATION THIS DRAWING IS UNPUBLISHED. C COPYRIGHT 2 3 1 2003 LOC 2003 REVISIONS DIST AI ALL RIGHTS RESERVED. - P LTR DESCRIPTION B B1 10+0.1 -0.1 D 5 1.2+0.1 -0.1 1.85 F-F 15 DATE DWN APVD ECR-12-002845 17APR2012 MKD RRP ECR-13-010494 30JUN2013

Contextual Info: 5 T H IS DR AW IN G IS U N P U B L IS H E D . C O PYRIG H T 4 3 2 R E L E A S E D FO R P U B LIC A T IO N BY TYCO ELEC TR O N IC S C O RPO RATIO N . LOC A L L R IG H T S R E S E R V E D . GP REVISIONS D IS T 00 LTR D E S C R IP T IO N DATE 51 1 4 30JUN2008

Contextual Info: SESD–05–32–G–03.00–D–LDS F-214 Rev 30JUN14 TEM–110–02–03.0–G–D–L1 SYSTEM SESD–15–32–G–03.25–S–L (0,80 mm) .0315" SESD, TEM-L1 SERIES DISCRETE WIRE CABLE ASSEMBLY Mates with: TEM-L1 NO. OF POSITIONS SESD 32 PLATING

Contextual Info: RF-13 Rev 30JUN14 RF23S–92SPP–92SJP–0100 RF23S SERIES 50Ω MICROWAVE CABLE ASSEMBLIES SPECIFICATIONS Mates with: 292PS High frequency performance to 40 GHz For complete specifications see www.samtec.com?RF23S RF Connector: Shell Material: Brass or Stainless Steel

Contextual Info: 107-68164 Packaging Specification 30June08 Rev D REC HOUSING,MIS 1. PURPOSE 目的 Define the packaging specifiction and packaging method of REC HOUSING,MIS. 订定 REC HOUSING,MIS 产品之包装规格及包装方式。 2. APPLICABLE PRODUCT 适用范围 / PACKAGING QUANTITY 包装数量

Contextual Info: 107-68154 Packaging Specification 30June08 Rev E REC.ASSY 2.5MM PITCH MIS 1. PURPOSE 目的 Define the packaging specifiction and packaging method of 2.5 MIS RECEPTACLE ASSEMBLY. 订定 2.5 MIS RECEPTACLE ASSEMBLY 产品之包装规格及包装方式. 2. APPLICABLE PRODUCT 适用范围

Contextual Info: THIS DRAWI NG COPYRIGHT IS UNPUBLISHED. RELEASED ROR ALL 2002 PUBLICATION RIGHTS L OC DIST REVISIONS RESERVED. DESCRIPTION C IRCUIT IDE NTIFICATION CORRECTED AM9 RKS 30JUN201 I RRR 6 .3 5± 0 .2 C I RC1J I T I - '1 - I D E N T I F I C A T I ON "-Ï—1 - i

Contextual Info: RF-13 Rev 30JUN14 292PS–J–C–HP–ST–CS3 292PS-CA SERIES 50Ω SMA 2.92 COMPONENTS SPECIFICATIONS TYPE For complete specifications and assembly instructions see www.samtec.com?292PS-CA Shell Material: Stainless Steel Contact Material: Brass Cable Body:

Contextual Info: 4 TH IS DRAWING IS U N P U B LIS H E D . RELEASED FOR PUBLICATION A L L RIGHTS COPYRIGHT 2 3 - LOC D IST REVISIONS GP 00 RESERVED. BY TYCO ELECTRONICS CORPORATION. LTR D E SC RIPTIO N R ELEASED PER EC 0S13 -0 2 0 7 -0 5 DATE DWN APVD 30JUN05 sw JG D D C

Contextual Info: 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC DIST R E V IS I O N S ALL INTERNATIONAL RIGHTS RESERVED. DATE OWN APVD 0 8A P R 10 HMR TM 30JUN2010 T.K T.M DESCRIPTION LTR J REVISED PER E C R - 1 0 - 0 0 7 0 7 8

Contextual Info: r THIS DRAWING IS UNPUBLISHED.- COPYRIGHT - I RELEASED Fôft RUBUGAflDN- ALL R titfl* RESERVED. LOC DJST 1 REVISIONS GZ 00 BY TYCO ELECTRONICS CORPORATION. Tnr “ KTE“ DESôRIPTtôN 0 7 2 0 -0 4 2 7 -0 4 30JUN04 W KH HT

Contextual Info: 4 T H IS D R AW IN G IS U N P U B L IS H E D . CO PYR IG H T 2 R E LE A S E D FO R PU B LIC A TIO N BY ^ C O ELEC TR O N IC S CO RPO RATIO N . - - R EVISIO N S 50 A L L R IG H T S R E S E R V E D . LTR D E S C R IP T IO N DATE DWN APVD 30JUN10 HMR PD REVISED PER E C R - 1 0 -

. rp 700 pc -24

Abstract: 2-1761603-3
Contextual Info: 6 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 5 4 3 2 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. REVISIONS DIST GP 00 LTR DESCRIPTION A1 2.54 [.1 00] 0.55 |\015' D D — DWN JDP SB I 8 MAYO6 REVISED PER EC O -06- 003476

SMARTRF05

Abstract: cc2541 CC2540EM SWRU297 heart rate sensor SMARTRF05 cc2540 C_1U_0402_X5R_K_6P3 CC2541EM CC2542 interface CC2540
Contextual Info: Bluetooth Low Energy CC2540 Development Kit CC2541 Evaluation Module Kit User’s Guide Document Number: SWRU301A Development Kit Part Number: CC2540DK, CC2541EMK SWRU301 TABLE OF CONTENTS 1. REFERENCES. 4

Contextual Info: TSML1000, TSML1020, TSML1030, TSML1040 www.vishay.com Vishay Semiconductors High Power Infrared Emitting Diode, RoHS Compliant, 940 nm, GaAlAs/GaAs FEATURES TSML1020 TSML1000 • Package type: surface mount • Package form: GW, RGW, yoke, axial • Dimensions L x W x H in mm : 2.5 x 2 x 2.7

TC14419

Contextual Info: 12F R Series Vishay High Power Products Standard Recovery Diodes (Stud Version), 12 A FEATURES • High surge current capability RoHS • Stud cathode and stud anode version COMPLIANT • Wide current range • Types up to 1200 V VRRM • RoHS compliant • Designed and qualified for industrial and consumer level

SWRU272

Abstract: SWRU270B cc2540 heart rate sensor bluetooth dongle 4.0 low energy USB slave BLE-CC2540-1 SWRU271A interface CC2540 "Blood Pressure Sensor" SWRU297
Contextual Info: Bluetooth Low Energy CC2540 Mini Development Kit User’s Guide Document Number: SWRU270B Document Version: 1.1 Development Kit Part Number: CC2540DK-MINI SWRU270B TABLE OF CONTENTS 1. REFERENCES. 3

m955

Abstract: M9551 M95512-DF
Contextual Info: M95512-W M95512-R M95512-DR M95512-DF 512-Kbit serial SPI bus EEPROM Datasheet − production data Features • Compatible with the Serial Peripheral Interface SPI bus ■ Memory array – 512 Kb (64 Kbytes) of EEPROM – Page size: 128 bytes SO8 (MN) 150 mil width