30A15 Search Results

KCH30A15

Contextual Info: SBD T y p e : KCH KCH30A 30A15 OUTLINE DRAWING FEATURES *Similar to TO-247AC Case *Dual Diodes – Cathode Common *High Voltage Low Leakage Current *Low Forward Voltage Drop *Low Power Loss,High Efficiency *High Surge Capability *Tj=150 °C operation Maximum Ratings

FCH30A15

Contextual Info: SBD T y p e : FCH30 FCH30A 30A15 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage

TCH30A15-11A

Contextual Info: SBD T y p e : TCH30 CH30A 30A1515-11A OUTLINE DRAWING FEATURES *Tabless TO-220 Packaged in 24mm Tape and Reel *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.45g

Contextual Info: 1Mx8/512Kx16/256Kx32, 17 - 35ns, ZIP/SIMM 30A151-00 A 8 Megabit CMOS SRAM DPS256X32KL/DPS256X32KW DESCRIPTION: The DPS256X32KL/DPS256X32KW is a 256K x 32 high density, high-speed Static Random Access Memory SRAM module, intended for high performance computers and digital signal processing

KRH30A15

Contextual Info: SBD T y p e : KRH KRH30A 30A15 OUTLINE DRAWING FEATURES *Similar to TO-247AC Case *Dual Diodes – Anode Common *High Voltage Low Leakage Current *Low Forward Voltage Drop *Low Power Loss,High Efficiency *High Surge Capability *Tj=150 °C operation Maximum Ratings

TCH30A15

Contextual Info: SBD T y p e : TCH30 CH30A 30A15 OUTLINE DRAWING FEATURES *SQUARE-PAK TO-263AB SMD Packaged in 24mm Tape and Reel *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.4g

30A15

Contextual Info: SBD T y p e : FCH30 FCH30A 30A15 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage

Contextual Info: SBD T y p e : TCH30 CH30A 30A1515-11A OUTLINE DRAWING FEATURES *Tabless TO-220 Packaged in 24mm Tape and Reel *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.45g

1530A

Abstract: CH30 TCH30A15-11A
Contextual Info: SBD T y p e : TCH30 CH30A 30A1515-11A OUTLINE DRAWING FEATURES *Tabless TO-220 Packaged in 24mm Tape and Reel *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.45g

FCH30A15

Contextual Info: SBD T y p e : FCH30 FCH30A 30A15 OUTLINE DRAWING FEATURES *TO-220AB Case *Fully Molded *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.75g Symbol Repetitive Peak Reverse Voltage

Contextual Info: SBD T y p e : TCH30 CH30A 30A15 OUTLINE DRAWING FEATURES *SQUARE-PAK TO-263AB SMD Packaged in 24mm Tape and Reel *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.4g

Contextual Info: 1.5Mx8/512Kx24, 20 - 45ns, STACK 30A154-03 A 12 Megabit High Speed CMOS SRAM DPS512X24MFn3 PRELIMINARY DESCRIPTION: SLCC Stack The DPS512X24MFn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

CH30

Abstract: TCH30A15
Contextual Info: SBD T y p e : TCH30 CH30A 30A15 OUTLINE DRAWING FEATURES *SQUARE-PAK TO-263AB SMD Packaged in 24mm Tape and Reel *Dual Diodes – Cathode Common *Low Forward Voltage Drop *High Surge Capability *Tj=150 °C operation Maximum Ratings Rating Approx Net Weight: 1.4g

Contextual Info: 2Mx8/1Mx16/5Mx32, 20 - 45ns, STACK 30A154-04 A 16 Megabit High Speed CMOS SRAM DPS512X32MFn3 DESCRIPTION: SLCC Stack The DPS512X32MFn3 High Speed SRAM ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC .

e351

Abstract: DPD32
Contextual Info: DENSE-PAC 1280 Megabit CMOS DRAM MICROSYSTEMS DPD32MS40PW 5 _ PRELIMINARY_ D E S C R IP T IO N : The D P D 32M S40 PW 5 is the 32 M eg x 40 Dynamic RAM module in the family of Super SIM M modules that utilize the new and innovative space saving TSO P

EATON CM20A

Abstract: A5 GNE mosfet Hall sensor 44e 402 2N8491 FTG 1087 S TRIAC BCR 10km FEB3T smd transistor marking 352a sharp EIA 577 sharp color tv schematic diagram MP-130 M mh-ce 10268
Contextual Info: Table of Contents N E W A R K E L E C T R O N IC S “Where serving you begins even before you call” Newark Electronics is a UNIQUE broadline distributor of electronic components, dedicated to provid­ ing complete service, fast delivery and in-depth inventory. Our main

30A-075

Contextual Info: Yuan Dean Scientific CO.,LTD 30A SERIES 8 PIN SINGLE-IN-LINE TTL ACTIVE DELAY LINE FEATURES • 8-PIN SIP PACKAGE. • 5EQUALLY-SPACED TAPS. • TTL SCHOTTKY INTERFACED. • TOTAL DELAYS FROM 25-1000nS. ELECTRICAL CHARACTERISTICS IIH Logic”1” Input Current

AL437

Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X32MFn3 ADVANCED INFORMATION D E S C R IP T IO N : The DPS512X32MFn3 High Speed S R A M "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCO.

D032

Contextual Info: DENSE-PAC MICROSYSTEMS 640 Megabit C M O S D R A M DPD16MS40PKW5 PRELIMINARY D E S C R IP T IO N : The D PD 16M S40PKW 5 is the 16 Meg x 40 Dynamic R A M module in the family of S o p e rS / M M modules that utilize the new and innovative space saving TSOP

Contextual Info: 1152 Megabit CMOS DRAM DPD32MS36PKW5 PRELIMINARY DESCRIPTION: PIN-OUT DIAGRAM The DPD32MS36PKW5 is the 32 Meg x 36 Dynamic RAM module in the family of Super SIMM modules that utilize the new and innovative space saving TSOP stacking technology. The module is constructed of twentyfour dynamic RAM stacks

Contextual Info: 30A150CT 30A150CTFP 30A SBR SUPER BARRIER RECTIFIER Features Mechanical Data • • • • • • • • Low Forward Voltage Drop Excellent High Temperature Stability Patented Super Barrier Rectifier Technology Soft, Fast Switching Capability Lead Free Finish, RoHS Compliant Note 1

L130C

Abstract: L74c l31c l97c l65c A311TC l146c l48c L202C L235C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC May 2009 Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

Contextual Info: DENSE-PAC 12 Megabit High Speed CMOS SRAM MICROSYSTEMS DPS512X24MFn3 ADVANCED INFORMATION DESCRIPTION : The DPS512X24MFn3 High Speed SRAM "S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC .