30A05000 Search Results

Contextual Info: H IG H SPEED 8K X 16 C M O S S R AM P G A M O D U L E PRELIMINARY DESCRIPTION: The DPS8X16A is a 40-pin Pin G rid Array PGA consisting o f tw o 8K X 8 SRAM devices in ceram ic LCC packages surface m o u n te d on a co-fired ceram ic substrate w ith m atched thermal coefficients.

Contextual Info: DPS8X16A Dense-Pac Microsystems, Inc. HIGH SPEED 8K X 16 CMOS SRAM PCA MODULE O PRELIMINARY DESCRIPTION: The DPS8X16A is a 40-pin Pin Grid Array PGA consisting of two 8K X 8 SRAM devices in ceramic LCC packages surface mounted on a co-fired ceramic substrate with matched thermal coefficients.

Contextual Info: DPS8X16A □PM Dense-Pac Microsystems, Inc. H IG H SPEED 8 K X 16 C M O S S R A M P G A M O D U L E O PRELIMINARY DESCRIPTIO N: The DPS8X16A is a 40-pin Pin Grid Array PGA consisting of two 8 K X 8 SR A M devices in ceramic LCC packages surface mounted on a co-fired ceramic

Contextual Info: ^ Dense-Pac Microsystems, I n c ^ ^ ^ DPS8X16A H |C H s p EEp ^ x 16 C M O S SR A M P G A M O D U L E PRELIMINARY DESCRIPTION: The DPS8X16A is a 40-pin Pin Grid Array P G A consisting of two 8K X 8 SRAM devices in ceram ic LC C packages surface mounted on a co-fired ceram ic