300MIL17 Search Results

TSOP 113 g

Contextual Info: Packing JEDEC Tray Name TSOP 2 300MIL17 Mounting Pad 26 pin TSOP (II) (300 mil) 14 26 1 5°±5° E F detail of lead end 13 A H I K G J N D L B C M M S26GS-50-9JD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Packing JEDEC Tray Name TSOP 2 300MIL17 Mounting Pad 26 pin TSOP (II) (300 mil) 26 14 F P E detail of lead end 1 13 A D M M C L B G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 300MIL17 Mounting Pad 26 pin TSOP (II) (300 mil) 26 14 F E 5°±5° detail of lead end 1 A D 13 M M B C L G K N I J H S26G3-50-7KD-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

TSOP package tray

Abstract: 300mil JEDEC TRAY DIMENSIONS tsop 1230
Contextual Info: UNIT : mm HEAT PROOF 111.3 7 PPE NEC 135°C MAX 11.13 12.30 TSOP 2 300MIL17 135.9 11x16=176 A A' 9.2 16.4 19.14 13.95 287.1 315.0 (322.6) SECTION A-A' 16.4 (6.35) 7.62 12.0 5.62 Applied Package Quantity (pcs) 26-pin Plastic TSOP(II)(300mil) MAX. 176 Tray

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 300MIL17 26 pin TSOP (II) (300 mil) 26 14 1 P E F detail of lead end 13 A H I K G J N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

TSOP TRAY 40 PIN

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 300MIL17 26 pin TSOP (II) (300 mil) 14 5°±5° detail of lead end F E 26 1 13 A D M M C L B G K N I J H S26GS-50-9KD-2 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

Contextual Info: Mounting Pad Packing JEDEC Tray Name TSOP 2 300MIL17 26 pin TSOP (II) (300 mil) 26 14 1 A 5°±5° E F detail of lead end 13 H I K G J N C D L B M M S26G3-50-7JD-1 NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at

TRAY TSOP

Contextual Info: Packing JEDEC Tray Name TSOP 2 300MIL17 Mounting Pad 26 pin TSOP (II) (300 mil) 26 14 F P E detail of lead end 1 A D M 13 M L B C G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

Contextual Info: Packing JEDEC Tray Name TSOP 2 300MIL17 Mounting Pad 26 pin TSOP (II) (300 mil) 26 14 E P F detail of lead end 1 A 13 H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition.

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

MD300-10A

Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Contextual Info: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case