2C53 Search Results

2C5339

Abstract: 2C6193
Contextual Info: P P C PRODUCTS CORP 55E D • tflJS b m DDODÔTD T ■ j 5-A NPN Power Transistor Chips 2C5339 'T 'Z 'b - o S FEATURES I CHIP TYPE: AL • Epitaxial, Planar Design • Contact Metallization: Base, Emitter - Aluminum - 50,000 A Nominal Collector ■Gold - 3,000 A Nominal

2c53

Abstract: NL7235 corotron
Contextual Info: <f - NATIONAL NL7235 TRIODE The National NL7235 is a miniature triode designed for use with plate voltages as high as 10 KV. It can be used as a substitute for the 2C53 with a subsequent saving in chassis space. The high Mu and Sm of the NL7235 recommends its use as

transistor 42t

Abstract: 2C5339 2C6193 chip die npn transistor
Contextual Info: 5-A PNP Power Transistor Chips 2C6193 FEATURES CHIP TYPE: AL • Epitaxial, Planar Design • Contact Metallization: Base, Emitter - Aluminum - 50,000 A Nominal Collector - Gold - 3,000 A Nominal • Die Thickness - 10 Mils Nominal • Complement to NPN 2C5339

Contextual Info: 2C5339HV Transistors Si NPN Power BJT Military/High-RelN V BR CEO (V)100 V(BR)CBO (V)100 I(C) Max. (A)5.0 Absolute Max. Power Diss. (W)1.0 Maximum Operating Temp (øC)200õ I(CBO) Max. (A)10u @V(CBO) (V) (Test Condition)100 V(CE)sat Max. (V)1.2 @I(C) (A) (Test Condition)5.0

2N5345

Abstract: MJ4647 2n5344 SILICON DICE motorola transistor motorola 2C5345 mj4646
Contextual Info: MOTOROLA 3M SC -CDIODES/OPTOJ 6367255 MOTOROLA SC » F lt.3 t.7 S S S D IO D E S /O P T O 34C 0037=135 37935 6 D „q j SILICON POWER TRANSISTOR DICE (continued) 2C5345 DIE NO. LINE SOURCE — PL500.77 This die provides performance equal to or better than that of

2C5339

Abstract: 2C6193
Contextual Info: P P C PRODUCTS CORP SSE D ta jb lll OOOOÖ'iD T • ! 5-A NPN Power Transistor Chips 2C5339 • T -lV O S t CHIP TYPE: AL FEATURES • Epitaxial, Planar Design • Contact Metallization: Base, Emitter - Aluminum - 50,000 A Nominal Collector ■ Gold - 3,000 A Nominal

2c5339

Abstract: transistor 2sc 1014 2C5339HV 2C6193
Contextual Info: 4bE D • b3b7254 00^2^73 2 ■ M O T b T - ^ “0 5 MOTOROLA SC XSTRS/R F MOTOROLA SEMICONDUCTOR TECHNICAL DATA kAä DM0 2C5339HV Chip NPN Silicon Medium-Power Transistor mini Discrete Military Operation . . .(or use in switching and wide-band amplifier applications

2C4300

Abstract: 2C5333 chip die npn transistor
Contextual Info: P P C PRODUCTS CORP bDE D • b flS b m □DOO'ìba 1GG W PPC PNP Power Transistor Chips 2C5333 FEATURES CHIP TYPE: AP • Epitaxial, Planar Design • Contact Metallization: Base, Emitter - Aluminum - 30,000 A Nominal Collector - Gold - 3,000 A Nominal • Die Thickness - 10 Mils Nominal

2NC5339

Abstract: 2N5349 2N6187 2n4877 2N6191 2N534B 2N5346 2n5430 2N6186 2nc53
Contextual Info: MOTOROLA SC O I O D E S / O P T O } S367255 MOTOROLA 34 SC D I O D E S ]>F| L,3L,7S55 □ Q B 7 ti34 t. | ~ /O P TO 34C 37934 SILICON POWER TRANSISTOR DICE (continued) 2C5339 DIE NO. — NPN LINE SOURCE — PL500.68 NPN D r - 3 3 ^ '/ 2C6193 / DIE NO.

TRANSISTOR SMD kl3

Abstract: P-LSSOP20-4 fra4 transistor bc 549
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

h-12-H

Abstract: SDA28 REJ09B0001 2CM06 DTC 304-2 user manual
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

L33A SMD

Abstract: smd TRANSISTOR code b6 l36a adc 809 wk1 smd EA1 transistor smd PRQP0100JD-B smd code book R8C 702 TRANSISTOR smd l33a
Contextual Info: REJ09B0441-0010 R8C/L35A Group, R8C/L36A Group, R8C/L38A Group, R8C/L3AA Group, 16 R8C/L35B Group, R8C/L36B Group, R8C/L38B Group, R8C/L3AB Group Hardware Manual RENESAS MCU R8C FAMILY / R8C/Lx SERIES Preliminary All information contained in these materials, including products and product specifications,

Contextual Info: Datasheet R8C/34W Group, R8C/34X Group, R8C/34Y Group, R8C/34Z Group RENESAS MCU 1. R01DS0012EJ0100 Rev.1.00 Nov 24, 2010 Overview 1.1 Features The R8C/34W Group, R8C/34X Group, R8C/34Y Group, and R8C/34Z Group of single-chip MCUs incorporate the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address

Contextual Info: Datasheet R8C/3NT Group RENESAS MCU 1. R01DS0047EJ0100 Rev.1.00 Jan 25, 2011 Overview 1.1 Features The R8C/3NT Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

Contextual Info: Datasheet R8C/34U Group, R8C/34K Group RENESAS MCU 1. R01DS0113EJ0110 Rev.1.10 Jun 15, 2011 Overview 1.1 Features The R8C/34U Group, R8C/34K Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of

Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

Contextual Info: Datasheet R8C/3MU Group, R8C/3MK Group RENESAS MCU 1. R01DS0112EJ0110 Rev.1.10 Jun 15, 2011 Overview 1.1 Features The R8C/3MU Group, R8C/3MK Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of

Contextual Info: Datasheet R8C/3JT Group RENESAS MCU 1. R01DS0045EJ0100 Rev.1.00 Apr 26, 2011 Overview 1.1 Features The R8C/3JT Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high

ST-M40

Contextual Info: PH AST-12 Device Programmable, High-Performance ATM/Packet/Transmission SONET/SDH Terminator for Level 12 TXC-06112 DATA SHEET PRELIMINARY DESCRIPTION Integrated clock recovery and synthesis fo r four O C -3c/STM -1 sig n a ls or one O C -1 2 /O C -1 2 c/

017BH

Contextual Info: PRELIMINARY Notice: This is not a final specification. Some parametric limits are subject to change. R8C/33A Group REJ03B0228-0001 Rev.0.01 Oct 26, 2007 RENESAS MCU 1. Overview 1.1 Features The R8C/33A Group of single-chip MCUs incorporates the R8C/Tiny Series CPU core, employing sophisticated

RCA 619

Abstract: BUX39 RCA Solid State Power Transistor
Contextual Info: G E SOLI» STATE 3875081 G E SOLID STATE •üï DE”!3fl7S0fll □D17t.l3 ^ | ~ 01E 1761 3 33 3 Pro Electron Power Transistors _ _ BUX39 File Num ber 1211 High-Current, High-Speed, High-Power

rtm870t

Abstract: RTM870T-690 9LPR462 rtm870 SRN22J-4-GP ICS9LPR462 foxconn rs690mc Socket AM2 GPIO57
Contextual Info: 5 4 3 2 1 Yukon Block Diagram AMD 8,9 DDR2 SODIMM DIMM2 K8 Rev.G AM2 Socket DDR II 533/667/800 8,9 HyperTransport 16x16 32 4,5, 6,7 L1: Signal 1 L2: VCC L3: Inner Signal 2 L4: Inner Signal 3 L5: GND L6: Signal 4 Project code: 91.4BC01.001 PCB P/N : 48.4BC01.001

g792

Abstract: CP2211F G7922 NIPPON CHEMICON ASF CPUTEST25L ATI-RS690M wistron MARVELL G77 WPC8768LDG c70021
Contextual Info: 5 4 3 2 1 Orta Block Diagram AMD 8,9 DDR2 SODIMM DIMM2 8,9 Power Switch P2231NFC1 28 HyperTransport New card 28 RJ45 C 24 24 INPUT OUTPUT DCBATOUT CRT13 VCC_CORE_S0 SYSTEM DC/DC LCD14 INPUT OUTPUT DCBATOUT PCI-E x 1 1D2V_S0 1D8V_S3 SYSTEM DC/DC INPUT PCI-E x 4

R5F2L38AMNFP

Abstract: R5F2L388MNFP R5F2L38AM R5F2L357M zd 027bh dtc 114 cross reference R5F2L387MNFP R5F2L
Contextual Info: R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, R8C/L3AM Group RENESAS MCU 1. R01DS0028EJ0001 Rev.0.01 Sep 30, 2010 Overview 1.1 Features The R8C/L35M Group, R8C/L36M Group, R8C/L38M Group, and R8C/L3AM Group of single-chip MCUs incorporate the R8C CPU core, which implements a powerful instruction set for a high level of efficiency and