29JUL2003 Search Results

J-STD-020B

Abstract: M36W0T7040T0 M69AW024B
Contextual Info: M36W0T7040T0 M36W0T7040B0 128Mbit Multiple Bank, 8Mb x 16, Burst Flash Memory 16Mbit (1Mb x16) PSRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Burst) Flash Memory – 1 die of 16 Mbit (1Mb x16) Pseudo SRAM

Contextual Info: 4 3 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. LOC ALL RIGHTS RESERVED. REVISIONS DIST CM LTR DESCRIPTION REVISED PER 0G3B-0211-05 1. P IN S TO C O M P L Y WITH SPEC. 10 9 - 1 1 - 3 . 2. D IM EN S IO N S

Contextual Info: 1.25 CD • <dO I CJ 3 P0S, 2 POS. 2.20 o cn 0.26 TYP. tj LO LO O _* ho AMP LOGO oy t i Ott- ry. o lü Qi Q_ NOTE: 1. MATERIAL: HOUSING: O . Pf ^ □û: Ld Ld O M I V PS -■Ori LOO-l O Ql- Q "?I ïf c S S -JL lIÜ- , LJSL is s t THERMOPLASTIC, UL 9 4 V-0,

Contextual Info: h• <dO I 1.30 u 1.1 D 0 . 15+ 0.02 o :zz; SEC A - A o CH SEC B—B SEC C-C tj C NOTE: 1. MATERIAL: TERMINAL: PHOSPHOR BRONZE. 2. FINISH: THICKNESS : PLEASE SEE TABLE. A 440147-1: TIN-LEAD PLATE AND 1.27urn MIN. NICKEL UNDERPLATE OVER ALL (B) 440147-2: GOLD PLATE IN CONTACT AREA, 1.27um MIN.

J-STD-020B

Abstract: M30L0R7000B0 M30L0R7000T0 M36L0R7050B0 M36L0R7050T0 M69AR048B
Contextual Info: M36L0R7050T0 M36L0R7050B0 128 Mbit Multiple Bank, Multi-Level, Burst Flash Memory 32 Mbit (2M x16) PSRAM, 1.8V Supply Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128 Mbit (8Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32 Mbit (2Mb x16) Asynchronous

794075-2

Abstract: tyco ul94v-0
Contextual Info: 8 T H IS DRAWING IS U N P U B LIS H E D . 7 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. COPYRIGHT - BY TYCO ELECTRONIC5 CORPORATION. 3 9 .8 3 34.67 D 1 1.89 ROa # #& # # Rrì PCH= 9.83 =W 13.49 L 0.76 V B AMP 4 6 0 5 REV 3 1 M AR 2000 V V LOC D IS T CM REVISIONS

Contextual Info: 2 THIS DRAWI NG I S U N P U B L I SHED. C O P Y R I G H T 20 R E L E A S E D FOR P U B L I C A T I O N BY TYCO E L E C T R O N I C S C O R P O R A T I O N . A L L RIGHTS 20 LOC GP R E S E RV E D. REVISIONS DIST 00 P LTR H3 DESCRIPTION DATE REV PER E C R - 0 9 - 0 1 3 0 6 2

Contextual Info: THIS DRAWING IS UNPUBLISHED. AA VW COPYRIGHT - 6 7 8 RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. 5 4 3 2 - LOC ALL RIGHTS RESERVED. DIST CM R E VIS IO N S P LTR H1 DESCRIPTION REVISED PER E C 0 - 0 7 - 0 0 7 2 4 2 P IN S TO C O M P L Y SPEC 109- 1 1-3.

C-440146

Abstract: X-440147-X
Contextual Info: 1.25 CD • <dO I CJ D 3 POS, 2 POS. 2.20 o cn tj 0.26 TYP. C LO LO O _* ho AMP LOGO on Q_ NOTE: 1. MATERIAL: HOUSING: < o CO o Q CO •01 LJÏÏL THERMOPLASTIC, UL 94V-0, COLOR: NATURAL 2. APPLY TERMINAL PART NO: X-440147-X. DIMENSION : 0 PLC ± 1 PLC ±0.15

UR-94V0

Abstract: UR-94V-0
Contextual Info: D R AW IN G IS U N P U B LIS H E D . RELEASED FOR ALL P U B LIC A T IO N R IG H T S D IST LOC RESERVED. R E V IS IO N S C O P Y R IG H T D E S C R IP T IO N R EVISED PER DWN 1m a r 11 EC O -11-00491 7 APVD RK HMR -22.28 HOUSING D 4 PIN C O N T A C T 10 REQUIRED

M30L0T7000T0

Abstract: J-STD-020B M36L0T7050B0 M36L0T7050T0 M69AW048B Flash Memory 32Mbit M30L0T7000
Contextual Info: M36L0T7050T0 M36L0T7050B0 128Mbit Multiple Bank, Multi-Level, Burst Flash Memory 32Mbit (2M x16) PSRAM, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 128Mbit (8Mx16, Multiple Bank, Multi-level, Burst) Flash Memory – 1 die of 32Mbit (2Mx16) Pseudo SRAM

Contextual Info: 2 THIS DRAWING IS UNPUBLISHED. RELEASED BY C O P Y R I G HT 20 TYCO ELECTRONICS CORPORATION. ALL FOR PUBLICATION R|3 H T S LOC CM RESERVED. REV ISIONS D I ST 00 LTR DE S C R I P T I O N DWN DATE R E V I S E D PER OG 3 B - 0 2 7 8 - 0 3 R E V I S E D RER OG 3B - 1 0 9 4 - 0 4

e 156176

Contextual Info: 7 8 THIS DRAWING IS UNPUBLISHED. C COPYRIGHT RELEASED FOR PUBLICATION 6 5 4 3 2 20 LOC ES ALL RIGHTS RESERVED. 20 1 REVISIONS DIST 00 P LTR L9 DESCRIPTION DATE REVISED 3-6 DWN APVD CZ 21OCT2013 SZ DIM F REF: SIGNAL SECONDARY LOCK PART NUMBER-1600902-1 4 D