287PIN Search Results

Contextual Info: 287S8-A Metal seal 287pin PGA EIAJ Package Code – Weight g JEDEC Code – 57.404±0.36 4.801TYP φ34.798±0.41 φ0.457±0.04 φ4.826MAX 5.461TYP 2.54TYP AB AA Y W V U T R P N M L K J H G F E D C B A 57.404±0.36 1.27TYP 3.683TYP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22

Contextual Info: 5 Thermal Specifications Sections 5.1 and 5,2 specify the DECchip 21066 operating temperature and thermal resistance. 5.1 Operating Temperature The 21066 is specified to operate when the temperature at the center of the heat sink Tc is within the range of 0°C to 85°C. Temperature Tc should be

Contextual Info: 1 Microarchitecture The DECchip 21066 microprocessor implements Digital’s Alpha AXP architecture. The following sections provide an overview of the chip’s architecture and major functional units. Figure 1 is a block diagram of the DECchip 21066 microprocessor.

Contextual Info: 4 Mechanical Specifications Figures 4 and 5 show the 287-pin standard pin grid array PGA package and its dimensions. Figure 4 21066 Package — Top and Side HPAT RI U 6 RASF AREA n 2.260 -t 0.012 TYP - 42 T <«-<££ Figure 5 21066 Package — Bottom - 4©

Tag 225 600 replacement

Abstract: Alpha 21066-AB EC-QC4HA-TE EY-L520E-DP 21066AA
Contextual Info: Alpha 21066 and Alpha 21066A Microprocessors Data Sheet Order Number: EC–QC4HB–TE Revision/Update Information: Digital Equipment Corporation Maynard, Massachusetts This document supersedes the Alpha 21066/21066A Microprocessors Data Sheet EC–QC4HA–TE .

v850e2

Abstract: ICE 10501 vending machine using microcontroller V850E2 core 433 Mc block diagram vending machine using FPGA renesas v850e2 V850E2M MC10501 MC-10501
Contextual Info: PFESiP Platform for Embedded System in a Package EP Series EP-1 PFESiP (Platform for Embedded System in a Package) is a new ASIC solution providing Gate Array quickly, cost-effectively, and safely with expanded functionality, by developing Gate Array and general-purpose function chips into SiPs, which are pre-verified and lined up as masters.