28-PIN SOJ Search Results

Contextual Info: 2 MEG X 8 FPM DRAM MICRON HR AM MT4C2M8B1 MT4LC2M8B1 U r iM IV I FEATURES PIN ASSIGNMENT (Top View OPTIONS LC C • Packages Plastic 28-pin SOJ (300 mil) Plastic 28-pin SOJ (400 mil) Plastic 28-pin TSOP (300 mil) DJ DW TG • Timing 60ns access 28-Pin SOJ

Contextual Info: MT4LC2M8B1 L 2 MEG X 8 DRAM M IC R O N DRAM 2 MEG x 8 DRAM 3.3V, FAST PAGE MODE, OPTIONAL EXTENDED REFRESH FEATURES PIN ASSIGNMENT (Top View) 28-Pin 300 mil SOJ 28-Pin 400 mil SOJ (DA-3) (DA-4) V cc [ 1 • 28 ) Vss Vccf DQ1 [ 2 27 ] DQ8 DQ1 [ 2 28 ] Vss

CERAMIC FLATPACK 20pin

Contextual Info: MECHANICAL DRAWINGS Ceramic DIP Ordering Code: C C1 24-pin, 0.3" wide C2 20-pin, 0.3" wide C3 22-pin, 0.3" wide C4 24-pin, 0.6" wide C5 28-pin, 0.3" wide C6 28-pin, 0.6" wide C7 16-pin, 0.3" wide C8 18-pin, 0.3" wide C9 32-pin, 0.6" wide C10 28-pin, 0.4" wide

9744

Abstract: 438 j
Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN CERAMIC LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50mil Package width 432mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ (LCC-28C-A04) 18.42±0.25 (.725±.010) 10.98±0.25 (.432±.010)

LCC28

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN CERAMIC To Top / Package Lineup / Package Index LCC-28C-A04 28-pin ceramic SOJ Lead pitch 50 mil Package width 432 mil Sealing method Metal seal Lead shape J bend LCC-28C-A04 28-pin ceramic SOJ

smd marking "d3"

Abstract: SMD MARKING A13
Contextual Info: SRAM MT5C2568 Austin Semiconductor, Inc. 32K x 8 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY 28-PIN SOJ (ECJ) 28-Pin DIP (C, CW) FEATURES OPTIONS MARKING • Timing 12ns access1 15ns access1 20ns access 25ns access 35ns access 45ns access 55ns access2

smd transistor A7

Abstract: smd transistor marking A14 smd a7 5962-8866204xx smd marking A8 smd transistor a4 SMD a7 Transistor Transistors Diodes smd e2 smd transistor marking A3 smd transistor A8
Contextual Info: SRAM MT5C2568 Austin Semiconductor, Inc. 32K x 8 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY 28-PIN SOJ (DCJ) 28-Pin DIP (C, CW) FEATURES OPTIONS MARKING • Timing 12ns access1 15ns access1 20ns access 25ns access 35ns access 45ns access 55ns access2

Contextual Info: SRAM MT5C2568 Austin Semiconductor, Inc. 32K x 8 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY 28-PIN SOJ (DCJ) 28-Pin DIP (C, CW) FEATURES OPTIONS MARKING • Timing 12ns access1 15ns access1 20ns access 25ns access 35ns access 45ns access 55ns access2

5962-8855205YA

Abstract: 5962-8855205UA
Contextual Info: SRAM MT5C2568 AS5C2568 Austin Semiconductor, Inc. 32K x 8 SRAM PIN ASSIGNMENT Top View SRAM MEMORY ARRAY AVAILABLE AS MILITARY SPECIFICATIONS 28-PIN SOJ (DCJ) 28-Pin DIP (C, CW) FEATURES Access Times: 12, 15, 20, 25, 35, 45, 55, 70, & 100ns Battery Backup: 2V data retention

D9000007

Contextual Info: AS& AUSTIN SEMICONDUCTOR, INC. SRAM MT5C2568 883C 32K x 8 SRAM 32K x 8 SRAM AVAILABLE AS MILITARY SPECIFICATIONS PIN ASSIGNMENT Top View • SMD 5962-88662 • MIL-STD-883 28-PIN SOJ 28-Pin DIP (D15/D10) FEATURES • • • • • Ultra high speed 12,15ns

Contextual Info: SRAM FT5C2568 32K x 8 SRAM PIN ASSIGNMENT Top View SRAM A SPECIFICATIONS 28-PIN SOJ 28-Pin DIP FEATURES Access Times: 12(I.only), 15, 20, 25, 35, 45, 55, 70, & 100ns Battery Backup: 2V data retention Low power standby High-performance, low-power CMOS double-metal process

Contextual Info: Package Dimensions 24 & 28-pin, 300-mil Plastic SOJ TSO D N E1 1 PIN #1 INDEX E b A C SEATING PLANE e TSO A1 B R E2 Inches No. Pins 24 Millimeters 28 24 28 Symbol Min Nom Max Min Nom Max Min Nom Max Min Nom Max A 0.128 — 0.148 0.128 — 0.148 3.26 —

Contextual Info: PRELIMINARY |W|IC=RC3N 512K M T4C 8 512/3 L WIDE DRAM X 8 512K x 8 DRAM WIDE DRAM LOW POWER, EXTENDED REFRESH FEATURES PIN ASSIGNMENT Top View OPTIONS 28-Pin ZIP (DB-3) 28-Pin SOJ (DC-4) MARKING • Timing 60ns access 70ns access 80ns access • MASKED WRITE

Contextual Info: MT4LC2M8E7 S 2 MEG x 8 DRAM MICRON I TECHNOLOGY, M C. DRAM 2 MEG x 8 DRAM 3.3V, EDO PAGE MODE, OPTIONAL SELF REFRESH FEATURES PIN ASSIGNMENT (Top View) 28-Pin SOJ 28-Pin SOJ • Industry-standard x8 pinout, timing, functions and packages • High-performance CMOS silicon-gate process

PA-SOJ28D-L-V-01

Abstract: PA-SOJ28D-L-V-01W
Contextual Info: 0.198" 0.998" 1 Pin 28 28 0.261" 15 0.400" PA-SOJ28D-L-V-01 Pin 1 0.800" 14 1 0.989" 2 0.187" 0.141" 0.100" typ. Side View 0.050" 0.020"±0.001" dia. 0.165" End View 0.100" 0.193" PA-SOJ28D-L-V-01W 0.507" 28 27 26 24 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5

Contextual Info: CY7B339 PRELIMINARY CYPRESS SEMICONDUCTOR • Available in 28-pin 300-mil PDIP and CerDIP, and in SOJ, PLCC, and LCC packages • Very high performance decoder with latched outputs — tpD = 7 ns Functional Description The CY7B339 is a 7-ns, 28-pin program­

SOJ028-P

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN PLASTIC LCC-28P-M05 EIAJ code : ∗SOJ028-P-0400-2 28-pin plastic SOJ Lead pitch 50mil Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-28P-M05 * : Resin protrusion. (Each side : 0.15 (.006) max)

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN PLASTIC LCC-28P-M07 EIAJ code : ∗SOJ028-P-0400-4 28-pin plastic SOJ Lead pitch 50mil Package width 400mil Lead shape J bend Sealing method Plastic mold LCC-28P-M07 * : Resin protrusion. (Each side : 0.15 (.006) max)

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN PLASTIC LCC-28P-M04 EIAJ code : ∗SOJ028-P-0400-3 Lead pitch 50mil Package width 300mil Lead shape J bend Sealing method Plastic mold 28-pin plastic SOJ LCC-28P-M04 * : Resin protrusion. (Each side : 0.15 (.006) max)

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE 28 PIN PLASTIC LCC-28P-M06 EIAJ code : ∗SOJ028-P-0400-3 Lead pitch 50mil Package width 400mil Lead shape J bend Sealing method Plastic mold 28-pin plastic SOJ LCC-28P-M06 * : Resin protrusion. (Each side : 0.15 (.006) max)

Contextual Info: ‘ HYUNDAI HYM532220A E-Series 2M X 32-bit CMOS DRAM MODULE DESCRIPTION The HYM532220A is a 2M x 32-bit Fast Page mode CMOS ORAM module consisting of four HY5117800B in 28/28 pin SOJ or TSOPII and an AND gate in 16 pin SOP on a 72 pin giass-epoxy printed circuit board. 0.22nFdecoupling

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M06 EIAJ code :∗SOJ028-P-0400-3 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M04 EIAJ code :∗SOJ028-P-0400-3 28-pin plastic SOJ Lead pitch 50 mil Package width 300 mil Lead shape J bend Sealing method Plastic mold

Contextual Info: SMALL OUTLINE J-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 28 PIN PLASTIC To Top / Package Lineup / Package Index LCC-28P-M07 EIAJ code :∗SOJ028-P-0400-4 28-pin plastic SOJ Lead pitch 50 mil Package width 400 mil Lead shape J bend Sealing method Plastic mold