28 MS-013 PACKAGE Search Results

jedec MS-013

Abstract: MS-013 M28B
Contextual Info: Revised January 1999 Package M28B 28-Lead Small Outline Integrated Circuit SOIC , JEDEC MS-013, 0.300” Wide Package Number M28B 1999 Fairchild Semiconductor Corporation m28b.prf www.fairchildsemi.com Package M28B January 1999

MS-013-AE

Abstract: 28 MS-013 Package
Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e

Contextual Info: Plastic Packages for Integrated Circuits Small Outline Plastic Packages SOIC M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- A D h x 45o a e A1

28 MS-013 Package

Abstract: MS-013-AE
Contextual Info: Plastic Package Small Outline Plastic Package SOIC M28.3 (JEDEC MS-013-AE ISSUE C) 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE N INDEX AREA H 0.25(0.010) M B M INCHES E SYMBOL -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004)

28 MS-013 Package

Abstract: MS-013
Contextual Info: Package Information SOP Outline Dimensions 28-pin SOP 300mil Outline Dimensions 2 8 1 5 A B 1 1 4 C C ' G H D E = F • MS-013 Symbol Dimensions in inch Min. Nom. Max. A 0.393 ¾ 0.419 B 0.256 ¾ 0.300 C 0.012 ¾ 0.020 C¢ 0.697 ¾ 0.713 D ¾ ¾ 0.104 E ¾

28 MS-013 Package

Abstract: MS-013 Package MS-013
Contextual Info: Package Information SOP Outline Dimensions 28-pin SOP 300mil Outline Dimensions 2 8 1 5 A B 1 1 4 C C ' G H D E = F • MS-013 Symbol Dimensions in mil Min. Nom. Max. A 393 ¾ 419 B 256 ¾ 300 C 12 ¾ 20 C¢ 697 ¾ 713 D ¾ ¾ 104 E ¾ 50 ¾ F 4 ¾ 12 G 16

smd diode JC 7K

Abstract: JC 7K OVS 30 CS464 CS-464 CS464YDW16 CS464YDWR16 MS-013
Contextual Info: CS464 DE SI GN CS464 Single Coil Predriver Description EW tive edge filtering, stall timing and over-voltage shutdown. The IC is available as a bumped flipchip or packaged in a 16 lead SO wide package. AR CH IF V OR E N The CS464, Single Coil Predriver, provides interface control for the

Contextual Info: 53111 POWER MOSFET OPTOCOUPLER, 90 V/1 Ω, Hermetically Sealed, DSCC Approved 5962-9314001 and 5962-9314002 Features: Applications: • • • • • • • • • • • • • • • • Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight

Contextual Info: 53111 POWER MOSFET OPTOCOUPLER, 90 V/1 , Hermetically Sealed DSCC Approved 5962-9314001, 5962-9314002 and 5962-9314003 Features: Applications: •               Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight

Contextual Info: 53111 POWER MOSFET OPTOCOUPLER, 90 V/1 Ω , Hermetically Sealed, DSCC Approved 5962-9314001 and 5962-9314002 Features: Applications: • • • • • • • • • • • • • • • • • Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight

Contextual Info: 53111 POWER MOSFET OPTOCOUPLER, 90 V/1 Ω, Hermetically Sealed, DSCC Approved 5962-9314001 and 5962-9314002 Features: Applications: • • • • • • • • • • • • • • • • Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight

5962-9314002HXA

Abstract: optocoupler crossreference 53111-1PA 53111-1PC 53111-1XA 53111-1XC 53111-1YA 53111-1YC 53111-1ZA 53111-1ZC
Contextual Info: 53111 POWER MOSFET OPTOCOUPLER, 90 V/1 Ω , Hermetically Sealed, DSCC Approved 5962-9314001 and 5962-9314002 Features: Applications: • • • • • • • • • • • • • • • • • Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight

5962-9314002HXA

Abstract: 53111-1XA 5962-9314001HXA 9314002 EIGHT MOSFET ARRAY 53111-1PA 53111-1PC 53111-1XC 53111-1YA 53111-1YC
Contextual Info: 53111 POWER MOSFET OPTOCOUPLER, 90 V/1 Ω, Hermetically Sealed, DSCC Approved 5962-9314001 and 5962-9314002 Features: Applications: • • • • • • • • • • • • • • • • Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight

Contextual Info: 53111 POWER MOSFET OPTOCOUPLER, 90 V/1 Ω, Hermetically Sealed, DSCC Approved 5962-9314001 and 5962-9314002 Features: Applications: • • • • • • • • • • • • • • • • Hermetically Sealed 8-Pin Dual-In-Line package Small Size and Weight

4 pin optocoupler

Contextual Info: 53115 HYBRID MICROELECTRONICS PRODUCTS DIVISION 480V / 0.28A / 0.55A, AC/DC, Hermetically Sealed Features: • Hermetically Sealed 8-Pin Dual-In-Line package • Small Size and Weight • Options: 5mA or 10mA input forward current • Performance Guaranteed over –55°C to

fet dual gate sot143

Abstract: SGM2014M
Contextual Info: SGM2014M SONY, GaAs N-channel Dual Gate MES FET_ hor the availability of this product, please contact the sales officir] Description Package Outline Unit : mm The SGM2014M is an N-channel dual gate GaAs MES FET for UHF band low-noise amplification. This FET is

Sony 104A

Contextual Info: SGM2014M] SONY. GaAs N-channel Dual Gate MES FET Description Package Outline The SGM2014M is an N-channel dual gate GaAs MES FET for UHF band low-noise amplification. This FET is suitable lor a wide range of applications including TV tuners, cellular radios, and DBS IF amplifiers.

Contextual Info: 53115 POWER MOSFET OPTOCOUPLER, HYBRID MICROELECTRONICS PRODUCTS DIVISION 480V / 0.28A / 0.55A, AC/DC, Hermetically Sealed Features: • Hermetically Sealed 8-Pin Dual-In-Line package  Small Size and Weight  Options: 5mA or 10mA input forward current

Contextual Info: 90V - 0.8A DUAL POWER MOSFET OPTOCOUPLERS DSCC DWG #5962-03247 53252 Features: Applications: •              8-Pin Dual-In-Line Hermetic Package Performance over –55°C to +125°C Compact Isolation Solid State Switches

Contextual Info: 90V - 0.8A DUAL POWER MOSFET OPTOCOUPLERS DSCC DWG #5962-03247 53252 Features: Applications: • • • • • • • • • • • • • • 8-Pin Dual-In-Line Hermetic Package Performance over –55°C to +125°C Compact Isolation Solid State Switches

53252-117

Abstract: x-gold 101 pmb7880
Contextual Info: 90V - 0.8A DUAL POWER MOSFET OPTOCOUPLERS DSCC DWG #5962-03247 53252 Features: Applications: • • • • • • • • • • • • • • 8-Pin Dual-In-Line Hermetic Package Performance over –55°C to +125°C Compact Isolation Solid State Switches

Contextual Info: 90V - 0.8A DUAL POWER MOSFET OPTOCOUPLERS DSCC DWG #5962-03247 53252 Features: Applications: • • • • • • • • • • • • • • 8-Pin Dual-In-Line Hermetic Package Performance over –55°C to +125°C Compact Isolation Solid State Switches

Contextual Info: GMM7658287CNTG-5/6 u 8,388,608WORDS x 64 BIT CMOS EDO DYNAMIC RAM MODULE Description Features * 144 pins Dual In-Line Package - GMM7658287CNTG : Gold plating * Extended Data Out EDO Mode Capability * Single Power Supply * Fast Access Time & Cycle Time ,TT .

FD3500AH

Abstract: A451 ra20
Contextual Info: 7294621 POWEREX INC TÏ 7S T4tiE l DDD17S7 b »Ä 3 Standard Rectifiers lF AV To =100° C 50% Duty Cycle, Half Sine 60 Hz (Amps) l* t for Ifsm Fusing @8.3 ms (Amps x 10*) 50 Hz 60 Hz (A2se c x 10*) Ihrm @ Vrrm and Vrrm (mA) Range (Volts) Tj(Max) Vfm @ Tj=25°C