2741A Search Results

ebonol

Abstract: 637-10ABEP WTS001 MO-169 217-36CT6 634-20ABEP 637-15ABEP 236-150ABE-01 abe sot-223 sot-223 package dimensions
Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

274-1-AB

Abstract: 274-1ab 274-2AB 240-118ABH-22 273-AB 273-AB-01 274-1AB-01 281-1AB 240-118ABS-22 2743a
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above PC Board in. mm Standard P/N Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style

Contextual Info: 2741A, FOD2741B, FOD2741C Optically Isolated Error Amplifier Features Description • Optocoupler, precision reference and error amplifier in The FOD2741 Optically Isolated Amplifier consists of the popular KA431 precision programmable shunt reference and an optocoupler. The optocoupler is a gallium arsenide GaAs light emitting diode optically coupled to a

Contextual Info: WTS001_p1-25 6/14/07 10:54 AM Page 22 Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

231-75PAB-14V

Abstract: 251-62AB 216-40CTT wakefield engineering 67 c 945 p 239 c MO-184 REF-10 Wakefield Engineering EIA-481-3 MS-013
Contextual Info: BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS D 2PAK, TO-220, SOL-20 Surface Mount Heat Sinks 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Height Above PC Board .390 in. 9.9 .390 in. (9.9) .390 in. (9.9) Package Format Bulk Tube

schematic diagram atx Power supply 500w

Abstract: pioneer PAL 012A 1000w inverter PURE SINE WAVE schematic diagram 600va numeric ups circuit diagrams winbond bios 25064 TLE 9180 infineon smsc MEC 1300 nu TBE schematic diagram inverter 2000w DK55 circuit diagram of luminous 600va UPS
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 Digital Signal Processors, iCoupler , iMEMS® and iSensor . . . . . 805, 2707, 2768-2769 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-568 RF Connectors . . . . . . . . . . . . . . . . . . . . . . Pages 454-455

6073b

Abstract: BA 658 wakefield 1371 7191B e288 Aavid 6079B 6013B LAD66A4 573202B02800 RUR67B1CB
Contextual Info: If an extruded part does not appear on this list, please contact us at 818-842-7277. If a stamped part does not appear on this list, we do not manufacture it. Aavid Part Number IERC Exact Cross IERC Approx. Cross Aavid Part Number 60055 60080 60095 60175 60255

N10015

Abstract: 218-40cte3 ebonol outline of the heat sink for JEDEC 217-36CT6 MO-169 218-40CTE5 217-36CTTE6 unc screw 230-75ABE-01
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

DD3150

Abstract: 316 bcg 563-HH-3421-BC A42 BF 331 531002b00000g to220 mica 1591-TSBK NG-9512E 131-6 wj 78 1554d
Contextual Info: ENCLOSURES AND THERMAL Plastic Enclosures Altech. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1866, 1867 Bud . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1868, 1869, 1870, 1871, 1872, 1873 Bulgin. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1874

ebonol

Abstract: 260-4TH5B ebonol c black 205cb AB-275 204-CB TUBE 1625 5 lead dd pak weight 260-6SH5B 205-CB
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

ebonol

Abstract: 217-36CT6 218-40CT3 218-40CT5 MO-169 204sb
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

CNY17F-X

Abstract: FAN4803 FOD2741A FOD2741B FOD2741C KA1H0680 KA431 2741A
Contextual Info: 2741A, FOD2741B, FOD2741C Optically Isolated Error Amplifier Features Description • Optocoupler, precision reference and error amplifier in The FOD2741 Optically Isolated Amplifier consists of the popular KA431 precision programmable shunt reference and an optocoupler. The optocoupler is a gallium arsenide GaAs light emitting diode optically coupled to a

T250AC-16-4C

Abstract: transistor c323 Payton T250AC 1N5711 SMD D304 diode 1003 smd resistor UCC25600 llc resonant dc-dc converter payton MF630V
Contextual Info: Reference Design SLUU341B–DECEMBER 2008 – REVISED – MARCH 2009 PR883: A 300-W, Universal Input, Isolated PFC Power Supply for LCD TV Applications Power Management – Power Supply Controllers 1 INTRODUCTION This guide documents a low-profile power supply that is suitable for powering LCD TVs or other flat screen

D741A

Abstract: AD3b
Contextual Info: 1 7 7 7 12324567589ABCBDE6F5856A354A3BAC636 $%&67'6 % !!6$*(76%+(*6',-+(7+(6.&66 F395536 7 FB825A36(5545A856,B/6170"""#66 -54BA6"!6 256F35/612")2"#6

FOD2741A equivalent

Abstract: phototransistor 3 pin FOD2741A FOD2741B reflow profile 245 CNY17F-X FAN4803 FOD2741C KA1H0680 KA431
Contextual Info: OPTICALLY ISOLATED ERROR AMPLIFIER 2741A FOD2741B FOD2741C DESCRIPTION The FOD2741 Optically Isolated Amplifier consists of the popular KA431 precision programmable shunt reference and an optocoupler. The optocoupler is a gallium arsenide GaAs light emitting diode optically coupled to a silicon phototransistor. It comes in 3

ebonol

Abstract: 215CB 647-25ABP 217-36CT6 230-75AB-10 MO-169 205-CB 281-2AB 204CB 1134 sot dm
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area,

220v AC voltage stabilizer schematic diagram

Abstract: LG color tv Circuit Diagram tda 9370 1000w inverter PURE SINE WAVE schematic diagram schematic diagram atx Power supply 500w TV SHARP IC TDA 9381 PS circuit diagram wireless spy camera 9744 mini mainboard v1.2 sony 279-87 transistor E 13005-2 superpro lx
Contextual Info: QUICK INDEX NEW IN THIS ISSUE! Detailed Index - See Pages 3-24 AD9272 Analog Front End, iMEMS Accelerometers & Gyroscopes . . . . . . 782, 2583 Connectors, Cable Assemblies, IC Sockets . . . . . . . . . . . 28-528 Acceleration and Pressure Sensors . . . . . . . . . . . . . . . . . . . . . . . . . . Page 2585

FOD2741A equivalent

Abstract: FOD2741B
Contextual Info: OPTICALLY ISOLATED ERROR AMPLIFIER 2741A FOD2741B FOD2741C DESCRIPTION The FOD2741 Optically Isolated Amplifier consists of the popular KA431 precision programmable shunt reference and an optocoupler. The optocoupler is a gallium arsenide GaAs light emitting diode optically coupled to a silicon phototransistor. It comes in 3

thyristor TAG 8506

Abstract: nais inverter vf 7f operation manual 922AA1Y-A4P optek A400 817 Sprague 513D sprague 926c Sprague 195P Rapa relay 12vdc triac tag 8948 Mascot 719
Contextual Info: TABLE OF CONTENTS Catalog Number 11Q New For 1989! • Over 7,900 New Products • 13 New M anufacturers PRODUCT INDICES tiamp*,'fminei forskSockets ' Solder Equipment endTtfob ] vriHp\< lint Equipment, Panel Meters, Aejulpmant, i A P R E M IE R C o m p an y

bckk

Abstract: AUD20 car Battery Charger Atmel LED Driver Battery Charger with Atmel voltage regulator 10V
Contextual Info: Features • Eight High Performance Low Dropout Voltage Regulators LDO • • • • • • • • • • • • • • • • • • • • – Three Low Dropout Voltage Regulators (LDO) for Analog, Memories and Baseband Digital I/O – Two Low Dropout Voltage Regulators (LDO) High PSRR Low Noise for Radio

Wakefield Thermal Solutions TYPE 120

Abstract: ebonol 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 TO38 Laser TO-44 204sb
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION

Contextual Info: BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 274 & 281 SERIES Material: Aluminum, Black Anodized Standard P/N 274-1AB 274-1ABE-01 274-1ABE-02 274-2AB 274-2ABE-01 274-2ABE-02 274-3AB 274-3ABE-01 274-3ABE-02 281-1AB 281-2AB Height Above PC Board in. mm .375 (9.5)

ebonol

Abstract: abe sot-223 217-36CTRE6 217-36CT6 MO-169
Contextual Info: Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS Surface Mount Heat Sinks 217 SERIES D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology SMT automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers'

ebonol

Abstract: Wakefield Thermal Solutions Wakefield Thermal Solutions TYPE 120 217-36CT6 218-40CT3 218-40CT5 MO-169 635-10B2 207AB TO38 Laser
Contextual Info: STAMPED HEAT SINKS for Low Power Devices CORPORATE HEADQUARTERS WAKEFIELD THERMAL SOLUTIONS INC. 33 Bridge Street Pelham, NH 03076 Tel: 603 635-2800 Fax: (603) 635-1900 www.wakefield.com SUBSIDIARIES: LOCKHART INDUSTRIES Paramount, CA 90723-1430 SPECIALTY EXTRUSION