26PIN Search Results
26PIN Price and Stock
ITT Interconnect Solutions INSL DPX-26 PIN FRT- Bulk (Alt: INSL DPX-26 PIN FRT) |
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INSL DPX-26 PIN FRT | Bulk | 10 Weeks | 25 |
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INSL DPX-26 PIN FRT | Bulk | 25 |
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ITT Interconnect Solutions DPX2ME-26 - PIN- Bulk (Alt: DPX2ME-26 - PIN) |
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DPX2ME-26 - PIN | Bulk | 21 Weeks | 25 |
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DPX2ME-26 - PIN | Bulk | 25 |
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ITT Interconnect Solutions INSUL DPX-26 PIN REAR- Bulk (Alt: INSUL DPX-26 PIN REAR) |
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INSUL DPX-26 PIN REAR | Bulk | 10 Weeks | 25 |
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INSUL DPX-26 PIN REAR | Bulk | 25 |
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ITT Interconnect Solutions SEAL,INTERFACIAL 26 PINKITT SEALINTERFACIAL26PINK |
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SEAL,INTERFACIAL 26 PINK |
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MACOM SW-226-PINRF Switch ICs Switch,SPDT,RF, |
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SW-226-PIN |
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SW-226-PIN | 6 | 1 |
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26PIN Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
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FC26PContextual Info: Flat Cable SPECIFICATIONS Constituent 26Pin To 26Pin Label + Flat Cable +IDC CONNECTOR+Strain Relief+LAMINATION TAPE+CABLE TIE Electrical Insulation Resistance: 5MOhm Contact Resistance: 5Ohm Operate Tempreture:-30∘C~80∘C HEAT RESISTANCE:105∘C MAX 15 SECOND |
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26pinfc26p01-0e-effc26p | |
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Contextual Info: 26PIN PLASTIC TSOP II (300 mil) 26 14 E P F detail of lead end 1 A 13 H J K G I N C D M B L M NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 17.36 MAX. |
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26pins26g3-50-7jd1 | |
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Contextual Info: 26P3D-F Plastic 26pin 300mil TSOP (LOC) EIAJ Package Code TSOPII26/24-P-300-1.27 Weight(g) JEDEC Code – Lead Material Alloy 42 e ME 8 6 13 E Recommended Mount Pad Symbol 21 26 19 14 A c L D L1 HE 1 I2 F b2 e y b A2 Detail F A A1 A2 b c D E e HE L L1 y |
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26p3d-f26pin300miltsopii26/24-p-300-1 | |
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Contextual Info: 26P0J-B Weight g Lead Material Alloy 42 e b2 14 e1 19 HE 21 E 26 e1 c D Recommended Mount Pad Symbol 1 6 13 8 L A A1 b1 e y I2 JEDEC Code – I1 EIAJ Package Code SOJ26/24-P-300-1.27 Plastic 26pin 300mil SOJ b SEATING PLANE A A1 b b1 c D E e e1 HE L y b2 |
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26p0j-bsoj26/24-p-300-126pin300mil | |
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Contextual Info: 26P3Z-F Plastic 26pin 300mil TSOP EIAJ Package Code TSOPII26/20-P-300-1.27 Weight(g) 0.32 JEDEC Code – Lead Material Alloy 42 e 13 ME 9 5 E Recommended Mount Pad Symbol 22 26 18 14 A c L D L1 HE 1 I2 F b2 e b y A2 A1 Detail F A A1 A2 b c D E e HE L L1 |
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26p3z-f26pin300miltsopii26/20-p-300-1 | |
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Contextual Info: Datasheet - Page 1 SAS connection cable AK-410105-010-S 4016032325475 SAS connection cabel, mini SAS 26pin 1.00m,CU, AWG28, 2xshielded, M/M, UL The fast and reliable cable for high-performance applications This external cable connects SAS Serial Attached SCSI devices. |
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ak-410105-010-s26pinawg2826-pin+2 | |
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Contextual Info: Flat Cable SPECIFICATIONS Constituent 26Pin To 26Pin Label + Flat Cable +IDC CONNECTOR+Strain Relief+Key Electrical Insulation Resistance: 5MOhm Contact Resistance: 5Ohm Operate Tempreture:-30∘C~80∘C HEAT RESISTANCE:105∘C MAX 15 SECOND DRAWING ORDERING I NF OR MATI ON |
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26pinfc26000-07-df | |
26-pinContextual Info: 26P3D-E Plastic 26pin 300mil TSOP (LOC) EIAJ Package Code TSOPII26/24-P-300-1.27 Weight(g) JEDEC Code – Lead Material Alloy 42 e 19 ME 21 14 E Recommended Mount Pad Symbol 1 6 8 13 A c L D L1 HE 26 I2 F b2 e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1 |
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26p3d-e26pin300miltsopii26/24-p-300-1+1 | |
hy5118160bContextual Info: «HYUNDAI HYM536220A W-Series 2M X 36-bit CMOS DRAM MODULE DESCRIPTION The HYM536220A is a 2M x 36-bit Fast page mode CMOS DRAM module consisting of four HY5118160B in 42/42 pin SOJ and eight HY531000Ain 20/26pin SOJ on a 72 pin glass-epoxy printed circuit board. 0.22nFdecoupling |
OCR Scan |
hym536220a36-bithy5118160bhy531000ain+4 | |
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Contextual Info: 26P3Z-E Plastic 26pin 300mil TSOP EIAJ Package Code TSOPII26/20-P-300-1.27 Weight(g) 0.32 JEDEC Code – Lead Material Alloy 42 e 14 E Recommended Mount Pad Symbol 1 9 5 13 A D L c L1 HE 18 ME 22 26 I2 F b2 b e A2 y Detail F A1 A A1 A2 b c D E e HE L L1 |
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26p3z-e26pin300miltsopii26/20-p-300-1 | |
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Contextual Info: 26P0D-B JEDEC Code – Weight g Lead Material Alloy 42 b2 I1 e e1 HE 14 19 21 E 26 e1 c D Recommended Mount Pad Symbol 1 8 6 13 L A A1 b1 e y I2 EIAJ Package Code SOJ26/24-P-300-1.27 Plastic 26pin 300mil SOJ(LOC) b SEATING PLANE A A1 b b1 c D E e e1 HE L |
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26p0d-bsoj26/24-p-300-126pin300mil | |
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Contextual Info: Flat Cable SPECIFICATIONS Constituent 26Pin To 26Pin Flat Cable +IDC CONNECTOR+CLARITY TAPE+ACETATE TAPE Electrical Insulation Resistance: 5MOhm Contact Resistance: 5Ohm Operate Tempreture:-30∘C~80∘C HEAT RESISTANCE:105∘C MAX 15 SECOND DRAWING ORDERING I NF OR MATI ON |
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26pinfc26000-05-df | |
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Contextual Info: Flat Cable SPECIFICATIONS Constituent 26Pin To 26Pin Flat Cable +CONNECTOR+Strain Relief Electrical Insulation Resistance: 5MOhm Contact Resistance: 5Ohm Operate Tempreture:-30∘C~80∘C HEAT RESISTANCE:105∘C MAX 15 SECOND DRAWING ORDERING I NF OR MATI ON |
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26pinfc26000-04-df | |
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Contextual Info: 26PIN PLASTIC TSOP II (300 mil) 26 14 F P E detail of lead end 1 A D M 13 M L B C G K N I J H NOTE Each lead centerline is located within 0.21 mm (0.009 inch) of its true position (T.P.) at maximum material condition. ITEM MILLIMETERS INCHES A 17.36 MAX. |
Original |
26pins26g3-50-7kd1 | |
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26P0JContextual Info: 26P0J Plastic 26pin 300mil SOJ EIAJ Package Code SOJ26/20-P-300-1.27 JEDEC Code – Weight g 0.75 Lead Material Alloy 42 e b2 c e1 HE 14 18 22 E 26 e1 I1 I2 D Recommended Mount Pad Symbol 1 9 5 13 L A A1 b1 e y b SEATING PLANE A A1 b b1 c D E e e1 HE L y |
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26p0j26pin300milsoj26/20-p-300-1 | |
44c256
Abstract: 3034C
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OCR Scan |
smj44c256sgms034cmil-std-833smj44c256-80+8 | |
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Contextual Info: TM4EP72BPB, TM4EP72BJB, 4194304 BY 72-BIT TM4EP72CPB, TM4EP72CJB 4194304 BY 72-BIT EXTENDED-DATA-OUT BUFFERED DYNAMIC RAM MODULES _ _ • • • • Long Refresh Periods: - TM4EP72CxB: 64 ms 4096 Cycles |
OCR Scan |
tm4ep72bpbtm4ep72bjb72-bittm4ep72cpb+5 | |
VREG14Contextual Info: TPD4144AK TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC TPD4144AK The TPD4144AK is a DC brush less motor driver using high voltage PWM control. It is fabricated by high voltage SOI process. It is three-shunt resistor circuit for current sensing. It contains level |
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tpd4144akhdip26-p-1332-2vreg14 | |
SPS555H
Abstract: SPS855 SPS85 L2C gps of civil technology
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sps855sps555hsps85l2c gps+1 | |
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Contextual Info: Power Management ICs for Automotive Body Control LED Drivers for Automotive Light No.11039ECT14 BD8381EFV-M ●Description BD8381EFV-M is a white LED driver with the capability of withstanding high input voltage 50V MAX . A current-mode buck-boost DC/DC controller is also integrated to achieve stable operation against voltage input and also to |
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11039ect14bd8381efv-m | |
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Contextual Info: NJW1124 Voice Switched Speakerphone circuit ! GENERAL DESCRIPTION ! PACKAGE OUTLINE The NJW1124 is a Voice Switched Speakerphone Circuit. NJW1124 includes all of functions processing a high quality hands–free speakerphone system, such as the necessary amplifiers Microphone , |
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njw1124njw1124v | |
zener n20
Abstract: PIN68010 PIN8702 CON78 CON29 PIN3401 CON61 CON62
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Original |
con78con76pin80con68+13 | |
ssd1001
Abstract: HDD spindle motor circuit SSD1002 pump motor 12v datasheet spindle motor circuit sensorless circuit SSD2003 1.5A 2A voice coil Driver "BANDGAP REFERENCE" cross bldc electric drive spindle
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Original |
ka2811cssd1001hdd spindle motor circuitssd1002+7 | |
SN74X04
Abstract: db3 c53 inta-7 THS0842 THS5651 THS5651A PCS1475CT
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Original |
ths0842slau043csn74x04sn74lvc08a+7 | |