259A Search Results

Western Electric

Abstract: vacuum tube amplifier Scans-0017377
Contextual Info: Western Electric 2 8 3 A Vacuum Tube Classification—Variable-mu, voltage-amplifier, screen-grid tetrode with indirectly heated cathode Except for the variable-mu feature, the 283A tube is similar to the 259A tube. Applications High-frequencv voltage amplifier, especially in circuits in which the amplification is varied by

mosfet 30a 200v

Abstract: MOSFET 500V 15A parallel connection of MOSFETs OM6021SC OM6022SC OM6023SC OM6024SC power audio mosfets
Contextual Info: OM6021SC OM6023SC OM6022SC OM6024SC POWER MOSFETS IN HERMETIC PACKAGE 100V Thru 500V, Up To 35 Amp, N-Channel Power MOSFETs In JEDEC TO-259AA Package FEATURES • • • • Isolated Side-Tab Hermetic Metal Package Fast Switching, Low Drive Current Ease of Paralleling For Added Power

ST23ZL48

Abstract: TV TRANSMITTER PROJECT stmicroelectronics eeprom ST23
Contextual Info: ST23ZL48 Smartcard MCU with enhanced security, crypto-processor and 48 Kbyte EEPROM Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory 259a.ai Micromodule Wafer ■ 300 Kbytes of User ROM ■

mcu st23

Abstract: ST23ZL34 TV TRANSMITTER PROJECT ST23
Contextual Info: ST23ZL34 Smartcard MCU with enhanced security, crypto-processor and 34 Kbyte EEPROM Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory 259a.ai Micromodule Wafer ■ 300 Kbytes of User ROM ■

Contextual Info: ST21Y036 Smartcard MCU with 36 Kbytes High Density EEPROM Data Brief Feature summary ST21Y036 major applications include: • Mobile communications GSM and CDMA ■ Java applications Hardware features 259a.ai ■ Enhanced 8/16-bit CPU core with 16 MBytes

HD74LV126ATELL

Abstract: HD74LV126A HD74LV126AFPEL HD74LV126ARPEL
Contextual Info: HD74LV126A Quad. Bus Buffer Gates with 3-state Outputs REJ03D0316–0300Z Previous ADE-205-259A (Z Rev.3.00 Jun. 03, 2004 Description The HD74LV126A features independent line drivers with three state outputs. Each output is disabled when the associated output enable (OE) input is low. To ensure the high impedance state during power up or power down, OE

Contextual Info: HI — O 2 EMITTER NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M -1982. 2. DIMENSIONS ARE SHOWN IN MILLIMETERS INCHES . Fig. 14 - Conforms to JED EC Outline TO-259AA BERYLLIA WARNING PER Mll-S-19500 Packages containing beryllia shall not be ground, sandblasted, machined, or have

Contextual Info: ST21Y036 Smartcard MCU with 36 Kbytes High Density EEPROM Data Brief Feature summary ST21Y036 major applications include: • Mobile communications GSM and CDMA ■ Java applications Hardware features 259a.ai ■ Enhanced 8/16-bit CPU core with 16 MBytes

GSM circuit diagram project

Abstract: st21y068
Contextual Info: ST21Y068 Smartcard MCU with 68 KBytes High Density EEPROM Data Brief Feature summary ST21Y068 major applications include: • Mobile communications GSM and CDMA ■ Java applications Hardware features 259a.ai ■ Enhanced 8/16-bit CPU core with 16 MBytes

ST33F1M

Abstract: ST33F1M NESCRYPT ST33F1M package ST33F768 MIFARE DESFire software Desfire ev1 implementation NFC Protocol ARM SecurCore SC300 iso 7816-2 ST33F896
Contextual Info: ST33F1M, ST33F1M0, ST33F896, ST33F768, ST33F640, ST33F512 Secure MCU with 32-bit ARM SC300 CPU, SWP interface, NESCRYPT cryptoprocessor and high-density Flash memory Data brief Micromodule Wafer 259a.ai DFN8 package WLCSP package CSP Software features • Secure Flash Loader

st23yr80

Abstract: iso 3309 ST23YR mcu st23 AIS-31 ST23 DSASW0037395
Contextual Info: ST23YR80 Dual contactless smartcard MCU with 80 Kbyte EEPROM, enhanced security, cryptoprocessor and optimized RF performance Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes linear addressable memory 259a.ai Micromodule

ojtb

Abstract: KM4232W
Contextual Info: 259A CMOS WINDOW RAM 256K x 32 Bit CMOS Window RAM G ENERAL DESCRIPTION The KM 4232W 259A is a 1M Byte Dual Ported DRAM array FEATURES with added features that accelerate graphic operations in a GUI • 1M Byte Fram e-Buffer on a single chip • 2.1 G Byte/Second Internal Bus :

SD-51281-012

Abstract: SD-51281-011 SD-51281 A37AD 51281-0694
Contextual Info: 10 2.45 1 9 — 5^10 I X O V 'j 'J HOUSING A ±0.2 HHHHHHHH FIT TING NAIL ( 1.35) EVEN CkT TERMINAL S E C T . G-G 13.5 12.5 15.1 51281-259A 51281-2640 12.5 11.5 1A.1 51281-2A9A 51281-2440 11.5 10.5 13.1 51281-229A 51281-2240 10.5 9.5 12.1 51281-2094 51281-2040

ST21F384

Contextual Info: ST21F384 Smartcard MCU with 384 Kbytes of high density Flash memory Data Brief Features ST21F384 major applications include: • Mobile communications GSM, 3G and CDMA ■ Java applications Hardware features 259a.ai ■ Enhanced 8/16-bit CPU core with 16 Mbytes

ID73

Contextual Info: OM6021SC OM6023SC OM6Q22SC OM6Q24SC POWER MOSFETS IN HERMETIC PACKAGE 100V Thru 500V, Up To 35 Amp, N-Channel Power MOSFETs In JEDEC TO-259AA Package FEATURES • Isolated Side-Tab Hermetic Metal Package • Fast Switching, Low Drive Current • Ease of Paralleling For Added Power

common anode 600v

Contextual Info: SHD307901P SHD307901N SHD307901D SENSITRON SEMICONDUCTOR TECHNICAL DATA DATA SHEET 4983, REV. – HERMETIC ULTRAFAST RECTIFIER DUAL - COM. CATHODE / COM. ANODE / DOUBLER DESCRIPTION: 600 VOLT, 45AMP, 90 NS HERMETIC RECTIFIER IN A TO-259AA PACKAGE. MAX RATINGS/ELECTRICAL CHARACTRISTIC ALL RATINGS ARE AT TA = 25 C UNLESS OTHERWISE SPECIFIED

ST23ZL18

Abstract: mcu st23 TV TRANSMITTER PROJECT ST23 16615
Contextual Info: ST23ZL18 Smartcard MCU with enhanced security, crypto-processor and 18 Kbyte EEPROM Data brief Features Hardware features • Enhanced 8/16-bit ST23 CPU core with 16 Mbytes of linear addressable memory 259a.ai Micromodule Wafer ■ 300 Kbytes of User ROM ■

Contextual Info: International IQ R Rectifier Government and Space Products to Part Number ByDSS v DS(on) m T f =25°C (A) T ,= I00°C C (A) Pd @ Tc - 25°C (W) Fax on Demand Number Case Outline Key Hermetic Packages HEXFET® Power MOSFETs TO-259AA N-Channel ÏRFI064 60

ST32F416

Abstract: ST32F
Contextual Info: ST32F416 Smartcard MCU with 32-bit ARM Cortex M3 CPU and 416 Kbytes high density Flash memory Data Brief Features ST32F416 major applications include: • Mobile communications GSM, 3G and CDMA ■ Java Card™ applications Hardware features 259a.ai ■

OM6021SC

Abstract: OM6022SC OM6023SC OM6021
Contextual Info: OM6021SC OM6023SC OM6022SC OM6024SC POWER MOSFETS IN HERMETIC PACKAGE 100V T hru 500V, Up To 35 Am p, N-Channel Power MOSFETs In JEDEC TO-259AA Package FEATURES • Isolated Side-Tab Hermetic Metal Package • Fast Switching, Low Drive Current • Ease of Paralleling For Added Power

ST21Y

Contextual Info: ST21Y144 Smartcard MCU with 144 Kbytes High Density EEPROM Data Brief Feature summary ST21Y144 major applications include: • Mobile communications GSM and CDMA ■ Java applications Hardware features 259a.ai ■ Enhanced 8/16-bit CPU core with 16 MBytes

ST32F512

Abstract: ST32F arm gsm java
Contextual Info: ST32F512 Smartcard MCU with 32-bit ARM Cortex M3 CPU and 512 Kbytes high density Flash memory Data Brief Features ST32F512 major applications include: • Mobile communications GSM, 3G and CDMA ■ Java Card™ applications Hardware features 259a.ai ■

KM4232W

Abstract: KM4232W259
Contextual Info: 259A C M O S W I N D O W RAM FEATURES GENERAL DESCRIPTION . 1M Byte Frame-Buffer on a single chip The KM4232W 259A . 2.1 G Byte/Second Internal Bus : is a 1M Byte Dual Ported DRAM array with added features that accelerate graphic operations in a GUI

GSM circuit diagram project

Abstract: ST21Y144
Contextual Info: ST21Y144 Smartcard MCU with 144 Kbytes High Density EEPROM Data Brief Feature summary ST21Y144 major applications include: • Mobile communications GSM and CDMA ■ Java applications Hardware features 259a.ai ■ Enhanced 8/16-bit CPU core with 16 MBytes