256-PIN PLASTIC BGA 17 X 17 Search Results

ep600i

Abstract: JEDEC MS-034-AAJ-1 BGA Package 172 EP1800 MS-034 AAF-1 192PGA pdip 24 altera AP672 EP610 epm9560 die
Contextual Info: Altera Device Package Information May 2001, ver. 9.1 Introduction Data Sheet This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

MO-83-AF

Abstract: PQFP moisture sensitive handling and packaging footprint jedec MS-026 TQFP schematic impulse sealer BGA 11x11 junction to board thermal resistance EIA standards 481 JEDEC MS-026 footprint eftec 64 EFTEC-64 footprint jedec MS-026 TQFP 128
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

vhdl code for dice game

Abstract: Video Proc 3.3V 0.07A 64-Pin PQFP ez811 GRAPHICAL LCD interfaced with psoc 5 cypress ez-usb AN2131QC CYM9239 vhdl code PN 250 code generator CY3649 cy7c63723 Keyboard and Optical mouse program CY7C9689 ethernet
Contextual Info: Product Selector Guide Communications Products Description Pins Part Number Freq. Range Mbps ICC (mA) Packages* 3.3V SONET/SDH PMD Transceiver 2.5V SiGe Low Power SONET/SDH Transceiver SONET/SDH Transceiver w/ 100K Logic 2.5 G-Link w/ 100K Logic OC-48 Packet Over SONET (POS) Framer

Contextual Info: Spartan-II 2.5V FPGA Automotive IQ Product Family: Introduction and Ordering R DS105-1 v1.0 July 17, 2002 Advance Product Specification Introduction The Spartan -II 2.5V Field-Programmable Gate Array (FPGA) Automotive IQ product family gives users high performance, abundant logic resources, and a rich feature set.

gal16v8d programming algorithm

Abstract: gal programming algorithm vantis jtag schematic 1 of 8 selector 96 L 2 GAL16V8D LATTICE 3000 SERIES cpld PALCE610H-XX ISPGDX160A GAL22V10D
Contextual Info: Lattice and Vantis Product Selector Guide February 2000 Universe of Programmable Solutions Introduction Lattice and Vantis 3.3V and 2.5V ISP CPLD Families Lattice and Vantis. The companies that gave the world ISP and took you Beyond Performance now bring you their combined

pin diagrams of basic gates

Abstract: BGA and QFP Package Nand gate Crystal Oscillator 272000 astro tool HQFP-208 MCM NAND qcm 5 sim 980 CE61
Contextual Info: To Top / Lineup / Index Product Line-up FUJITSU Semicustom Products Semicustom Products Gate arrays Sea-of-Gate CMOS Macro-embedded type cell arrays CMOS Standard cell CMOS Semicustom microcontrollers QCM series* ASTRO NT Bi-CMOS SIM/PLL SERIES Bi-CMOS SAW PLL

alphanumeric display 2 character

Abstract: SJ 1848 176-QFP SP 1848 LQFP176 256-pin Plastic BGA BGA and QFP Package
Contextual Info: Renesas Package Code Notation The overall structure of the package code is as follows. x × ×× ×××× × × — × Auxiliary appearance code 1 alphanumeric character; sequential (No general common rules; this code is used to identify lead shape and the like)

xc4000 pin

Abstract: 57B8 dsp o212 PQ304 o4413 atmel 144
Contextual Info: Features • Ultra High Performance • • • • • • • • – System Speeds to 100 MHz – Array Multipliers > 50 MHz – 10ns Flexible SRAM – Internal 3-State Capability in each Cell FreeRAM – Flexible, Single/Dual Port, Sync/Async 10 ns SRAM

I0358

Contextual Info: Features • Ultra High Performance - System Speeds to 100 MHz - Array Multipliers > 50 MHz - 10ns Flexible SRAM - Internal 3-State Capability in each Cell • FreeRAM - Flexible, Single/Dual Port, Sync/Async 10 ns SRAM - 2,048 -18,432 Bits of Distributed SRAM Independent of Logic Cells

5D-13

Abstract: 6a7 Marking cadence leapfrog O223 6b14
Contextual Info: M ACH 5 FAMI LY X FINAL COM’L:-7/10/12/15 IND:-10/12/15/20 MACH5-512/MACH5LV-512 MACH5-512/120-7/10/12/15 MACH5-512/192-7/10/12/15 MACH5LV-512/160-7/10/12/15 MACH5LV-512/256-7/10/12/15 MACH5-512/160-7/10/12/15 MACH5-512/256-7/10/12/15 MACH5LV-512/184-7/10/12/15

S70FL256P

Abstract: s25fl129p0 FL129P S70FL256 S25FL129 FL256 FL256P S70FL Marking S70 pin ZSA024
Contextual Info: S70FL256P 256-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI Serial Peripheral Interface Multi I/O Bus Data Sheet (Preliminary) S70FL256P Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information,

Intel reflow soldering profile BGA

Abstract: A5832 JEDEC bga 63 tray Intel BGA cte table epoxy substrate BGA PROFILING A4470-01 Lead Free reflow soldering profile BGA land pattern BGA 196 a5764
Contextual Info: Ball Grid Array BGA Packaging 14.1 14 Introduction The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high leadcount (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems

VR300

Abstract: VR5000 VR5000A VR5000TM
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD30500, 30500A, 30500B VR5000TM, VR5000ATM, VR5000BTM 64-BIT MICROPROCESSOR DESCRIPTION The µPD30500 VR5000 , µPD30500A (VR5000A), and µPD30500BNote (VR5000B) are a high-performance, 64bit RISC (Reduced Instruction Set Computer) type microprocessors employing the RISC architecture developed by

272-pin BGA drawing

Abstract: U11761E TAG 9044 VR3000 nec aa8 VR5000 VR5000A VR5000TM V20 NEC NEC V20
Contextual Info: DATA SHEET MOS INTEGRATED CIRCUIT µPD30500, 30500A VR5000TM, VR5000ATM 64-/32-BIT MICROPROCESSOR DESCRIPTION The µPD30500 VR5000 and µPD30500A (VR5000A) are a high-performance, 64-/32-bit RISC (Reduced Instruction Set Computer) type microprocessors employing the RISC architecture developed by MIPSTM Technologies,

TQFP 100 PACKAGE footprint

Abstract: 225-pin BGA transistor BF 998 BGA and QFP Package PQFP ALTERA 160 PLCC pin configuration 84 pin plcc ic base 2030 ic 5 pins 256-pin BGA AW 55 IC
Contextual Info: Packaging Solutions Advanced Packaging Solutions for High-Density PLDs June 1998 • package options • pin compatibility Advanced • design flexibility Packaging Solutions FineLine BGA • vertical migration • space efficiency • cost-effectiveness

MSM514221B

Abstract: MSM518221 MSM518221-25JS MSM518221-25ZS MSM518221-30ZS MSM518221-40ZS
Contextual Info: E2L0032-17-Y1 ¡ Semiconductor MSM518221 ¡ Semiconductor This version:MSM518221 Jan. 1998 Previous version: Dec. 1996 262,214-Word ¥ 8-Bit Field Memory DESCRIPTION The OKI MSM518221 is a high performance 2-Mbit, 256K ¥ 8-bit, Field Memory. It is designed for

TQ14

Abstract: ad1b A E 23 AH IC LM 384 gn cn/A/U 237 BG
Contextual Info: Features • Ultra High Performance - System Speeds to 100 MHz - Array Multipliers > 50 MHz - 10ns Flexible SRAM - Internal 3-State Capability in each Cell • Free RAM'“ - Flexible, Single/Dual Port, Sync/Async 10 ns SRAM - 2,048 -18,432 Bits of Distributed SRAM Independent of Logic Cells

strapack s-669

Abstract: Sivaron S 669 strapack d-52 strapack MIL-I-8835A CAMTEX camtex trays PQFP 176 J-Lead s-669 strapping machine PEAK TRAY bga
Contextual Info: January 1999, ver. 4 Introduction Application Note 71 Devices that use surface-mount J-lead, quad flat pack QFP , and ball-grid array (BGA)—including FineLine BGATM—packaging are now common on boards because they provide density, size, and cost benefits. However,

S70FL256

Abstract: fl129p S70FL256P FL256 s25fl129p00 S25FL129P S70FL S25FL129
Contextual Info: S70FL256P 256-Mbit CMOS 3.0 Volt Flash Memory with 104-MHz SPI Serial Peripheral Interface Multi I/O Bus Data Sheet S70FL256P Cover Sheet Notice to Readers: This document states the current technical specifications regarding the Spansion product(s) described herein. Each product described herein may be designated as Advance Information,