256-PIN BGA DRAWING Search Results

bet GP 119 diode

Abstract: ir p 813h bet 82a BA-06 d31ad
Contextual Info: PCI1251AGFN/GJG PC CARD CONTROLLER S C P S 038-A U G U S T 1998 * • • • PCI Power Management 1.0 Compliant ACP11.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

AREG D10

Abstract: 1010 817 K14
Contextual Info: PCI1251A GFN/GJG PC CARD CONTROLLER SCPS038 – AUGUST 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

PCI1251B

Contextual Info: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

AREG D10

Abstract: SCHEMATIC graphics card PCI1251A TPS2206 b12 7d diode
Contextual Info: PCI1251A GFN/GJG PC CARD CONTROLLER SCPS038 – AUGUST 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

GP 809 DIODE

Abstract: Intel 8237 dma PCI1251B TPS2206 82365SL diode gp 805 U1 LM386
Contextual Info: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

1010 817 K14

Contextual Info: PCI1251B GFN/GJG PC CARD CONTROLLER SCPS043A – OCTOBER 1998 D D D D D D D D D D D D D D D D D PCI Power Management 1.0 Compliant ACPI 1.0 Compliant Packaged in GFN 256-Pin BGA or GJG MicroStar BGA PCI Local Bus Specification Revision 2.2 Compliant 1997 PC Card Standard Compliant

C4228

Contextual Info: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.

QFP Package 80 lead

Abstract: C4002 256-QFP 256QFP
Contextual Info: 7.15mm [0.281"] A1 7.15mm [0.281"] 26X26X5 + 8X8 ARRAY 25mm 39.3mm [0.984"] [1.547"] 41.9mm [1.650"] 1mm [0.039"] Top View 41.9mm [1.650"] DETAIL A Lead coplanarity 0.005" max. 2.78mm [0.109"] 0.5mm Side View Description: BGA to QFP package converter 484 position BGA surface mount pads to 256 QFP, 0.5mm gull-wing leads. Pin assignment as per Actel requirements.

st LD33

Abstract: ld33 st LD33 LD33 data sheet LD33 V ld33 linear st st ld50 Architecture of TMS320C4X FLOATING POINT PROCESSED CLC146 ld33 ST ELECTRONIC
Contextual Info: NM6403 Digital Signal Processor 431282.001D3 Features General Description 40 MIPS, 25 ns Instruction Rate. CMOS 0,5µm Technology. 256-pin BGA Package. Low Voltage Supply, 3.0V to 3.6V. Memory Address Space - 16 Gbytes. Scalar and Vector Data Format: 32-bit Scalar Data,

CAD15-CAD8

Contextual Info: PCI1250A PC CARD CONTROLLER XCPS014 -D E C E M B E R 1997 * Peripheral Component Interconnect PCI Power Management Compliant • Supports Zoom Video With Internal Buffering • ACP11.0 Compliant • Programmable Output Select for CLKRUN • Packaged in 256-Pin BGA

ATM-18

Abstract: ATM-5 DG 7-119 ATM machine using microprocessor 0x760 GSM modem M10 icp multiplexer 24 pin SINGLE POINT load cell C3 CLASS CX28225 CX28229
Contextual Info: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-B January 2003 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 28224-14 D 256-pin, 17 mm BGA –40 °C to 85 °C

ATM-18

Abstract: CX28229-14 CX28225-14 DG 7-119 GSM modem M10 CX28224-14 CX28225 CX28229 512K16
Contextual Info: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-D March 2004 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 CX28224-14 D 256-pin, 17 mm BGA –40 °C to 85 °C

ATM-18

Abstract: IMA16 CX28224-14 CX28229-14 CX28225 CX28225-14 CX28229
Contextual Info: CX28224/5/9 Inverse Multiplexing for ATM IMA Family Data Sheet 28229-DSH-001-C August 2003 Ordering Information Model Number Manufacturing Part Number Product Revision Package Operating Temperature CX28224 CX28224-14 D 256-pin, 17 mm BGA –40 ° C to 85 ° C

AD27

Abstract: AD29 AD30 PCI1250A TPS2206 XCPS014
Contextual Info: PCI1250A PC CARD CONTROLLER XCPS014 – DECEMBER 1997 D D D D D D D D D D D D D D D D Peripheral Component Interconnect PCI Power Management Compliant ACPI 1.0 Compliant Packaged in 256-Pin BGA PCI Local Bus Specification Revision 2.1 Compliant 1995 PC Card Standard Compliant

Contextual Info: TMS320C6711 FLOATING-POINT DIGITAL SIGNAL PROCESSOR S P R S 088A - FEB R U A R Y 1999 - R EVISED MARCH 1999 GFN 256-PIN BALL GRID ARRAY BGA PACKAGE (BOTTOM VIEW) Y W V U T R P N M L K J H G F E D C VelociTI Advanced Very Long Instruction Word (VLIW) ’C6700 CPU Core

of BGA Staggered pins

Abstract: of BGA Staggered Pins package C10943X
Contextual Info: Mounting pad of plastic BGA The drawings of cavity up-type mounting pads are shown in Figure 1-13, followed by Table 1-7 which provides detailed information on these pads. Those for cavity-down type pads are provided in Figure 1-14 and Table 1-8. Figure 1-13. Mounting Pad Dimensions of Plastic BGA Cavity-Up

C10943X

Contextual Info: Mounting pad of tape BGA The drawings of tape BGA mounting pads are shown in Figure 1-15, followed by Table 1-9, which provides detailed information of these pads. Figure 1-15. Mounting Pad Dimensions of Tape BGA 352 pins 35 x 35 1.27 x 25 = 31.75 1.27 x 19 = 24.13

208 pin rqfp drawing

Abstract: 240 pin rqfp drawing BGA 144 MS-034 AAL-1 bga package weight 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information April 2002, ver. 10.2 Introduction Data Sheet This data sheet provides the following package information for all Altera devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

240 pin rqfp drawing

Abstract: BGA sumitomo 724p EP1C12 Altera pdip top mark epm7032 plcc FBGA672 192 BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information February 2003, vers. 11.0 Introduction Data Sheet This data sheet provides package information for Altera devices. It includes these sections: • ■ ■ Device & Package Cross Reference below Thermal Resistance (starting on page 9)

PQFP 176

Abstract: 240 pin rqfp drawing EP3C5E144 EP1K50-208 processor cross reference EP3C16F484 MS-034 1152 BGA 84 FBGA thermal TQFP 144 PACKAGE DIMENSION FBGA 1760
Contextual Info: Altera Device Package Information May 2007 version 14.7 Document Revision History Data Sheet Table 1 shows the revision history for this document. Table 1. Document Revision History 1 Date and Document Version May 2007 v14.7 Changes Made ● ● ● ●

transistors BC 458

Abstract: 240 pin rqfp drawing ep600i BC 458 256-pin BGA drawing EPM7032-44 transistor BC 458 tqfp 44 thermal resistance datasheet epm7064s cross reference BGA PACKAGE thermal resistance
Contextual Info: Altera Device Package Information August 1999, ver. 8 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

EP20K100E

Abstract: EP20K160E EP20K200 EP20K200E EP20K300E EP20K60E EP20K100 0245 TQFP-208 208RQFP 280-PGA
Contextual Info: Altera Device Package Information August 2000, ver. 8.03 Data Sheet 2 Introduction This data sheet provides the following package information for all Altera® devices: • ■ ■ ■ Lead materials Thermal resistance Package weights Package outlines In this data sheet, packages are listed in order of ascending pin count.

FBGA-484

Abstract: A54SX32A-CQ256 actel FG484 package mechanical drawing B22 filament base CQ256 land pattern QFP 208 SX72 A54SX32A-FG484 silicone paste p4 FG484
Contextual Info: Actel CQFP – FBGA484 Adapter Boards SI-SX32-ACQ256SFG484 and SI-SX72-ACQ256SFG484 Contents 1). Introduction 2). Appendix A – SI-SX32-ACQ256SFG484 Mechanical Drawing and Assembly instructions 3). Appendix B – SI-SX72-ACQ256SFG484 Mechanical Drawing and Assembly

35 x 35 PBGA, 580 100 balls

Abstract: Enplas drawings HG7900 BGA Ball Crack 153pin NEC stacked CSP 2000 PEAK TRAY bga BGA-35 Lead Free reflow soldering profile BGA NEC stacked CSP
Contextual Info: High Performance! Contents Contents 1. What is a BGA Ball Grid Array ? _ 3 2. Varieties of NEC's BGA _ 3 3. Advantages _ 4 4. Photographs _ 6 5. Line-up_ 8