256-PIN BGA Search Results

256-pin BGA

Abstract: 24 pin MATRIX led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01)

led matrix circuits

Abstract: 256-pin Plastic BGA BGA-256P-M02
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02)

256-pin BGA

Abstract: led matrix circuits 256-pin
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC To Top / Package Lineup / Package Index BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04)

256-pin Plastic BGA

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M01 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ

BGA-256P-M02

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M02 256-pin plastic BGA Lead pitch 50 mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)

Contextual Info: Up To 4 K Switching Matrix TDM/TSI SWITCHES VOICE/DATA Packaging M 8 40 pin PDIP, 44 pin PLCC, 44 pin QFP MT89L80 256 x 256 8 8 M 8 44 pin PLCC, 48 pin SSOP MT89L85 256 x 256 8 8 M 8 44 pin PLCC, 48 pin SSOP ZL50012 512 x 512 16 16 Per-Stream M 16 160 pin LQFP, 144 ball LBGA

c051004

Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension. 27.00±0.20(1.063±.008)SQ

Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M04 256-pin plastic T-BGA Lead pitch 1.27 mm Pin matrix 20 Sealing method Plastic mold BGA-256P-M04 256-pin plastic T-BGA (BGA-256P-M04) Note: The actual shape of corners may differ from the dimension.

C1995

Abstract: 256-PIN 256-pin Plastic BGA
Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M01 Lead pitch 50mil Pin matirx 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M01 256-pin plastic BGA (BGA-256P-M01) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004)SQ Note: The actual shape of corners may differ from the dimension.

BGA-256P-M02

Abstract: C1995 256-PIN
Contextual Info: BALL GRID ARRAY PACKAGE 256 PIN PLASTIC BGA-256P-M02 Lead pitch 50mil Pin matrix 20 Sealing method Plastic mold 256-pin plastic BGA BGA-256P-M02 256-pin plastic BGA (BGA-256P-M02) 27.00±0.20(1.06±.008)SQ 24.00±0.10(.94±.004) Note: The actual shape of corners may differ from the dimension.

Contextual Info: Product Number: 587-10-256-08-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 256-08-005 16 X 16 # Of Pins Mill-Max Part Number 256 587-10-256-08-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737

Contextual Info: Product Number: 599-10-256-08-007429 Description: BGA Header 1mm Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 256-08-007 16 X 16 # Of Pins Mill-Max Part Number 256 599-10-256-08-007429 RoHS Compliant LOOSE PIN: Loose Pin Used: 9929

Contextual Info: Product Number: 587-10-256-10-005437 Description: BGA Header .050 Grid; BGA Header Plating Code: 10 Shell Plating: 10 µ" Gold over 100 µ" Nickel 256-10-005 20 X 20 # Of Pins Mill-Max Part Number 256 587-10-256-10-005437 RoHS Compliant LOOSE PIN: Loose Pin Used: 8737

EPF6024A

Contextual Info: EPF6024A Device Pin-Outs ver. 1.0 Pin Name 1 144-Pin TQFP EPF6024A 208-Pin PQFP EPF6024A 240-Pin PQFP EPF6024A 256-Pin BGA EPF6024A 256-Pin FineLine BGA EPF6024A MSEL (2) 33 46 52 T3 L5 nSTATUS (2) 56 80 92 W11 K8 nCONFIG (2) 53 77 89 Y11 N8 DCLK (2) 128

XCR3256xl 144

Abstract: Xilinx XCR3256XL FT256
Contextual Info: R DS013 v1.7 April 11, 2001 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • Lowest power 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,400 usable gates

L16 eeprom

Abstract: FT256 PQ208 TQ144 XCR3256XL CS280 DS012 DS013
Contextual Info: R DS013 v1.8 April 19, 2001 XCR3256XL 256 Macrocell CPLD 14 Preliminary Product Specification Features Description • Lowest power 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,400 usable gates

XCR3256XL-10TQ144I

Abstract: XCR3256 XCR3256XL-10TQ144C FT256 PQ208 TQ144 XCR3256XL XCR3256XL-7PQ208C XCR3256XL-7TQ144C CS280
Contextual Info: R XCR3256XL 256 Macrocell CPLD DS013 v2.3 August 21, 2003 14 Preliminary Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 154 MHz • 256 macrocells with 6,000 usable gates

CS280

Abstract: DS012 DS013 FT256 PQ208 TQ144 XCR3256XL XCR3256XL-7PQ208C XCR3256XL-7TQ144C U6-15
Contextual Info: R XCR3256XL 256 Macrocell CPLD DS013 v2.1 January 27, 2003 14 Preliminary Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 154 MHz • 256 macrocells with 6,000 usable gates

Contextual Info: R XCR3256XL 256 Macrocell CPLD DS013 v2.2 July 15, 2003 14 Preliminary Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 154 MHz • 256 macrocells with 6,000 usable gates

CS280

Abstract: DS012 DS013 FT256 PQ208 TQ144 XCR3256XL D1127 D1554
Contextual Info: R XCR3256XL 256 Macrocell CPLD DS013 v1.9 January 8, 2002 14 Preliminary Product Specification Features Description • Lowest power 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays • System frequencies up to 140 MHz • 256 macrocells with 6,000 usable gates

XCR3256XL-10TQ144I

Contextual Info: R XCR3256XL 256 Macrocell CPLD DS013 v2.6 April 8, 2005 14 Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.0 ns pin-to-pin logic delays The CoolRunner XPLA3 XCR3256XL device is a 3.3V, 256 macrocell CPLD targeted at power sensitive designs

XCR3256XL

Abstract: XCR3256XL-10TQ144I XCR3256XL-7TQG144C XCR3256XL-12TQG144I XCR3256XL-10CS280C XCR3256XL-12PQ208I XCR3256XL-10TQG144C marking w13 XCR3256XL-12PQG208I XCR3256XL10TQG144C
Contextual Info: R XCR3256XL 256 Macrocell CPLD DS013 v2.7 March 31, 2006 14 Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.0 ns pin-to-pin logic delays The CoolRunner XPLA3 XCR3256XL device is a 3.3V, 256 macrocell CPLD targeted at power sensitive designs

256-pin Plastic BGA

Abstract: BGA-256P-M21
Contextual Info: BALL GRID ARRAY PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 256 PIN PLASTIC BGA-256P-M21 256-pin plastic BGA Ball pitch 1.27 mm Package width x package length 27.00 × 27.00 mm Sealing method Plastic mold Mounting height 2.53 mm MAX Weight Approx. 2.7 g BGA-256P-M21

XCR3256XL-10TQ144I

Abstract: CS280 DS012 DS013 FT256 PQ208 TQ144 XCR3256XL XCR3256XL-7PQ208C XCR3256XL-7TQ144C
Contextual Info: R XCR3256XL 256 Macrocell CPLD DS013 v2.5 February 13, 2004 14 Product Specification Features Description • Low power 3.3V 256 macrocell CPLD • 7.5 ns pin-to-pin logic delays The XCR3256XL is a 3.3V, 256 macrocell CPLD targeted at power sensitive designs that require leading edge programmable logic solutions. A total of 16 function blocks provide