2508H Search Results

BMS-2508H

Abstract: M200
Contextual Info: BMS-2508H DB LECTRQ Inc. Type Rated Im pedance O Rated(Max.) Power{W) Resonant Frequency(Hz) Rated Freq.Range(Hz) Sound Pressure Level(dB) Magnet(g) Operating TemperaturefC) BMS-2508H 8±15% 0.1 (0.2) 1000±20% M 200 75 ±3 1.7 -40-+85 O E M p in o r e x te n te d w ire w ith c o n n e c to r

K8P2815UQB

Contextual Info: K8P2815UQB FLASH MEMORY 128Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

samsung ba92

Abstract: BA137 k8p3215
Contextual Info: K8P6415UQB FLASH MEMORY 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

F300H

Abstract: FC44H BIT137
Contextual Info: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

USB cable AWM 2725 rx tx pinout

Contextual Info: CP3BT26 CP3BT26 Reprogrammable Connectivity Processor with Bluetooth, USB, and CAN Interfaces Literature Number: SNOSAE5C CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded

F1A4

Abstract: TR-28 national timer switch tb 208
Contextual Info: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

K8P3215UQB

Abstract: K8P2815 K8p3215 K8P3215U k8p2815u K8P32 48FBGA samsung nor flash Samsung MCP K8P6415
Contextual Info: K8P3215UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

K8P6415UQB

Abstract: K8P2815 BA141 K8P6415U K8p3215 K8P6415 K8P32 k8p2815u K8P3215U K8P64
Contextual Info: K8P6415UQB FLASH MEMORY 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

Contextual Info: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

CP3BT23

Abstract: CP3BT23G18NEP CP3BT23G18NEPNOPB CR16C LMX5251 LMX5252 LQFP-144 315 receiver module
Contextual Info: MAY 2004 CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

4 wire resistive touch screen

Abstract: deutsch dmc CP3UB26 CP3UB26G18NEP CP3UB26G18NEPNOPB CP3UB26G18NEPX CP3UB26G18NEPXNOPB CR16C LQFP-144
Contextual Info: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

EE CORE 70

Abstract: books national semiconductor
Contextual Info: CP3UB26 CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces Literature Number: SNOSAE7D CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

Contextual Info: CP3UB26 www.ti.com SNOSAE7E – APRIL 2005 – REVISED JANUARY 2014 CP3UB26 Reprogrammable Connectivity Processor with USB Interface 1 GENERAL DESCRIPTION The CP3UB26 connectivity processor combines high performance with the massive integration needed for

SLE 78

Abstract: USB cable AWM 2725 rx tx pinout CP3BT26 CP3BT26G18AWM CP3BT26G18AWMX CR16C DS202 LMX5251 LMX5252 LQFP-144
Contextual Info: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

Contextual Info: CP3BT23 www.ti.com SNOSCX3A – JULY 2013 – REVISED JANUARY 2014 CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces Check for Samples: CP3BT23 1 Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for

K8P6415

Abstract: K8P32 K8P3215u K8P6415UQB K8P64
Contextual Info: Target Information FLASH MEMORY K8P6415UQB 64Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

SLE 78

Abstract: CR16C LMX5251 national timer switch tb 179 CP3BT26 CP3BT26G18NEP CP3BT26G18NEPNOPB DS202 LMX5252 LQFP-144
Contextual Info: CP3BT26 Reprogrammable Connectivity Processor with Bluetooth , USB, and CAN Interfaces 1.0 General Description The CP3BT26 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

ERTEC200

Abstract: ertec Sapling Master Clock IEC-93 Firmware ssd 2310h HX1188 uPD800261F1-523-HN2 Sapling Master Clock 2000 Series PL021
Contextual Info: Preliminary User’s Manual ERTEC 200 Enhanced Real-Time Ethernet Controller 32-Bit RISC CPU Core Hardware µPD800261F1-523-HN2 Document No. A17988EE1V1UM00 Date Published August 2007 NEC Electronics Corporation 2007 Printed in Germany NOTES FOR CMOS DEVICES

ERTEC400

Abstract: A17812EE1V1UM00 264ch l PL021 nec PC 2500H ertec manual* cygnus sl 5000 ARM946E-S 2310h ahb pci bridge fujitsu
Contextual Info: Preliminary User’s Manual ERTEC 400 Enhanced Real-Time Ethernet Controller 32-Bit RISC CPU Core Hardware µPD800232F1-012-HN2 Document No. A17812EE1V1UM00 Date Published July 2007 NEC Electronics Corporation 2007 Printed in Germany NOTES FOR CMOS DEVICES

K8P1615UQB

Abstract: K8P2815 K8P1615U K8P6415U K8P3215U 555H k8p2815u samsung nor flash Samsung MCP 256-w
Contextual Info: K8P1615UQB FLASH MEMORY 16Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,

Contextual Info: CP3BT23 Reprogrammable Connectivity Processor with Bluetooth and Dual CAN Interfaces 1.0 General Description The CP3BT23 connectivity processor combines high performance with the massive integration needed for embedded Bluetooth applications. A powerful RISC core with on-chip

AEH 5PIN

Abstract: atdr1 DS021 IR CP3UB26 CR16C LQFP-144 CVSD pcm EE CORE 70
Contextual Info: CP3UB26 Reprogrammable Connectivity Processor with USB and CAN Interfaces 1.0 General Description The CP3UB26 connectivity processor combines high performance with the massive integration needed for embedded applications. A powerful RISC core with on-chip SRAM

Contextual Info: H ousing Wafer Terminal 2.5mm Terminal / Housing 5.75 1.35 0.80 0.20 1.25 1.66 0.40 2.90 1.05 1.60 2.60 2.10 1.74 0.80 SEC:A-A 1.50 Wire Range AWG#22-#30 Insulation O.D. 1.90mm max SEC:B-B Material Phosphor Bronze Part No.:2505-T-L Finish Tin Plated Specifications

MAX9060

Contextual Info: K8P3315UQB FLASH MEMORY 32Mb B-die Page NOR Specification INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,