24JUNE2005 Search Results

PSRAM

Abstract: RAM 2112 256 word J-STD-020B M30L0R8000B0 M30L0R8000T0 M36L0R8060B1 M36L0R8060T1 M69KB096AA
Contextual Info: M36L0R8060T1 M36L0R8060B1 256 Mbit Multiple Bank, Multi-Level, Burst Flash Memory and 64 Mbit (Burst) PSRAM, 1.8V Supply, Multi-Chip Package FEATURES SUMMARY MULTI-CHIP PACKAGE – 1 die of 256 Mbit (16Mb x16, Multiple Bank, Multi-level, Burst) Flash Memory

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - 6 4 5 3 2 RELEASED FOR PUBLICATION ALL RIGHTS RESERVED. By - LOC DIST GP 00 REVISIONS LTR F1 120° 1 REF A A HMR SM 22JUL1 E C O - 1 1-01 1 461 APVD BLACK D THE RETENTION TABS PROVIDE A ONE-TIME INTEREERENCE FIT IN THE .078 DIAMETER BOARD HOLE FOR HEADER

T-300

Contextual Info: 3 4 THIS DRAWING IS UNPUBLISHED. COPYRIGHT RELEASED FOR PUBLICATION BY TYCO ELECTRONICS CORPORATION. - 2 - LOC ALL RIGHTS RESERVED. REVISIONS DIST CM 00 LTR DESCRIPTION C MATERIAL: CL n REVISED PER E C Q - 0 7 - 0 0 3 7 5 7 DATE DWN APVD 01M AR 07 KW DB

217F

Abstract: rec2.2-2412srw
Contextual Info: Features Regulated Converters ● ● ● ● ● ● ● ● ● ECONOLINE 2.2W DIP Package 1kVDC Isolation Regulated Output Wide Input Range 2 : 1 and 4 : 1 UL94V-0 Package Material Continuous Short Circuit Protection Cost Effective 100% Burned In Efficiency to 84%

Contextual Info: 7 THIS DRAWING IS UNPUBLISHED. COPYRIGHT - By - 6 5 4 3 2 RELEASED FOR PUBLICATION LOC ALL RIGHTS RESERVED. REVISIONS DIST GP 00 LTR F1 DESCRIPTION REVISED PER DATE MATERIAL: HEADER - POLYESTER UL94V-0 BLACK POST - COPPER ALLOY. ZÊ\ SOLDER SIDE OF P.O. BOARD SHOWN.