23Z116SM
Abstract: PE-64974-001 PE-65737 23Z110SM 23Z111SM 23Z112SM 23Z126SM 23Z133SM 23Z354SM PE-65736
Contextual Info: TOKEN RING ISOLATION TRANSFORMERS Designed for 4 and 16 Mbps Applications Dual low-profile surface mount packages Low cost front-end solution Ideal for concentrator and adapter card applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C
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TI380C30
Abstract: TI380C60 TI380FPA P802 TI380 TI380C25 valor magnetics tokenring
Contextual Info: TEXAS INSTRUMENTS Semiconductor Group TI380C30 Physical Layer Interface Design Guidelines of the Integrated Token-Ring COMMProcessor Application Design Note Revision A March 9, 1995 Questions may be directed to: TI380 TECHNICAL SUPPORT LINE ti380hot@micro.ti.com
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PE-63838-001
Abstract: 23Z110SM 23Z111SM 23Z112SM 23Z116SM 23Z126SM 23Z133SM 23Z354SM PE-65736 PE-65737
Contextual Info: TOKEN RING ISOLATION TRANSFORMERS Designed for 4 and 16 Mbps Applications Dual low-profile surface mount packages Low cost front-end solution Ideal for concentrator and adapter card applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C
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23Z116SM
Contextual Info: TOKEN RING ISOLATION TRANSFORMERS Designed for 4 and 16 Mbps Applications Dual low-profile surface mount packages Low cost front-end solution Ideal for concentrator and adapter card applications Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C
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1N4004
Abstract: 23Z87 TI380C25 TI380C27 TI380C60 TMS38054 UPS schematics TI380C60A
Contextual Info: TI380C60 CMOS TokenĆRing Physical Layer Device Application Report 1995 Networking Products Group TI380C60 CMOS Token-Ring Physical Layer Device Application Report Stephen J. Hubbins Networking Products Group Printed on Recycled Paper IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any
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63838-001
Abstract: PE-67537 pe-63838-001 fil-mag 23z110 23Z110 23Z111 23Z112 23Z806 23Z807 PE-64974-001
Contextual Info: TOKEN RING THROUGH HOLE ISOLATION TRANSFORMERS Designed for 4 and 16 Mbps Applications IEEE 802.5 compatible Single and dual low profile packages Proven reliable designs Recommended by Texas Instruments since 1984 Electrical Specifications @ 25°C — Operating Temperature 0°C to 70°C
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filmag
Abstract: PIN assignments of UTP cables pinout db9 rj45 HC49 TI380C25 TI380C30 TI380C60 TI380FPA TMS38054
Contextual Info: TI380C30 Physical Layer Interface Design Guidelines of the Integrated TokenĆRing Commprocessor Application Report 1998 Networking Products Group Printed in U.S.A. 0898 SPWA005A TI380C30 Physical Layer Interface Design Guidelines of the Integrated Token-Ring Commprocessor
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Ferrite Bead TDK
Abstract: filmag 1N4004 23Z87 TI380C25 TI380C27 TI380C60 TMS38054 UPS schematics SC30-3383-2
Contextual Info: TI380C60 CMOS TokenĆRing Physical Layer Device Application Report 1995 Networking Products Group Printed in U.S.A., November 1995 SPWA004 TI380C60 CMOS Token-Ring Physical Layer Device Application Report Stephen J. Hubbins Networking Products Group SPWA004
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